Patents by Inventor Osamu Hashimoto
Osamu Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130120959Abstract: The dielectric sheet of the present invention is made of a sheet having a thickness of 5-30 ?m, which is formed by drying a coated film of a coating liquid containing a resin and a natural graphite powder having an average particle diameter of 10 ?m or less. Preferably, the sheet is formed from a coating liquid containing a resin, a natural graphite powder having an average particle diameter of 10 ?m or less, and a solvent, wherein the content rate of the natural graphite powder to the resin exceeds 5% by volume and is not more than 20% by volume, and the total content of the resin and the natural graphite powder is 10-55 wt %.Type: ApplicationFiled: May 27, 2011Publication date: May 16, 2013Applicant: NITTO DENKO CORPORATIONInventors: Takashi Wano, Masataka Tada, Yuuki Fukuda, Osamu Hashimoto, Ryoji Tamaru
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Patent number: 8138460Abstract: A method and apparatus of obtaining a record of repetitive optical or other phenomena having durations in the picosecond range, comprising a circular scan electron tube to receive light pulses and convert them to electron images consisting with fast nanosecond electronic signals, a continuous wave light or other particle pulses, e.g. electron picosecond pulses, and a synchronizing mechanism arranged to synchronize the deflection of the electron image (images) in the tube (tubes) with the repetition rate of the incident pulse train. There is also provided a method and apparatus for digitization of a repetitive and random optical waveform with a bandwidth higher than 10 GHz.Type: GrantFiled: March 8, 2010Date of Patent: March 20, 2012Assignee: Jefferson Science Associates, LLCInventors: Amur Margaryan, Karlen Gynashyan, Osamu Hashimoto, Stanislaw Majewski, Linguang Tang, Gagik Marikyan, Lia Marikyan, legal representative
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Publication number: 20110260904Abstract: An electromagnetic wave absorber includes a dielectric layer, a divided conductive film layer and an electromagnetic wave reflective layer, wherein a ratio of thickness ādā and wavelength ā?ā satisfies a condition of [0.01?d/?0.03], weight per unit area of the electromagnetic wave absorber falls within a range of 1000 g/m2 and 3000 g/m2. The divided conductive film layer is configured such that each side's length of conductive films is dimensioned within a range of 0.5 mm and 4.8 mm and arrangement distance between adjoining conductive films is taken within a range of 0.01 mm and 3 mm.Type: ApplicationFiled: April 25, 2011Publication date: October 27, 2011Applicant: NITTO DENKO CORPORATIONInventors: Yuuki Fukuda, Takashi Wano, Masataka Tada, Osamu Hashimoto
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Publication number: 20110147073Abstract: An electromagnetic radiation absorber is made up of a composite of base material and filler. The base material is formed of high permittivity dielectric material and formed in a cubic shape. The filler is formed of high magnetic permeability material and fills in long holes formed inside the base material in three directions. In the composite, the high permittivity dielectric material and the high magnetic permeability material are arranged in a three-dimensionally continuous manner. Accordingly, a thinned and light-weighted electromagnetic radiation absorber and a method for absorbing electromagnetic radiation are provided which have a high electromagnetic radiation absorbing property with respect to electromagnetic radiation of wide band including electromagnetic radiation of low frequency.Type: ApplicationFiled: September 19, 2008Publication date: June 23, 2011Applicant: NITTO DENKO CORPORATIONInventors: Katsuya Kume, Masataka Tada, Fuyuki Eriguchi, Takezo Hatanaka, Yuuki Fukuda, Toshinobu Hoshino, Osamu Hashimoto, Yuichi Sakumo
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Patent number: 7245508Abstract: A power conversion apparatus includes serially connected arms U and X, serially connected arms V and Y, serially connected arms W and Z, and a capacitor, the pairs of serially connected arms and the capacitor all connected in parallel to one another. The input-side arms U and X and the output-side arms W and Z are subjected to PWM control so that the arms W and Z are controlled to have a voltage that is lower than that of the arms U and X, thereby providing a step down operation. A step up operation also can be provided by an opposite relation in which the arms W and Z are controlled to have a voltage that is higher than that of the arms U and X, thereby to expand the range within which the output voltage is controlled with the effect of reducing distortion.Type: GrantFiled: May 31, 2005Date of Patent: July 17, 2007Assignee: Fuji Electric Systems Co., Ltd.Inventors: Hirokazu Tokuda, Nobuyuki Kobayashi, Yasuhiro Okuma, Hiroyuki Matsuo, Osamu Hashimoto
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Patent number: 7077640Abstract: A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while processing the same material into a sheet type material of a predetermined thickness, a first processing step for cutting the sheet type material, which has thus been transferred to a stage for carrying out this step, in parallel with the transfer direction thereof to a predetermined width, and thereby obtaining a processed body of laterally arranged rows of elongated string-like materials, a step of cutting the processed body, which is obtained in the first processing step, to a predetermined length with respect to the transfer direction, a transfer direction changing step for transferring the processed body, which has been subjected to the cutting step, to a subsequent stage by changing the transfer direction of the processed bodyType: GrantFiled: August 16, 2004Date of Patent: July 18, 2006Assignee: Sumitomo Bakelite Company LimitedInventors: Osamu Hashimoto, Kazuyuki Najima, Ryuji Nozaki
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Publication number: 20060007712Abstract: A power conversion apparatus includes serially connected arms U and X, serially connected arms V and Y, serially connected arms W and Z, and a capacitor, the pairs of serially connected arms and the capacitor all connected in parallel to one another. The input-side arms U and X and the output-side arms W and Z are subjected to PWM control so that the arms W and Z are controlled to have a voltage that is lower than that of the arms U and X, thereby providing a step down operation. A step up operation also can be provided by an opposite relation in which the arms W and Z are controlled to have a voltage that is higher than that of the arms U and X, thereby to expand the range within which the output voltage is controlled with the effect of reducing distortion.Type: ApplicationFiled: May 31, 2005Publication date: January 12, 2006Inventors: Hirokazu Tokuda, Nobuyuki Kobayashi, Yasuhiro Okuma, Hiroyuki Matsuo, Osamu Hashimoto
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Patent number: 6888158Abstract: A bare chip carrier for holding a bare chip includes a bare chip carrier base member, a bump electrode which is located above a principal surface of the bare chip carrier base member and which is to be connected to a pad electrode of the bare chip, a bare chip carrier electrode which is formed on a back surface of the bare chip carrier base member and which has a recessed portion, and a wiring that connects the bump electrode to the bare chip carrier electrode.Type: GrantFiled: September 20, 2001Date of Patent: May 3, 2005Assignee: Renesas Technology Corp.Inventor: Osamu Hashimoto
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Publication number: 20050013893Abstract: A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while processing the same material into a sheet type material of a predetermined thickness, a first processing step for cutting the sheet type material, which has thus been transferred to a stage for carrying out this step, in parallel with the transfer direction thereof to a predetermined width, and thereby obtaining a processed body of laterally arranged rows of elongated string-like materials, a step of cutting the processed body, which is obtained in the first processing step, to a predetermined length with respect to the transfer direction, a transfer direction changing step for transferring the processed body, which has been subjected to the cutting step, to a subsequent stage by changing the transfer direction of the processed bodyType: ApplicationFiled: August 16, 2004Publication date: January 20, 2005Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Osamu Hashimoto, Kazuyuki Najima, Ryuji Nozaki
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Patent number: 6838030Abstract: A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while processing the same material into a sheet type material of a predetermined thickness, a first processing step for cutting the sheet type material, which has thus been transferred to a stage for carrying out this step, in parallel with the transfer direction thereof to a predetermined width, and thereby obtaining a processed body of laterally arranged rows of elongated string-like materials, a step of cutting the processed body, which is obtained in the first processing step, to a predetermined length with respect to the transfer direction, a transfer direction changing step for transferring the processed body, which has been subjected to the cutting step, to a subsequent stage by changing the transfer direction of the processed bodyType: GrantFiled: December 31, 2001Date of Patent: January 4, 2005Assignee: Sumitomo Bakelite Company LimitedInventors: Osamu Hashimoto, Kazuyuki Najima, Ryuji Nozaki
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Patent number: 6797744Abstract: There is disclosed a composition which is layered in a reflective board to constitute a radio wave absorber. In this composition, an electroconductive titanium oxide is compounded with a substrate. With regard to the substrate, there may be used thermoplastic resin, thermosetting resin, rubber or elastomer.Type: GrantFiled: January 28, 2002Date of Patent: September 28, 2004Assignee: The Yokohama Rubber Co., Ltd.Inventors: Osamu Hashimoto, Tetsu Soh, Masato Tadokoro
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Publication number: 20040172477Abstract: The present invention relates to a content providing system which can provide a user with a desirable content in a short time. This content providing system comprises content package receiving means for receiving a content package including a content and attribute information concerning an attribute of the content; content package extracting means for extracting a specific content package from received content packages; content package storing means including a specific area for storing the specific content package; content package alteration control means for erasing the content package stored in the specific area and so forth and inhibiting the user from erasing the detail of the content package and so forth according to an instruction signal; content package reading means for reading out the content package; and content providing means for providing the content included in the content package.Type: ApplicationFiled: January 30, 2004Publication date: September 2, 2004Inventors: Dai Takeuchi, Yasuhiko Iwai, Osamu Hashimoto
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Patent number: 6783297Abstract: A projecting portion 52 which becomes convex in radial direction is formed in a rubber elastic body 5 for connecting together an inner cylindrical body 3 mounted to a shaft portion 21a of a lower shift lever member 21 by external interfit and an outer cylindrical body 4 mounted to a cylindrical portion 22a of an upper shift lever member 22 by internal interfit. Formed in an inner peripheral surface of the outer cylindrical body 4 is a recessed portion 42 which becomes concave with clearances C1 and C2 of respective given amounts left between the recessed portion 42 and the projecting portion 52. This makes it possible to manufacture a shift lever bush 1 having a two-stage spring characteristic at low cost.Type: GrantFiled: January 23, 2002Date of Patent: August 31, 2004Assignees: Kurashiki Kako Co., Ltd., Mannoh Kogyo Co., Ltd.Inventors: Osamu Hashimoto, Yoshihito Hiraiwa, Kenji Nishikawa
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Patent number: 6774657Abstract: Versatility of an inspection apparatus suitable for use in a burn-in inspection operation is improved so as to enable inspection of various semiconductor integrated circuits. A plurality of relay pins which are electrically connected to wiring patterns laid on a base board are provided. Sockets for receiving a semiconductor integrated circuits are mounted on a base board. An exchange board is provided for electrically connecting socket terminals of the socket to specific relay pins. The exchange board is mounted on the base board via spacers. In accordance with the type of semiconductor integrated circuits, the exchange board and the socket are replaced.Type: GrantFiled: December 7, 2000Date of Patent: August 10, 2004Assignee: Renesas Technology Corp.Inventors: Osamu Hashimoto, Masaaki Tanimura
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Patent number: 6750672Abstract: An apparatus to be inspected is mounted on one surface of a socket board. An auxiliary inspecting apparatus for adjusting timing of write signals transmitted from a semiconductor inspecting apparatus is mounted on the other surface of the socket board. Input/output (I/O) pins of the auxiliary inspecting apparatus are connected to corresponding I/O pins of the inspected device via through holes in the socket board on a one-to-one basis. This semiconductor inspecting method is thus capable of easily suppressing the delay difference between a plurality of signals output from the semiconductor inspecting apparatus.Type: GrantFiled: April 10, 2002Date of Patent: June 15, 2004Assignee: Renesas Technology Corp.Inventors: Masaaki Tanimura, Mitsuhiro Hamada, Osamu Hashimoto
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Patent number: 6703854Abstract: A function test circuit inside a burn-in apparatus is mounted on a burn-in board and specifies a plurality of checked devices which operate normally. An average voltage calculating circuit calculates average voltage for test voltage applied to a plurality of checked devices specified on a mounting section. A voltage correction circuit receives the average voltage and outputs a control signal to control set voltage output from a device power supply generation circuit. Therefore, this burn-in apparatus can set the test voltage applied to the checked devices readily with high accuracy.Type: GrantFiled: August 22, 2002Date of Patent: March 9, 2004Assignee: Renesas Technology Corp.Inventor: Osamu Hashimoto
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Patent number: 6683246Abstract: The radio wave absorber of the present invention has a radio wave reflector and at least two radio wave absorbing layers disposed on a surface of the radio wave reflector, the at least two radio wave absorbing layers being formed of a base material and electroconductive titanium oxide mixed with the base material. The radio wave absorbing layers have different blend ratios of the electroconductive titanium oxide so as to make their radio wave absorption property different.Type: GrantFiled: October 29, 2002Date of Patent: January 27, 2004Assignees: The Yokohama Rubber Co., LTDInventors: Osamu Hashimoto, Tetsu Soh
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Publication number: 20030079893Abstract: The radio wave absorber of the present invention has a radio wave reflector and at least two radio wave absorbing layers disposed on a surface of the radio wave reflector, the at least two radio wave absorbing layers being formed of a base material and electroconductive titanium oxide mixed with the base material. The radio wave absorbing layers have different blend ratios of the electroconductive titanium oxide so as to make their radio wave absorption property different.Type: ApplicationFiled: October 29, 2002Publication date: May 1, 2003Inventors: Osamu Hashimoto, Tetsu Soh
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Patent number: 6545499Abstract: The peak of the current dissipated by semiconductor devices is dispersed and suppressed to a level below the current supply capability of a burn-in apparatus. As a result, there is obtained a semiconductor manufacturing-and-inspection apparatus which enables easy performance of a burn-in test without involvement of anomalies arising in the burn-in apparatus or limitations on the number of semiconductor devices mounted on the burn-in board. A semiconductor manufacturing-and-inspection system, which tests semiconductor devices provided in a plurality of areas on a burn-in board through use of a burn-in apparatus, includes a driver for supplying a drive signal to the semiconductor devices provided in the plurality of areas, a delay circuit which is provided for one of a plurality of drive signals output from the signal generation apparatus and delays the drive signal relative to the other drive signal; and a driver for controlling the delaying operation of the delay apparatus.Type: GrantFiled: June 5, 2001Date of Patent: April 8, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventor: Osamu Hashimoto
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Publication number: 20030062918Abstract: A function test circuit inside a burn-in apparatus is mounted on a burn-in board and specifies a plurality of checked devices which operate normally. An average voltage calculating circuit calculates average voltage for test voltage applied to a plurality of checked devices specified on a mounting section. A voltage correction circuit receives the average voltage and outputs a control signal to control set voltage output from a device power supply generation circuit. Therefore, this burn-in apparatus can set the test voltage applied to the checked devices readily with high accuracy.Type: ApplicationFiled: August 22, 2002Publication date: April 3, 2003Applicant: Mitsubishi Denki Kabushiki KaishaInventor: Osamu Hashimoto