Patents by Inventor Osamu Igawa
Osamu Igawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10844917Abstract: A brake caliper according to this disclosure is, for example, equipped with: a body having a pair of side walls arranged with a gap therebetween, a peripheral wall running between the pair of side walls, wherein the pair of side walls and the peripheral wall enclose the peripheral edge portion of a disk rotor from the outside of the disk rotor in the radial direction; brake pads positioned between the side walls and the disk rotor; pistons that are supported by the side walls and that press the brake pads toward the side surfaces of the disk rotor by means of applied hydraulic pressure; and a shaft that supports the brake pads and passes through an opening provided in the side walls. The opening includes a retaining part that retains the shaft in the circumferential direction at two contact points separated from each other along the edge of the opening.Type: GrantFiled: May 24, 2017Date of Patent: November 24, 2020Assignee: ADVICS CO., LTD.Inventors: Osamu Igawa, Shinichi Morita
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Publication number: 20200132141Abstract: A brake caliper according to this disclosure is, for example, equipped with: a body having a pair of side walls arranged with a gap therebetween, a peripheral wall running between the pair of side walls, wherein the pair of side walls and the peripheral wall enclose the peripheral edge portion of a disk rotor from the outside of the disk rotor in the radial direction; brake pads positioned between the side walls and the disk rotor; pistons that are supported by the side walls and that press the brake pads toward the side surfaces of the disk rotor by means of applied hydraulic pressure; and a shaft that supports the brake pads and passes through an opening provided in the side walls. The opening includes a retaining part that retains the shaft in the circumferential direction at two contact points separated from each other along the edge of the opening.Type: ApplicationFiled: May 24, 2017Publication date: April 30, 2020Applicant: ADVICS CO., LTD.Inventors: Osamu IGAWA, Shinichi MORITA
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Patent number: 10415201Abstract: An opening/closing device according to the present invention includes a gate, a fall prevention unit, a support release unit, a first float, a floating prevention unit, a second float, and a floating prevention release unit. The gate receives a flow of fluid, and is able to fall down toward a downstream direction of the flow. The fall prevention unit supports the gate, thereby preventing the gate from falling down. The support release unit releases the support for the gate by the fall prevention unit. The first float is arranged on an upstream side of the gate, is arranged on one of the left side and the right side of the gate viewed from upstream, and is less in the specific gravity than the fluid. The floating prevention unit prevents the first float from floating.Type: GrantFiled: June 18, 2015Date of Patent: September 17, 2019Assignees: NIPPON KOEI CO., LTD., TOKYO METROPOLITAN SEWERAGE SERVICE CORPORATION, KANSEI COMPANYInventors: Motonobu Ito, Tamotsu Kikuchi, Takato Aoyama, Takaaki Odate, Kenji Hasegawa, Osamu Igawa
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Publication number: 20180135266Abstract: An opening/closing device according to the present invention includes a gate, a fall prevention unit, a support release unit, a first float, a floating prevention unit, a second float, and a floating prevention release unit. The gate receives a flow of fluid, and is able to fall down toward a downstream direction of the flow. The fall prevention unit supports the gate, thereby preventing the gate from falling down. The support release unit releases the support for the gate by the fall prevention unit. The first float is arranged on an upstream side of the gate, is arranged on one of the left side and the right side of the gate viewed from upstream, and is less in the specific gravity than the fluid. The floating prevention unit prevents the first float from floating.Type: ApplicationFiled: June 18, 2015Publication date: May 17, 2018Applicants: NIPPON KOEI CO., LTD., TOKYO METROPOLITAN SEWERAGE SERVICE CORPORATION, KANSEI COMPANYInventors: Motonobu ITO, Tamotsu KIKUCHI, Takato AOYAMA, Takaaki ODATE, Kenji HASEGAWA, Osamu IGAWA
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Patent number: 8513800Abstract: After a semiconductor chip is cut out, an In-10 atom % Ag pellet is placed on a metal film. Next, an epoxy sheet on a stiffener is stuck to a ceramic substrate. At this time, the In alloy pellet is sandwiched between a central protrusion portion and the metal film. Then, an In alloy film is formed from the In alloy pellet by heating, melting, and then cooling the In alloy pellet. As a result, the semiconductor chip and a heat spreader are bonded via the metal film and the In alloy film.Type: GrantFiled: July 31, 2007Date of Patent: August 20, 2013Assignee: Fujitsu Semiconductor LimitedInventors: Takaki Kurita, Osamu Igawa
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Patent number: 8421219Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.Type: GrantFiled: June 28, 2011Date of Patent: April 16, 2013Assignee: Fujitsu LimitedInventors: Tsuyoshi So, Hideo Kubo, Seiji Ueno, Osamu Igawa
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Publication number: 20110254149Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.Type: ApplicationFiled: June 28, 2011Publication date: October 20, 2011Applicant: FUJITSU LIMITEDInventors: Tsuyoshi So, Hideo Kubo, Seiji Ueno, Osamu Igawa
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Patent number: 7999374Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.Type: GrantFiled: September 22, 2009Date of Patent: August 16, 2011Assignee: Fujitsu LimitedInventors: Tsuyoshi So, Hideo Kubo, Seiji Ueno, Osamu Igawa
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Patent number: 7813133Abstract: A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.Type: GrantFiled: February 23, 2006Date of Patent: October 12, 2010Assignee: Fujitsu Semiconductor LimitedInventors: Makoto Iijima, Seiji Ueno, Osamu Igawa
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Publication number: 20100013089Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.Type: ApplicationFiled: September 22, 2009Publication date: January 21, 2010Applicant: FUJITSU LIMITEDInventors: Tsuyoshi So, Hideo Kubo, Seiji Ueno, Osamu Igawa
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Publication number: 20080067671Abstract: After a semiconductor chip is cut out, an In-10 atom % Ag pellet is placed on a metal film. Next, an epoxy sheet on a stiffener is stuck to a ceramic substrate. At this time, the In alloy pellet is sandwiched between a central protrusion portion and the metal film. Then, an In alloy film is formed from the In alloy pellet by heating, melting, and then cooling the In alloy pellet. As a result, the semiconductor chip and a heat spreader are bonded via the metal film and the In alloy film.Type: ApplicationFiled: July 31, 2007Publication date: March 20, 2008Applicant: FUJITSU LIMITEDInventors: Takaki Kurita, Osamu Igawa
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Publication number: 20070139892Abstract: A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.Type: ApplicationFiled: February 23, 2006Publication date: June 21, 2007Applicant: FUJITSU LIMITEDInventors: Makoto Iijima, Seiji Ueno, Osamu Igawa
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Patent number: 7064645Abstract: The present invention realizes a miniaturized electronic device that is still capable of maintaining its high reliability even when miniaturized. To this end, the electronic device has an electronic circuit, comprising: a substrate with a circuit formation surface on which one part of the electronic circuit is formed; a polyimide layer that is formed on the circuit formation surface; and a spiral inductor constituting another part of the electronic circuit, which is formed into a pattern on the polyimide layer.Type: GrantFiled: December 13, 2002Date of Patent: June 20, 2006Assignee: Fujitsu LimitedInventors: Kazuhiko Kobayashi, Hideharu Sakoda, Hirohisa Matsuki, Osamu Igawa, Mitsutaka Sato, Koju Aoki, Hiroyuki Sakima
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Patent number: 6836025Abstract: In a semiconductor device circuit formation surfaces of each of a plurality of semiconductor chips can be easily located at even level when the semiconductor chips are arranged side by side so that a process of forming rearrangement wiring is simplified. The semiconductor chips are mounted on a substrate via an adhesive layer in a two-dimensional arrangement. A resin layer is formed on the substrate and located around the semiconductor elements. The resin layer has the same thickness as a thickness of the semiconductor elements. An organic insulating layer is formed over a surface of the resin layer and circuit formation surfaces of the semiconductor elements. A rearrangement wiring layer is formed on the organic insulating layer and electrodes of the semiconductor chips. External connection terminals are electrically connected to the circuit formation surfaces of the semiconductor elements through wiring in the rearrangement wiring layer.Type: GrantFiled: May 30, 2003Date of Patent: December 28, 2004Assignee: Fujitsu LimitedInventors: Tetsuya Fujisawa, Hirohisa Matsuki, Osamu Igawa, Yoshitaka Aiba, Masamitsu Ikumo, Mitsutaka Sato
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Patent number: 6767219Abstract: A contactor has a contactor substrate and a plurality of contact electrodes formed on the contactor substrate. Each contact electrode is formed by a metal wire bent between one end joined to the contactor substrate and the other end. An inclined plane is formed by a cutting surface. A fracture surface formed by a tension fracture is formed at the apex portion of the contact electrode.Type: GrantFiled: November 13, 2002Date of Patent: July 27, 2004Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Naoyuki Watanabe, Kazuhiro Tashiro, Naohito Kohashi, Osamu Igawa, Tetsuya Fujisawa
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Publication number: 20030227095Abstract: In a semiconductor device circuit formation surfaces of each of a plurality of semiconductor chips can be easily located at even level when the semiconductor chips are arranged side by side so that a process of forming rearrangement wiring is simplified. The semiconductor chips are mounted on a substrate via an adhesive layer in a two-dimensional arrangement. A resin layer is formed on the substrate and located around the semiconductor elements. The resin layer has the same thickness as a thickness of the semiconductor elements. An organic insulating layer is formed over a surface of the resin layer and circuit formation surfaces of the semiconductor elements. A rearrangement wiring layer is formed on the organic insulating layer and electrodes of the semiconductor chips. External connection terminals are electrically connected to the circuit formation surfaces of the semiconductor elements through wiring in the rearrangement wiring layer.Type: ApplicationFiled: May 30, 2003Publication date: December 11, 2003Inventors: Tetsuya Fujisawa, Hirohisa Matsuki, Osamu Igawa, Yoshitaka Aiba, Masamitsu Ikumo, Mitsutaka Sato
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Publication number: 20030186566Abstract: A contactor has a contactor substrate and a plurality of contact electrodes formed on the contactor substrate. Each contact electrode is formed by a metal wire bent between one end joined to the contactor substrate and the other end. An inclined plane is formed by a cutting surface. A fracture surface formed by a tension fracture is formed at the apex portion of the contact electrode.Type: ApplicationFiled: November 13, 2002Publication date: October 2, 2003Applicant: FUJITSU LIMITEDInventors: Shigeyuki Maruyama, Naoyuki Watanabe, Kazuhiro Tashiro, Naohito Kohashi, Osamu Igawa, Tetsuya Fujisawa
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Publication number: 20030127704Abstract: The present invention realizes a miniaturized electronic device that is still capable of maintaining its high reliability even when miniaturized. To this end, the electronic device has an electronic circuit, comprising: a substrate with a circuit formation surface on which one part of the electronic circuit is formed; a polyimide layer that is formed on the circuit formation surface; and a spiral inductor constituting another part of the electronic circuit, which is formed into a pattern on the polyimide layer.Type: ApplicationFiled: December 13, 2002Publication date: July 10, 2003Inventors: Kazuhiko Kobayashi, Hideharu Sakoda, Hirohisa Matsuki, Osamu Igawa, Mitsutaka Sato, Koju Aoki, Hiroyuki Sakima
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Patent number: D815000Type: GrantFiled: January 30, 2017Date of Patent: April 10, 2018Assignee: ADVICS CO., LTD.Inventor: Osamu Igawa