Patents by Inventor Orville Washington Brown

Orville Washington Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free and cadmium-free conductive copper thick film pastes
    Patent number: 7176152
    Abstract: Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: February 13, 2007
    Assignee: Ferro Corporation
    Inventors: Orville Washington Brown, Srinivasan Sridharan