Patents by Inventor ORMET CIRCUITS, INC.

ORMET CIRCUITS, INC. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE FILM ADHESIVE
    Publication number: 20140120356
    Abstract: An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 1, 2014
    Applicant: ORMET CIRCUITS, INC.
    Inventor: ORMET CIRCUITS, INC.