Patents by Inventor Osamu Akaki

Osamu Akaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device in which the emitter resistance is reduced
    Patent number: 7598521
    Abstract: A semiconductor device includes a semiconductor chip having a collector region, a base region, and an emitter region that are formed in a semiconductor substrate. The semiconductor chip also includes a base electrode strip in contact with the base region, an emitter electrode strip in contact with the emitter region, an emitter electrode plate disposed above the base electrode strip and the emitter electrode strip, and a base electrode plate disposed adjacent the emitter electrode plate. The device also includes a base terminal external to the semiconductor chip and connected to the base electrode plate and an emitter terminal external to the semiconductor chip and connected to the emitter electrode plate. The base terminal and the emitter terminal are disposed along an edge of the semiconductor chip, and the base electrode strip and the emitter electrode strip are perpendicular to the edge of the semiconductor chip.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: October 6, 2009
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Osamu Akaki
  • Semiconductor device
    Publication number: 20050212088
    Abstract: A semiconductor device includes a semiconductor chip having a collector region, a base region, and an emitter region that are formed in a semiconductor substrate. The semiconductor chip also includes a base electrode strip in contact with the base region, an emitter electrode strip in contact with the emitter region, an emitter electrode plate disposed above the base electrode strip and the emitter electrode strip, and a base electrode plate disposed adjacent the emitter electrode plate. The device also includes a base terminal external to the semiconductor chip and connected to the base electrode plate and an emitter terminal external to the semiconductor chip and connected to the emitter electrode plate. The base terminal and the emitter terminal are disposed along an edge of the semiconductor chip, and the base electrode strip and the emitter electrode strip are perpendicular to the edge of the semiconductor chip.
    Type: Application
    Filed: February 25, 2005
    Publication date: September 29, 2005
    Applicant: Sanyo Electric Co., Ltd.
    Inventor: Osamu Akaki