Patents by Inventor Orion Starr

Orion Starr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip interconnection
    Patent number: 7736950
    Abstract: Methods for forming flip chip interconnection, in which the bump interconnect is defined at least in part by an underfill. The underfill includes a material that is thermally cured; that is, raising the temperature of the underfill material can result in progressive curing of the underfill through stages including a gel stage and a fully cured stage. According to the invention, during at least an early stage in the process the semiconductor chip is carried by a thermode, which is employed to control the temperature of the assembly in a specified way. Also, flip chip interconnections and flip chip packages made according to the methods of invention.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: June 15, 2010
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Rajendra D. Pendse, Marcos Karnezos, Kyung-Moon Kim, Koo Hong Lee, Moon Hee Lee, Orion Starr
  • Flip chip interconnection
    Publication number: 20090045507
    Abstract: Methods for forming flip chip interconnection, in which the bump interconnect is defined at least in part by an underfill. The underfill includes a material that is thermally cured; that is, raising the temperature of the underfill material can result in progressive curing of the underfill through stages including a gel stage and a fully cured stage. According to the invention, during at least an early stage in the process the semiconductor chip is carried by a thermode, which is employed to control the temperature of the assembly in a specified way. Also, flip chip interconnections and flip chip packages made according to the methods of invention.
    Type: Application
    Filed: May 15, 2006
    Publication date: February 19, 2009
    Applicant: STATS ChipPAC Ltd.
    Inventors: Rajendra D. Pendse, Marcos Karnezos, Kyung-Moon Kim, Koo Hong Lee, Moon Hee Lee, Orion Starr