Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

Abstract: A system and method for depositing an aerosolized powder of solid particles on a substrate for printed circuit applications is disclosed and comprises cold spraying the aerosolized powder onto the substrate to form a finite feature, wherein at least one of the dimensions of length and width of the finite feature measures 500 microns or less.

Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

Abstract: A photoemissive ion mobility spectrometer is disclosed for of chlorinated hydrocarbons and nitro-organic materials. Backside illumination of a thin gold film by pulsed laser radiation, pulsed ultraviolet xenon flashlamp, or like UV source, is used to produce bursts of low energy photo-emitted electrons. These swarms of thermalized electrons are directly attached by electronegative analytes or by reactant molecules, followed by charge transfer to the more electronegative analyte. Total internal reflection is incorporated for the backside illumination using optical elements such as a fused silica prism. The spectrometer allows for the direct vaporization of adsorbed explosive molecules from surfaces followed by direct injection into the photoemissive ion mobility spectrometer through a heated inlet.