Abstract: A novel method and interface are provided to generalize power delivery (PD) solutions and allow OEMs and suppliers to easily replace PD solutions using the same design and layout without having to re-spin the motherboard. This is achieved by defining a new interface and ball-out which support dual port PD solution that meet the system requirements. The embodiments employ an interposer to unify different PD solutions. The interposer is part of a unique Land Grid Array (LGA) soldered down solution with pre-defined interface employing a generic pinout to support PD solutions for dual type-C ports from different vendors. The interposer includes an LGA having a pattern of pads that is coupled to a LGA on a platform PCB with a matching pattern.