Abstract: A vapor chamber that includes a housing composed of a first sheet and a second sheet facing each other and having outer edge portions thereof joined to each other to define an internal space, the second sheet having a plurality of projecting portions on an inner surface thereof that faces the internal space; a pillar between the first sheet and the second sheet and supporting them from the internal space; a wick arranged in the housing, and a working fluid enclosed in the housing. A first flow path and a second flow path are formed in the internal space, and a cross-sectional area of the second flow path is larger than a cross-sectional area of the first flow path.

Abstract: A vapor chamber that includes a housing, and working fluid that is sealed in the housing. The housing has a plurality of protrusions on at least one main surface inside the housing, the protrusions are composed of a columnar portion and a head portion, at least one lateral surface of the head portion faces a lateral surface of another head portion, and a first area of the head portion measured in a direction perpendicular to the main surface of the housing is larger than a second area of the columnar portion.

Abstract: A vapor chamber includes a housing including first and second sheets that face each other and that include respective outer edge portions joined to each other, supports that support the first and second sheets from inside and that are disposed therebetween, and a hydraulic fluid enclosed in the housing. The first and second sheets do not include an angled portion having an angle of about 90° or less between a joint and a support nearest to the joint. The expression 0.02?b/a?0.3 is satisfied, where a is a distance from an outer edge of the outermost support to an inner edge of the joint between the first and second sheets, and b is a distance between the first and second sheets at the outer edge of the outermost support.

Abstract: A thermoelectric conversion element includes a laminated body including a plurality of first thermoelectric conversion parts, a plurality of second thermoelectric conversion parts, and an insulator layer. The first thermoelectric conversion parts and the second thermoelectric conversion parts are alternately arranged in the Y axis direction and the first thermoelectric conversion part and the second thermoelectric conversion part are joined in a region of the surface between the first thermoelectric conversion part and the second thermoelectric conversion part in the Y axis direction, and in the other region of the surface in the Y axis direction, the insulator layer is interposed between the first thermoelectric conversion part and the second thermoelectric conversion part. The laminated body has a first principal surface and a second principal surface at both ends in the Y axis direction, and both end surfaces in a direction perpendicular to the Y axis direction.

Abstract: A thermoelectric conversion module includes a plurality of thermoelectric conversion element and a sealing member for sealing the plurality of thermoelectric conversion elements. The thermoelectric conversion element includes a plurality of first thermoelectric conversion parts and a plurality of second thermoelectric conversion parts, being alternately disposed in a Y-axial direction. At least one of an end portion of the first thermoelectric conversion part on its ?Z direction side and an end portion thereof on its +Z direction side is electrically connected to an end portion of the second thermoelectric conversion part of the adjacent other thermoelectric conversion element. The sealing member has an upper side serving as a contact surface.

Abstract: A thermoelectric conversion module includes a module main body having a length direction and a height direction which is perpendicular to the length direction. The module main body include a row of alternating first and second thermoelectric conversion elements each of which is elongated in the height direction and has upper and lower surfaces. First and second electrodes are connected to respective ones of the plurality of first and second thermoelectric conversion elements. An insulator covers both the upper and lower surfaces of the first and second thermoelectric conversion elements. A lower heat transfer plates is provided on the lower part of the insulator 13 and an upper heat transfer plate is provided on the upper part of the insulator.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: A method is provided for efficiently and securely smoothing a surface of an electrode disposed on a base, such as a ceramic substrate, without damaging the electrode or the base. The electrode is fired by a non-shrinkage process using a constraining layer and is separated from the constraining layer. The base including the electrode disposed thereon is prepared and a surface of the electrode is smoothed by vibrating media such that the media are arranged to be in contact with the electrode.

Abstract: A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.

Abstract: When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.

Abstract: A laminated body includes, in sequence, a base layer mainly composed of a ceramic material and a glass material, a first constraining layer that is primarily made of a ceramic material that is not sintered at a temperature at which the base layer is sintered, a second constraining layer primarily made of a ceramic material and a glass material that are sintered at the temperature at which the base layer is sintered, and a third constraining layer primarily made of a ceramic material that is not sintered at the temperature at which the base layer is sintered. The laminated body is subsequently fired at the temperature at which the base layer is sintered. The first, second, and third constraining layers are removed from the fired laminated body to provide a ceramic body that is a sinter of the base layer. After the firing, adhesion between the base layer and the first constraining layer and adhesion between the second constraining layer and the first constraining layer are different from each other.

Abstract: A ceramic electronic component achieves a sufficient drop resistance strength even when terminal electrodes are formed with a higher density. The ceramic electronic component includes a ceramic laminate including ceramic laminates which are laminated to each other, first terminal electrodes disposed in a peripheral portion of a bottom surface of the ceramic laminate, catch pad electrodes arranged in the ceramic laminate so as to face the respective first terminal electrodes, and sets each including at least two first via hole conductors, which electrically connect the first terminal electrodes and the respective catch pad electrodes.

Abstract: In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.

Abstract: An auxiliary-layer-lined unfired ceramic body, having a step portion in a principal surface thereof, has an unfired ceramic body and an auxiliary layer which is adhered to one principal surface of the unfired ceramic body and which is made of a material that is substantially unsinterable at a temperature at which the unfired ceramic body is fired. The auxiliary-layer-lined unfired ceramic body is fired at a temperature at which the unfired ceramic body is sinterable but the auxiliary layer is substantially unsinterable, while the auxiliary layer remains adhered to the unfired ceramic body. A pressing operation is performed using a die having a projection placed on the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer, so that the step portion, having a shape corresponding to the outer shape of the die projection, is formed in the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer.

Abstract: A laminated body includes, in sequence, a base layer mainly composed of a ceramic material and a glass material, a first constraining layer that is primarily made of a ceramic material that is not sintered at a temperature at which the base layer is sintered, a second constraining layer primarily made of a ceramic material and a glass material that are sintered at the temperature at which the base layer is sintered, and a third constraining layer primarily made of a ceramic material that is not sintered at the temperature at which the base layer is sintered. The laminated body is subsequently fired at the temperature at which the base layer is sintered. The first, second, and third constraining layers are removed from the fired laminated body to provide a ceramic body that is a sinter of the base layer. After the firing, adhesion between the base layer and the first constraining layer and adhesion between the second constraining layer and the first constraining layer are different from each other.

Abstract: A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.

Abstract: In a method for manufacturing a laminated ceramic electronic component, in order to form a green ceramic laminate to be fired, first ceramic green layers which include first conductor patterns including Ag as a main component and which include a first ceramic material including a first glass component are disposed in surface layer portions. Second ceramic green layers which include second conductor patterns including Ag as a main component, which include a second ceramic material containing a second glass component, and which include a composition in which Ag diffuses than more easily in the first ceramic green layer during firing are disposed in inner layer portions. The green ceramic laminate is fired to produce a multilayer ceramic substrate.

Abstract: When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.