Patents by Inventor Osamu Asagi

Osamu Asagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6284057
    Abstract: Soldering paste obtained by mixing solder material with photosetting flux, which hardens by the irradiation of ultraviolet light, is used for reflow soldering. The photosetting flux contains flux base material, flux base material solvent, a photopolymerization initiator and photosetting prepolymer. The soldering paste obtained by mixing this photosetting flux is printed and bonded on the surface of soldered portion of a printed substrate, and is brought into tight contact with the pad portion of a lead of an electronic part to be soldered. The surface of soldering paste exposed is irradiated with ultraviolet light to cause the surface to gel. Thereafter, soldering is effected by means of preliminary heating and solder melting and heating (reflow heating). Since the surface of the soldering paste is thereby hardened by the irradiation of ultraviolet light, no sags occur during preliminary heating, thus making it possible to prevent any defective bridge caused by sags.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: September 4, 2001
    Assignee: Sony Corporation
    Inventors: Osamu Asagi, Moriyuki Ebizuka, Koichi Shiozawa, Kiyoshi Ichikawa
  • Patent number: 5871592
    Abstract: Soldering paste obtained by mixing solder material with photosetting flux, which hardens by the irradiation of ultraviolet light, is used for reflow soldering. The photosetting flux contains flux base material, flux base material solvent, a photopolymerization initiator and photosetting prepolymer. The soldering paste obtained by mixing this photosetting flux is printed and bonded on the surface of soldered portion of a printed substrate, and is brought into tight contact with the pad portion of a lead of an electronic part to be soldered. The surface of soldering paste exposed is irradiated with ultraviolet light to cause the surface to gel. Thereafter, soldering is effected by means of preliminary heating and solder melting and heating(reflow heating). Since the surface of the soldering paste is thereby hardened by the irradiation of ultraviolet light, no sags occur during preliminary heating, thus making it possible to prevent any defective bridge caused by sags.
    Type: Grant
    Filed: September 18, 1996
    Date of Patent: February 16, 1999
    Assignee: Sony Corporation
    Inventors: Osamu Asagi, Moriyuki Ebizuka, Koichi Shiozawa, Kiyoshi Ichikawa
  • Patent number: 4377777
    Abstract: Two DC motors are driven by switching pulse drive circuits, and the switching on times of drive pulses are made to be out of phase with each other at the two switching pulse drive circuits. One of the two DC motors rotates rotary video heads, and the other drives a capstan of a video tape recording and/or reproducing apparatus. The drive pulses are preferably synchronized with horizontal synchronizing pulses of a video signal to be handled by the video tape recording and/or reproducing apparatus in order to avoid pulse noises.
    Type: Grant
    Filed: August 15, 1980
    Date of Patent: March 22, 1983
    Assignee: Sony Corporation
    Inventors: Osamu Asagi, Masaaki Sakai