Abstract: A power semiconductor module and a method of manufacture thereof includes lead a frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: A power semiconductor module and a method of manufacture thereof includes a lead frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: A power semiconductor module and a method of manufacture thereof includes lead a frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: A power semiconductor module and a method of manufacture thereof includes lead a frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: A unidirectionally visible printing member includes a light-transmitting base material, a pressure-sensitive adhesive layer having a re-releasable pressure-sensitive adhesive, formed on the base material, and a sheet member including an opaque layer and an image-forming layer and having through-cuts, formed on the pressure-sensitive adhesive layer. The sheet member, when peeled, is capable of remaining partly on the pressure-sensitive adhesive layer in conformity with the cuts, and the pressure-sensitive adhesive layer is capable of remaining on the base material and being uncovered at the part other than the part where the sheet member remains on the pressure-sensitive adhesive layer.

Abstract: A molten metal probe which is dipped into molten metal and thereafter pulled up therefrom and which is capable of preferably providing solidification temperature data of the molten metal and providing a solidified sample. A probe main body includes an introductory path facing a flow inlet formed at a side portion thereof, a communicating path and a sampling path branched respectively upwardly and downwardly from the introductory path, a temperature measuring chamber communicated with the communicating path extended upwardly, a sampling chamber communicated with the sampling path extended downwardly, and a temperature sensor facing the temperature measuring chamber.

Abstract: A heat-sensitive transferring recording medium comprises a base film, a heat melting ink layer provided on the under surface of the base film, and a conveyance improving layer provided on the upper surface of the base film, said conveyance improving layer comprising a material selected from the group consisting of compounds having a perfluoroalkyl group and ultraviolet ray-curing type resins.