Patents by Inventor Osamu Ibaragi

Osamu Ibaragi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical fiber sheet and its manufacturing method
    Patent number: 7680365
    Abstract: An optical fiber sheet comprises optical fibers sandwiched between sheet members and fixed thereto. Distal ends of the optical fibers extend from outer peripheral edges of the sheet members with resin coatings applied to the distal ends to produce extensions. The distal ends of the extensions are inserted into fiber holes of connectors with the resin coatings applied to the distal ends to be connected with the connectors.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: March 16, 2010
    Assignees: Sumitomo Electric Industries, Ltd., NEC Corporation, Hitachi Chemical Company, Ltd., Hirose Electric Company, Ltd.
    Inventors: Kazuhito Saito, Masaki Ohmura, Masao Kinoshita, Hiroshi Masuda, Shuji Suzuki, Osamu Ibaragi
  • Optical connection structure of optical backplane to circuit substrate
    Patent number: 7645075
    Abstract: An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: January 12, 2010
    Assignees: NEC Corporation, Hirose Electric Co., Ltd., Sumitomo Electric Induestries, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Junichi Sasaki, Kazuhiko Kurata, Shuji Suzuki, Kazuhito Saito, Hiroshi Masuda, Osamu Ibaragi, Masao Kinoshita
  • Optical connection structure of optical backplane to circuit substrate
    Publication number: 20070086723
    Abstract: An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 19, 2007
    Inventors: Junichi Sasaki, Kazuhiko Kurata, Shuji Suzuki, Kazuhito Saito, Hiroshi Masuda, Osamu Ibaragi, Masao Kinoshita
  • Optical fiber sheet and its manufacturing method
    Publication number: 20070003185
    Abstract: An optical fiber sheet comprises optical fibers sandwiched between sheet members and fixed thereto. Distal ends of the optical fibers extend from outer peripheral edges of the sheet members with resin coatings applied to the distal ends to produce extensions. The distal ends of the extensions are inserted into fiber holes of connectors with the resin coatings applied to the distal ends to be connected with the connectors.
    Type: Application
    Filed: May 17, 2006
    Publication date: January 4, 2007
    Inventors: Kazuhito Saito, Masaki Ohmura, Masao Kinoshita, Hiroshi Masuda, Shuji Suzuki, Osamu Ibaragi
  • Optical interconnection apparatus and interconnection module
    Patent number: 6912333
    Abstract: For example, a surface emitting semiconductor laser and a driver IC are arranged three-dimensionally to put a submounting substrate between them, and LSIs such as a CPU, etc. are mounted on the driver IC. The surface emitting semiconductor laser is formed of the epitaxial lift-off (ELO) process and has a thickness of about 10 ?m. A through hole is provided to all the submounting substrate, the surface emitting semiconductor laser, the driver IC, and the LSIs. These parts are connected electrically mutually via conductor in the through hole.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: June 28, 2005
    Assignee: Fujitsu Limited
    Inventors: Takashi Mikawa, Tetsuzo Yoshimura, Osamu Ibaragi
  • Optical interconnection apparatus and interconnection module
    Publication number: 20040033008
    Abstract: For example, a surface emitting semiconductor laser and a driver IC are arranged three-dimensionally to put a submounting substrate between them, and LSIs such as a CPU, etc. are mounted on the driver IC. The surface emitting semiconductor laser is formed of the epitaxial lift-off (ELO) process and has a thickness of about 10 &mgr;m. A through hole is provided to all the submounting substrate, the surface emitting semiconductor laser, the driver IC, and the LSIs. These parts are connected electrically mutually via conductor in the through hole.
    Type: Application
    Filed: June 20, 2003
    Publication date: February 19, 2004
    Applicant: Fujitsu Limited
    Inventors: Takashi Mikawa, Tetsuzo Yoshimura, Osamu Ibaragi