Patents by Inventor Osami Nakagawa

Osami Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method for semiconductor device
    Patent number: 5166099
    Abstract: A manufacturing method for a semiconductor device in which an electrode of a semiconductor chip is electrically connected to an inner lead of a carrier tape. The electrodes of the semiconductor chip are brought into contact with the inner lead of the carrier tape. Bonding is performed with inner lead droop controlled to no more than 80 .mu.m.
    Type: Grant
    Filed: September 13, 1991
    Date of Patent: November 24, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tetsuya Ueda, Osami Nakagawa, Haruo Shimamoto, Yasuhiro Teraoka, Seiji Takemura