Patents by Inventor Osamu Hoshino

Osamu Hoshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10854373
    Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: December 1, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Tsukasa Nakanishi, Kiyokazu Sato, Osamu Hoshino
  • Publication number: 20180218830
    Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.
    Type: Application
    Filed: January 25, 2018
    Publication date: August 2, 2018
    Inventors: Tsukasa Nakanishi, Kiyokazu Sato, Osamu Hoshino
  • Publication number: 20180166374
    Abstract: A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.
    Type: Application
    Filed: November 7, 2017
    Publication date: June 14, 2018
    Inventors: KIYOKAZU SATO, MITSUYOSHI IMAI, OSAMU HOSHINO
  • Patent number: 9997448
    Abstract: A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: June 12, 2018
    Assignee: Shinko Electric Industries Co., Ltd
    Inventors: Kiyokazu Sato, Mitsuyoshi Imai, Osamu Hoshino
  • Patent number: 9826639
    Abstract: A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion projecting from a first surface of the first wiring layer facing away from the insulating layer. A surface of the end portion facing in the same direction as the first surface of the first wiring layer is depressed to be deeper in the center than in the periphery.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: November 21, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Tatsuaki Denda, Osamu Hoshino
  • Publication number: 20170164473
    Abstract: A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion projecting from a first surface of the first wiring layer facing away from the insulating layer. A surface of the end portion facing in the same direction as the first surface of the first wiring layer is depressed to be deeper in the center than in the periphery.
    Type: Application
    Filed: November 15, 2016
    Publication date: June 8, 2017
    Inventors: Tatsuaki DENDA, Osamu HOSHINO
  • Patent number: 9167689
    Abstract: A wiring substrate includes an insulation substrate including a first surface, a second surface on an opposite side of the first surface, and first and second through-holes penetrating the insulation substrate from the first surface to the second surface; a wiring layer formed on the first surface of the insulation substrate; a first via formed in the first through-hole and connected to the wiring layer; a bus line positioned away from the wiring layer and the first via, and formed on the first surface of the insulation substrate; and a second via formed in the second through-hole and connected to the bus line.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: October 20, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Takayuki Matsumoto, Kiyokazu Sato, Osamu Hoshino
  • Publication number: 20130233607
    Abstract: A wiring substrate includes an insulation substrate including a first surface, a second surface on an opposite side of the first surface, and first and second through-holes penetrating the insulation substrate from the first surface to the second surface; a wiring layer formed on the first surface of the insulation substrate; a first via formed in the first through-hole and connected to the wiring layer; a bus line positioned away from the wiring layer and the first via, and formed on the first surface of the insulation substrate; and a second via formed in the second through-hole and connected to the bus line.
    Type: Application
    Filed: February 22, 2013
    Publication date: September 12, 2013
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Atsushi NAKAMURA, Tsukasa NAKANISHI, Takayuki MATSUMOTO, Kiyokazu SATO, Osamu HOSHINO
  • Publication number: 20080246616
    Abstract: A media case and a circuit pattern sheet with a simple configuration is provided that allows highly dense collection and reliable recognition of housed disk media. The media case 1 can house disk media 50 provided with an RFID tag (not illustrated in the drawing). This media case 1 includes an antenna element 51a being formed on its back plane to exchange an electromagnetic wave signal with the outside of the media case 1; a waveguide line 52a formed in the vicinity of its center therethrough along the disk media 50 from the antenna element 51a to guide high-frequency signals representing the electromagnetic wave signals to the antenna element 51a; and a resonance element 53a being formed adjacent to this waveguide line 52a and electromagnetically induced by the high-frequency signal.
    Type: Application
    Filed: February 28, 2008
    Publication date: October 9, 2008
    Inventors: Isao SAKAMA, Osamu Hoshino
  • Publication number: 20080086307
    Abstract: Preparation of Braille books and audio books by man has a problem that a great deal of costs including the work cost for recitation or translation (printing) of Braille, composition, examination and the like and the distribution cost are required as compared with general books. Further, there is a problem that books that visually handicapped people wish to read cannot be delivered immediately at an inexpensive price. The user (reader) himself participates in editing or correction in processing for producing an audio book which reads an electronic book aloud using the speech synthesis technique and pronunciation symbol text constituting the basis of the audio book to thereby reduce the cost required for the production processing of the audio book and the pronunciation symbol text and improve the quality of the audio book and the pronunciation symbol text.
    Type: Application
    Filed: May 29, 2007
    Publication date: April 10, 2008
    Applicant: Hitachi Consulting Co., Ltd.
    Inventors: Nobuya Okayama, Osamu Hoshino, Shigeru Iida, Akiko Isono, Aya Onoyama
  • Publication number: 20010044778
    Abstract: The present invention provides a commercial transaction system which enables goods to be sold and bought with high accuracy without anxiety by using a computer network such as the Internet, and which can also give credit information in commercial transaction. The electronic commercial transaction system according to the invention includes plural electronic terminals connected to one another by a computer network, and an authentication station connected to the computer network. An electronic certificate and a company code are assigned to each of the electronic terminals on the basis of examination performed by the authentication station, and when a commercial transaction is to be performed between one and another of the electronic terminals via the computer network, both selling and buying sides of the commercial transaction present the respective electronic certificates before performing the commercial transaction.
    Type: Application
    Filed: June 25, 2001
    Publication date: November 22, 2001
    Inventors: Osamu Hoshino, Hiroaki Okazaki, Terukazu Asami, Haruhiko Usui, Toshikazu Ichikawa
  • Patent number: 6216989
    Abstract: A support structure for a body to be supported, such as a display unit, includes a support base, a stand support held upright by the support base, and an attachment member for attaching a body to be supported thereto laterally held by the stand support. The stand support and the attachment member may be coupled to each other in an electrically insulated state. The body to be supported may be mounted on the attachment member via a tilting mechanism for holding the support body at an arbitrarily vertically tilted angle from a home position.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: April 17, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yasushi Shioya, Osamu Hoshino, Takao Miyamoto, Akio Yoshida, Hiroshi Takabayashi, Toyohide Miyazaki, Toshiaki Itazawa, Takashi Yamamoto
  • Patent number: 6163358
    Abstract: A liquid crystal layer is sealed between an array substrate and an opposed substrate arranged to oppose each other with a gap. A multiplicity of particulate spacers are arranged between the array and opposed substrates to maintain the gap therebetween. The array substrate is formed with a transparent insulating film covering signal lines, scanning lines, switching elements and pixel electrodes. The areas of the insulating film opposing the respective pixel electrodes are each formed with a plurality of apertures for limiting the movement of the spacers.
    Type: Grant
    Filed: October 2, 1998
    Date of Patent: December 19, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masanobu Nonaka, Hisaaki Hayashi, Koichi Shiba, Tomiaki Yamamoto, Osamu Hoshino
  • Patent number: 5627670
    Abstract: A scanning optical apparatus comprises a light source unit, scanning means for deflecting a beam from said light source unit and scanning a scanning surface with the beam, means for detecting the beam scanned on said scanning surface and control means for controlling the beam scanned on said scanning surface in a direction perpendicular to said scanning surface on the basis of a magnitude and a change as a function of time of a signal output from said detecting means.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 6, 1997
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuo Minoura, Isamu Shimoda, Masayuki Suzuki, Yoshinobu Shiraiwa, Osamu Hoshino
  • Patent number: 5615038
    Abstract: A scanning optical device for scanning a material to be scanned with a beam emitted from a light source thereof, has a storage device for storing information relating to the quantity of deviation of a scanning optical system. The convergent position of the beams is adjustable in the direction of the optical axis by at least partially controlling the elements of the scanning optical system in accordance with information relating the quantity of deviation supplied by the storage device. The quantity of deviation such as curvature of field of the scanning optical system can be compensated by a simple structure. Therefore, a recording device or reading device employing the scanning optical system exhibiting high resolution, low cost and a capability of preventing deterioration in the gradation expression can be realized.
    Type: Grant
    Filed: April 11, 1995
    Date of Patent: March 25, 1997
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masayuki Suzuki, Osamu Hoshino, Yoshinobu Shiraiwa, Kazuo Minoura
  • Patent number: 5283681
    Abstract: A scanning optical equipment provided with the means to detect scanning beam spot at more than two points of the scanned surface and the means to enable direct observation of the state of focussing of the beam spot, thus enabling extremely precise control of the state of focussing and forming an extremely high density image which could not be obtained by the conventional methods.
    Type: Grant
    Filed: April 27, 1990
    Date of Patent: February 1, 1994
    Assignee: Canon Kabushiki Kaisha
    Inventors: Osamu Hoshino, Isamu Shimoda, Kazuo Isaka, Masayuki Suzuki
  • Patent number: 5142306
    Abstract: An image forming apparatus and method for forming an image includes a recording material which changes its adhesiveness in response to the polarity of the voltage applied thereto. Such a recording material can include negatively or positively changeable or inorganic particles, gas-generating solvents, a substance having a gel or sol state, and a dissociative electrolyte. The recording material is positioned between a pair of electrodes. At least one of the electrodes includes an electroconductive member and a pattern comprising an insulating material disposed on the electroconductive member. A voltage is then applied between the pair of electrodes to attach the recording material to one of the electrodes. Also provided is a pressure applicator for transferring to a transfer-receiving medium the recording material attached to the electrode.
    Type: Grant
    Filed: March 27, 1990
    Date of Patent: August 25, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kohzoh Arahara, Osamu Hoshino, Noboru Tohyama, Toshiya Yuasa, Norihiko Koizumi, Hiroshi Tanioka
  • Patent number: 5019835
    Abstract: An image forming apparatus comprises: an electroconductive substrate; an electroconductive member disposed opposite to the electroconductive substrate; a plate-forming unit for forming an insulating pattern on the electroconductive substrate; a supplier for providing a recording material between the electroconductive substrate and the electroconductive member, the recording material being capable of changing its adhesiveness corresponding to the polarity of a voltage applied thereto; and a voltage source for applying a voltage between the electroconductive substrate and the electroconductive member.
    Type: Grant
    Filed: October 3, 1989
    Date of Patent: May 28, 1991
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kohzoh Arahara, Kenichi Matsumoto, Hiroshi Fukumoto, Takashi Kai, Osamu Hoshino, Toshiya Yuasa, Noboru Tohyama, Motokazu Kobayashi
  • Patent number: 5014094
    Abstract: A color image forming apparatus that can detachably receive a plurality of process units into associated ones of a plurality of color image forming stations. Each of such detachable process units effects imaging in one of a plurality of different colors. The units are substantially identical in structure, configuration, and dimension, but differ with respect to indexing elements which allow each unit to be set only at its proper color image forming station in the image forming apparatus.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: May 7, 1991
    Assignee: Canon Kabushiki Kaisha
    Inventors: Joji Amitani, Osamu Hoshino
  • Patent number: 4972200
    Abstract: An image forming method and apparatus is disclosed an ink capable of changing its adhesiveness corresponding to the polarity of a voltage applied thereto is provided. The ink is used for image formation by means of an image-forming apparatus with at least a pair of electroconductive members. The residual ink left between the pair of electroconductive members is removed by; and applying a voltage to the residual ink so as to reduce the adhesiveness of the ink disposed on one of the pair of electroconductive members, thereby to remove the ink from the electroconductive member and transfer it to another electroconductive member.
    Type: Grant
    Filed: March 20, 1989
    Date of Patent: November 20, 1990
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kohzoh Arahara, Osamu Hoshino