Abstract: A fabric treating appliance having an agitator assembly comprising a base including at least one vane, and a tower extending upwardly from the base and terminating in an upper end having a recess. The agitator includes a cap having a top and a bottom that is removably mounted to the tower. A scrub brush is carried by the cap.

Abstract: A fabric treating appliance having an agitator assembly comprising a base and a tower extending upwardly from the base and terminating in an upper portion with an opening. A centrifugally actuated dispensing cup located within the upper portion and fluidly coupled to the opening. The agitator includes a scrub brush that can be mounted to the upper portion.

Abstract: A fabric treating appliance having an agitator assembly comprising a base including at least one vane, and a tower extending upwardly from the base and terminating in an upper end having a recess. The agitator includes a cap having a top and a bottom that is removably mounted to the tower. A scrub brush is carried by the cap.

Abstract: A fabric treating appliance having an agitator assembly comprising a base and a tower extending upwardly from the base and terminating in an upper portion with an opening. A centrifugally actuated dispensing cup located within the upper portion and fluidly coupled to the opening. The agitator includes a scrub brush that can be mounted to the upper portion.

Abstract: A test apparatus for determining layer-to-layer misregistration of a multiple layer printed circuit board having an electrical test pattern formed on an inner layer and an electrical test reference formed on an outer layer with the reference electrically connected to the pattern. The apparatus includes a holder for the board, an electrical input device that moves into and out of connection with the reference when the board is in the holder, with the input device adapted to provide a signal to the reference, and an electrical output probe configured to move into and out of electrical connection with the pattern when the board is in the holder. The output probe is adapted to receive at least one signal from the pattern when a signal is provided to the reference, such that the signal received by the output probe conveys layer-to-layer misregistration between the inner layer and the outer layer.

Abstract: A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the testing. A method of manufacturing a multiple layer board that is configured to facilitate non-destructive testing of layer-to-layer misregistration includes forming an electrical test pattern on a first layer and forming a corresponding electrical test reference on a second layer. Then, a connecting pathway is formed between the test reference and the test pattern, including the first and second layers, with testing for an electrical signal between the test reference and the test pattern determining layer-to-layer misregistration of the first layer with respect to the second layer.

Abstract: A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the testing. A method of manufacturing a multiple layer board that is configured to facilitate non-destructive testing of layer-to-layer misregistration includes forming an electrical test pattern on a first layer and forming a corresponding electrical test reference on a second layer. Then, a connecting pathway is formed between the test reference and the test pattern, including the first and second layers, with testing for an electrical signal between the test reference and the test pattern determining layer-to-layer misregistration of the first layer with respect to the second layer.