Patents by Inventor Orlando Luis Valentin
Orlando Luis Valentin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8926760Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.Type: GrantFiled: February 19, 2010Date of Patent: January 6, 2015Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Erich Christoph Mueller, Orlando Luis Valentin, Tao Xu
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Patent number: 8651354Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.Type: GrantFiled: July 18, 2011Date of Patent: February 18, 2014Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20130112735Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.Type: ApplicationFiled: July 18, 2011Publication date: May 9, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8308050Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: GrantFiled: July 2, 2012Date of Patent: November 13, 2012Assignee: Orthodyne Electronics CorporaitionInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8251274Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: GrantFiled: April 19, 2012Date of Patent: August 28, 2012Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20120205028Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: ApplicationFiled: April 19, 2012Publication date: August 16, 2012Applicant: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8231044Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: GrantFiled: October 3, 2011Date of Patent: July 31, 2012Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8196798Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: GrantFiled: October 10, 2011Date of Patent: June 12, 2012Assignee: Kulicke and Soffa Industries, Inc.Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20120085812Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: ApplicationFiled: October 10, 2011Publication date: April 12, 2012Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20110308545Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.Type: ApplicationFiled: February 19, 2010Publication date: December 22, 2011Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Erich Christoph Mueller, Orlando Luis Valentin, Tao Xu