Patents by Inventor Osamu Fujikawa

Osamu Fujikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component carriers and method of producing the same as well as electronic devices
    Patent number: 5438478
    Abstract: An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and thorugh-hole, an adhesive layer formed on the substrate, a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection, and a solder layer formed in the through-hole for electrical connection to the conductor pattern of the substrate.
    Type: Grant
    Filed: October 18, 1993
    Date of Patent: August 1, 1995
    Assignee: Ibiden Co., Ltd.
    Inventors: Mitsuhiro Kondo, Osamu Fujikawa, Katsumi Sagisaka