Patents by Inventor Osamu Adachi

Osamu Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8911029
    Abstract: In an electric braking device that produces brake fluid pressure by driving a second slave piston in the axial direction with the driving force by a motor, a driving force transmission mechanism for transferring the driving force by the motor includes a nut that rotates upon reception of the rotational driving force by the motor, and a ball screw shaft which is engaged with the nut and is movable in the axial direction and which abuts the second slave piston. The electric braking device further includes a worn-out reducer for reducing the worn-out of a contact part between the ball screw shaft and the second slave piston.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: December 16, 2014
    Assignees: Honda Motor Co., Ltd., Nissin Kogyo Co., Ltd.
    Inventors: Takaaki Ohnishi, Kunimichi Hatano, Arata Inoue, Hideo Miyabayashi, Osamu Adachi
  • Publication number: 20120248862
    Abstract: In an electric braking device that produces brake fluid pressure by driving a second slave piston in the axial direction with the driving force by a motor, a driving force transmission mechanism for transferring the driving force by the motor includes a nut that rotates upon reception of the rotational driving force by the motor, and a ball screw shaft which is engaged with the nut and is movable in the axial direction and which abuts the second slave piston. The electric braking device further includes a worn-out reducer for reducing the worn-out of a contact part between the ball screw shaft and the second slave piston.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Applicants: NISSIN KOGYO CO., LTD., HONDA MOTOR CO., LTD.
    Inventors: Takaaki OHNISHI, Kunimichi HATANO, Arata INOUE, Hideo MIYABAYASHI, Osamu ADACHI
  • Patent number: 7942247
    Abstract: In a vehicle disk brake, a motor housing houses in a housing recess a case into which an end of an output shaft liquid-tightly protrudes, and is mounted to a caliper body. A reduction mechanism having an output rotating member is sealed in the case while part of the output rotating member fluid-tightly protrudes from the case so as to be coaxially and operatively connected to a rear portion of the screw shaft. Grease is charged into the case. Thus, the case for housing the reduction mechanism is simply configured while preventing leakage of the grease charged into the case, and mounting of the case to the caliper body is facilitated.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: May 17, 2011
    Assignees: Honda Motor Co., Ltd., Nissin Kogyo Co., Ltd.
    Inventors: Osamu Adachi, Akihiko Koike
  • Patent number: 7779971
    Abstract: A speed reducer 32 has an eccentric rotating member 56 which rotates along with a motor shaft 55 of an electric motor 11, an outer gear 57 which is rotatably supported by the outer circumference of the eccentric rotating member 56, an inner gear 58 which is fixedly disposed so as to be coaxial with the motor shaft 55 so as to engage with the outer gear 57, an output member 59 which is connected to an input member 37 of the motion converting mechanism 22 disposed so as to be coaxial with the motor shaft 55 so as to be not relatively rotatable about the input member 37, and an Oldham mechanism 60 which is disposed between the outer gear 57 and the output member 59 so as to transmit only a rotational component of the outer gear 57.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: August 24, 2010
    Assignee: Nissin Kogyo Co., Ltd.
    Inventor: Osamu Adachi
  • Publication number: 20070209888
    Abstract: A speed reducer 32 has an eccentric rotating member 56 which rotates along with a motor shaft 55 of an electric motor 11, an outer gear 57 which is rotatably supported by the outer circumference of the eccentric rotating member 56, an inner gear 58 which is fixedly disposed so as to be coaxial with the motor shaft 55 so as to engage with the outer gear 57, an output member 59 which is connected to an input member 37 of the motion converting mechanism 22 disposed so as to be coaxial with the motor shaft 55 so as to be not relatively rotatable about the input member 37, and an Oldham mechanism 60 which is disposed between the outer gear 57 and the output member 59 so as to transmit only a rotational component of the outer gear 57.
    Type: Application
    Filed: March 9, 2007
    Publication date: September 13, 2007
    Applicant: NISSIN KOGYO CO., LTD.
    Inventor: Osamu ADACHI
  • Publication number: 20070029143
    Abstract: In a vehicle disk brake, a motor housing houses in a housing recess a case into which an end of an output shaft liquid-tightly protrudes, and is mounted to a caliper body. A reduction mechanism having an output rotating member is sealed in the case while part of the output rotating member fluid-tightly protrudes from the case so as to be coaxially and operatively connected to a rear portion of the screw shaft. Grease is charged into the case. Thus, the case for housing the reduction mechanism is simply configured while preventing leakage of the grease charged into the case, and mounting of the case to the caliper body is facilitated.
    Type: Application
    Filed: July 28, 2006
    Publication date: February 8, 2007
    Applicants: Nissin Kogyo Co., Ltd., Honda Motor Co., Ltd.
    Inventors: Osamu Adachi, Akihiko Koike
  • Patent number: 7026192
    Abstract: A terminal land frame includes a frame body and a plurality of lands. Each of these lands is formed out of the frame body to be connected to the frame body via a thinned portion and protrude therefrom. When the lands are pressed in a direction in which the lands protrude from the frame body, the thinned portions are fractured and the lands are easily separable from the frame body. A semiconductor chip is mounted on some of the lands of the terminal land frame, and the chip, wires, etc. are single-side-molded with a resin encapsulant. Thereafter, when the lands are pressed on the bottom, the lands are separated from the frame body. As a result, a structure, in which the lower part of each of these lands protrudes downward from the lower surface of the resin encapsulant, is obtained, and protruding portion is used as an external electrode.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: April 11, 2006
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Masanori Minamio, Osamu Adachi, Toru Nomura
  • Patent number: 6861734
    Abstract: In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: March 1, 2005
    Assignee: Matsushita Elecrtric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Osamu Adachi
  • Patent number: 6667541
    Abstract: A terminal land frame includes a frame body and a plurality of lands. Each of these lands is formed out of the frame body to be connected to the frame body via a thinned portion and protrude therefrom. When the lands are pressed in a direction in which the lands protrude from the frame body, the thinned portions are fractured and the lands are easily separable from the frame body. A semiconductor chip is mounted on some of the lands of the terminal land frame, and the chip, wires and so on, are single-side-molded with a resin encapsulant. Thereafter, when the lands are pressed on the bottom, the lands are separated from the frame body. As a result, a structure, in which the lower part of each of these lands protrudes downward from the lower surface of the resin encapsulant, is obtained, and that protruding portion is used as an external electrode. In this manner, a downsized and thinned resin-molded semiconductor device is provided at a lower cost and with higher reliability.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: December 23, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Osamu Adachi, Toru Nomura
  • Patent number: 6642609
    Abstract: In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: November 4, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Osamu Adachi
  • Patent number: 6638790
    Abstract: In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: October 28, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Osamu Adachi
  • Publication number: 20030178708
    Abstract: In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 25, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Masanori Minamio, Osamu Adachi
  • Patent number: 6542090
    Abstract: A character input apparatus and method which can give a plurality of different character input mean a capability of complementing each other.
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: April 1, 2003
    Assignee: Microsoft Corporation
    Inventors: Masayoshi Tadano, Osamu Adachi, Fujimura Takeshi, Toshiaki Kikka
  • Publication number: 20020160552
    Abstract: A terminal land frame includes a frame body and a plurality of lands. Each of these lands is formed out of the frame body to be connected to the frame body via a thinned portion and protrude therefrom. When the lands are pressed in a direction in which the lands protrude from the frame body, the thinned portions are fractured and the lands are easily separable from the frame body. A semiconductor chip is mounted on some of the lands of the terminal land frame, and the chip, wires and so on, are single-side-molded with a resin encapsulant. Thereafter, when the lands are pressed on the bottom, the lands are separated from the frame body. As a result, a structure, in which the lower part of each of these lands protrudes downward from the lower surface of the resin encapsulant, is obtained, and that protruding portion is used as an external electrode. In this manner, a downsized and thinned resin-molded semiconductor device is provided at a lower cost and with higher reliability.
    Type: Application
    Filed: June 10, 2002
    Publication date: October 31, 2002
    Applicant: Matsushita Electronics Corporation
    Inventors: Masanori Minamio, Osamu Adachi, Toru Nomura
  • Patent number: 6376979
    Abstract: The present invention relates to a color cathode ray tube that reduces a leakage electric field and a maximum instantaneous current generated in a bulb at the time of electric discharge and provides a stable connection of conductive layers with different specific resistance. A first conductive layer is formed on the entire area of an inner wall of a funnel including a contact portion of a first spring supported by a shadow mask structure, an anode button and a contact portion of a second spring supported by a final electrode of an electron gun. A second conductive layer with a specific resistance lower than that of the first conductive layer is formed on the surface of the first conductive layer within the range extending from the anode button to the contact portion of the first spring.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: April 23, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Itsuro Komori, Osamu Adachi, Yasunori Miura, Toshiaki Katano
  • Publication number: 20020031869
    Abstract: In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.
    Type: Application
    Filed: November 6, 2001
    Publication date: March 14, 2002
    Inventors: Masanori Minamio, Osamu Adachi
  • Patent number: 5822130
    Abstract: Light radiated from a light source is gathered by an oval mirror. The gathered light is incident on one end of a rod-shaped optical integrator, integrated and made uniform within the optical integrator, and is radiated from the other end of the optical integrator. The light from the optical integrator is diffused and projected on an exposure area of a display tube by a lens system. The lens system presents an astigmatism, thereby forming a first virtual focus and a second virtual focus on its virtual image area. The diffused light is apparently diffused vertically at the first virtual focus and apparently diffused horizontally at the second virtual focus. The first vertical focus and the second vertical focus correspond respectively in position to the positions of the vertical deflection means and horizontal deflection means of the display tube.
    Type: Grant
    Filed: March 8, 1996
    Date of Patent: October 13, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Nagano, Takashi Inoue, Kazuo Ueno, Shohroh Mochida, Shuji Ueda, Osamu Adachi
  • Patent number: 5565329
    Abstract: The present invention relates to a method of determining histamine content as a freshness index of food. An examination liquid is injected in a reaction cell, an amount of dissolved oxygen (DO) is recorded through an oxygen sensor and an amplifier in the recorder. Then, an enzymatic reagent having histamine oxidase activity is injected in the reaction cell, a decrease in the dissolved oxygen is recorded in the recorder, and the histamine concentration is determined on the basis of the decrease by a micro computer.
    Type: Grant
    Filed: May 9, 1995
    Date of Patent: October 15, 1996
    Assignee: Kikkoman Corporation
    Inventors: Minoru Ohashi, Osamu Adachi
  • Patent number: 5315593
    Abstract: A communication control unit provides an interface between a node apparatus of a lattice communication network and a terminal in conformance with a token ring network standard. The communication control unit includes a first memory for temporarily storing an input frame from the terminal, a second memory for temporarily storing an input frame from the lattice communication network, an input signal discriminator for discriminating a MAC frame which is used for ring management from the input frame from the terminal, a controller for controlling operation timings of at least the first and second memories, and a return path for returning the MAC frame to the terminal with a priority over other frame when the input signal discriminator discriminates the MAC frame.
    Type: Grant
    Filed: January 3, 1992
    Date of Patent: May 24, 1994
    Assignee: Ricoh Company, Ltd.
    Inventors: Osamu Adachi, Kazunori Hoshi
  • Patent number: 5267238
    Abstract: A network interface unit couples a lattice communication network and at least one token ring network. The network interface unit includes a sequence controller which controls a token detector and a reception register so that message information received from the lattice communication network via a node apparatus connection port is looped back from the token ring network via a terminal connection port and output from the node apparatus connection port when an address detector detects that a destination address matches a stored source address, and absorbed when the address detector detects that the destination address does not match the stored source address.
    Type: Grant
    Filed: November 27, 1991
    Date of Patent: November 30, 1993
    Assignee: Ricoh Company, Ltd.
    Inventors: Takashi Yano, Atsushi Shibata, Osamu Adachi, Kazunori Hoshi, Toshiharu Murai