Abstract: An electric vehicle control device includes an idling-sliding control unit that provides control to reduce or prevent idling and sliding that may occur on a wheel of an electric vehicle. The idling-sliding control unit includes an idling-sliding detection unit for detecting idling or sliding that has occurred on the electric vehicle, and a torque command value generation unit that generates a torque command value used for reducing or preventing idling or sliding, based on output of the idling-sliding detection unit. When a prediction signal representing an anticipated occurrence of idling or sliding is inputted, the torque command value generation unit performs narrowing of the torque command value regardless of whether or not the idling-sliding control unit is performing idling-sliding control.

Abstract: A state-monitoring device includes: a state estimating unit to estimate a state of an instrument using operation information of a train on which the instrument is mounted; an instrument arrangement storing unit to store instrument arrangement information indicating arrangement of the instrument in the train; and a work plan output unit to extract the instrument to be maintained that requires inspection or component replacement on the basis of a state estimation value of the instrument, and output information regarding maintenance work in which the instrument to be maintained and the instrument arrangement information are associated with each other.

Abstract: An inspection method includes a step S20 of electrically connecting electrical signal terminals of a semiconductor device to electric connectors, and optically connecting optical signal terminals of the semiconductor device to optical connectors, a step S30 of measuring a test light output signal output from a monitoring element provided in an inspection object in response to a test input signal having been input to the monitoring element while adjusting conditions of a position and an inclination of the inspection object, and extracting conditions in which an optical intensity of the test light output signal is a predetermined determination value or greater as inspection conditions, and a step S40 of inspecting the semiconductor device under the inspection conditions.

Abstract: A blood vessel specifying device (1) includes an image processing device (31) configured to subject an image for analysis of a target part (2) to image processing to acquire blood vessel information including positions and shapes of blood vessels included in the target part (2), an evaluation device (32) configured to use the blood vessel information to assign a point rating regarding a parameter that indicates a conformity to a particular purpose with respect to the blood vessels included in the image for analysis depending on a degree of the conformity, and a specification device (33) configured to specify conforming blood vessels conforming to the purpose from the blood vessels included in the target part (2) in accordance with rating points of the parameter.

Abstract: A blood vessel position display device (1) includes an image processing device (31) configured to subject an image for analysis of a target part (2) to image processing to acquire blood vessel information including positions and shapes of blood vessels included in the target part (2), a selection device (32) configured to choose blood vessels as conforming blood vessels in which a parameter obtained from the blood vessel information satisfies specific conditions, an image generation device (33) configured to generate a projection image including display lines at least set to have lengths corresponding to the conforming blood vessels, and a projection device (40) configured to cause the positions of the display lines to correspond to the positions of the conforming blood vessels so as to project the projection image on the target part (2).

Abstract: An inspection method includes a step S20 of electrically connecting electrical signal terminals of a semiconductor device to electric connectors, and optically connecting optical signal terminals of the semiconductor device to optical connectors, a step S30 of measuring a test light output signal output from a monitoring element provided in an inspection object in response to a test input signal having been input to the monitoring element while adjusting conditions of a position and an inclination of the inspection object, and extracting conditions in which an optical intensity of the test light output signal is a predetermined determination value or greater as inspection conditions, and a step S40 of inspecting the semiconductor device under the inspection conditions.

Abstract: A test system is characterized by a holding unit that holds a light-receiving unit receiving light emitted from a test object and an optical path forming unit that is formed with an optical transmission path as a path of the light received by the light-receiving unit, in which the optical transmission path is formed of a different member from the light-receiving unit. Since the test system has such a configuration, replacement of the light-receiving unit that receives the light emitted from the test object can be facilitated.

Abstract: It is an object of the present invention to provide a method for killing tumor cells, having a few side effects. The present invention provides a method for killing tumor cells, comprising: (1) a step of allowing an immunotoxin formed by binding an antibody binding to ROBO1 or a fragment thereof to a cytotoxin to come into contact with tumor cells; (2) a step of allowing a photosensitizer that induces photochemical cytoplasmic internalization to come into contact with the tumor cells; and (3) a step of irradiating the tumor cells with a wave length that is effective for activating the sensitizer, so as to kill the cells.

Abstract: A three-dimensional reference image is displayed along with an ultrasound image (tomogram). The three-dimensional reference image has a first existing line representing a first puncture needle and a second prospective line indicating the prospective puncture path of a second puncture needle. The position and orientation of the probe are adjusted by the user with reference to the three-dimensional reference image so that the second prospective line has an appropriate position relative to the first existing line. After the adjustment, the second puncture needle is inserted into the body using a puncture adaptor provided on the probe. A second existing line is displayed in the three-dimensional reference image when the insertion of the second puncture needle is completed.

Abstract: Provided are a control server and a control system both capable of preventing traffic accidents more effectively. The control server is configured to control multiple traffic signals installed on a road, and includes: a pressure information obtainer configured to obtain pressure information which is outputted from a pressure sensor installed at a stop position on the road corresponding to each of the multiple traffic signals, and which includes a value representing pressure received from a vehicle running on the road; an abrupt braking information obtainer configured to, based on the pressure information, obtain abrupt braking information on an abrupt braking operation performed by the vehicle running on the road; and a traffic signal controller configured to, based on the abrupt braking information, generate a control signal for controlling the multiple traffic signals.

Abstract: A test system is characterized by including: a holding unit that holds a light-receiving unit receiving light emitted from a test object; and an optical path forming unit that is formed with an optical transmission path as a path of the light received by the light-receiving unit, in which the optical transmission path is formed of a different member from the light-receiving unit. Since the test system has such a configuration, replacement of the light-receiving unit that receives the light emitted from the test object can be facilitated.

Abstract: Provided are a control server and a control system both capable of preventing traffic accidents more effectively. The control server is configured to control multiple traffic signals installed on a road, and includes: a pressure information obtainer configured to obtain pressure information which is outputted from a pressure sensor installed at a stop position on the road corresponding to each of the multiple traffic signals, and which includes a value representing pressure received from a vehicle running on the road; an abrupt braking information obtainer configured to, based on the pressure information, obtain abrupt braking information on an abrupt braking operation performed by the vehicle running on the road; and a traffic signal controller configured to, based on the abrupt braking information, generate a control signal for controlling the multiple traffic signals.

Abstract: A three-dimensional reference image is displayed along with an ultrasound image (tomogram). The three-dimensional reference image has a first existing line representing a first puncture needle and a second prospective line indicating the prospective puncture path of a second puncture needle. The position and orientation of the probe are adjusted by the user with reference to the three-dimensional reference image so that the second prospective line has an appropriate position relative to the first existing line. After the adjustment, the second puncture needle is inserted into the body using a puncture adaptor provided on the probe. A second existing line is displayed in the three-dimensional reference image when the insertion of the second puncture needle is completed.

Abstract: It is an object of the present invention to provide a monoclonal antibody, which is suitable for the quantitative analysis of asparagine synthetase in a cell. The present invention provides a monoclonal antibody which specifically recognizes asparagine synthetase that is present in a cell.

Abstract: An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

Abstract: An ultrasonic image is captured by an ultrasonic probe. A reference image is obtained by extracting a tomographic image corresponding to the scan plane of the ultrasonic image from volume image data that is pre-obtained by a diagnostic imaging apparatus and that is stored in a volume-data storing unit. The ultrasonic image and the reference image are displayed on the same screen. In this case, of the reference image, a portion corresponding to the view area of the ultrasonic image is extracted and the resulting reference image having the same region as the ultrasonic image is displayed as a fan-shaped image.

Abstract: An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads.

Abstract: A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.

Abstract: An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

Abstract: An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads.