Patents by Inventor Osamu Inoue

Osamu Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090115335
    Abstract: A plasma display panel of the present invention includes a display electrode (5) and an address electrode (10) that cross each other. At least one selected from the display electrode (5) and the address electrode (10) is covered with a first dielectric layer (6) containing first glass. The first glass contains Bi2O3, and the electrode that is covered with the first dielectric layer (6) contains at least one selected from the group consisting of silver and copper. The first glass further contains 0 to 4 wt % of MoO3 and 0 to 4 wt % of WO3, and the total of the contents of MoO3 and WO3 in the first glass is in a range of 0.1 to 8 wt %.
    Type: Application
    Filed: June 15, 2007
    Publication date: May 7, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Shinya Hasegawa, Osamu Inoue, Akira Kawase, Yasuhiko Nakada, Kazuhiro Yokota, Tsutomu Koshizuka, Seiji Toyoda
  • Publication number: 20090109563
    Abstract: A burst interval measuring apparatus includes: a detector that outputs detection signals that can to measure a burst interval of servo patterns for a tracking servo; and a measuring unit that measures the burst interval based on the detection signals. The detector is constructed so as to be capable of outputting the detection signals that can measure the burst interval at plural positions that are separated in a width direction of the magnetic tape inside one of the servo patterns. The measuring unit uses measurement values for the burst interval at at least two positions out of the plural positions that have been measured based on the detection signals to specify velocity fluctuations in a movement velocity of the magnetic tape in the length direction and corrects the measurement values based on the velocity fluctuations.
    Type: Application
    Filed: October 6, 2008
    Publication date: April 30, 2009
    Applicant: TDK CORPORATION
    Inventors: Takashi HANDA, Koji MATSUNO, Osamu INOUE, Keiji TESHIMA, Kazutaka FUJITA
  • Publication number: 20090102379
    Abstract: Disclosed is a glass composition composed of an oxide glass wherein the percentages of constitutional elements other than oxygen (O) expressed in atomic % are as follows: boron (B) is not less than 56% and not more than 72%; silicon (Si) is not less than 0% and not more than 15%; Zinc (Zn) is not less than 0% and not more than 18%; potassium (K) is not less than 8% and not more than 20%; and the total of K, sodium (Na) and lithium (Li) is not less than 12% and not more than 20%. This glass composition further may contain at least one of magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba) in an amount of more than 0% and not more than 5%, and molybdenum (Mo) and/or tungsten (W) in an amount of more than 0% and not more than 3%.
    Type: Application
    Filed: September 1, 2006
    Publication date: April 23, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Osamu Inoue, Shinya Hasegawa, Miyuki Nakai, Tsutomu Koshizuka
  • Patent number: 7459786
    Abstract: A reliable semiconductor device having a multilayer wiring structure formed of copper as a main component material, which constrains occurrence of voids caused by stress migration. In the multilayer wiring structure, a first insulation layer having a high barrier property and a compression stress, and making contact with the upper surface of a first wiring made of copper as a main component material, a second insulation film having a tensile stress, and a third insulation film having a dielectric constant which is lower than those of the first and second insulation film, are laminated one upon another in the mentioned order as viewed the bottom thereof, and a via hole is formed piercing through the first insulation film, the second insulation film and the third insulation film, making contact with the first wiring.
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: December 2, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Hiromi Shimazu, Tomio Iwasaki, Hiroyuki Ohta, Kensuke Ishikawa, Osamu Inoue, Takayuki Oshima
  • Publication number: 20080241600
    Abstract: The present invention provides a magnetic recording medium wherein a fine non-magnetic inorganic powder, the dispersibility of which is improved, is used to improve the surface smoothness of a lower non-magnetic layer, thereby giving an excellent surface smoothness of an upper magnetic layer and electromagnetic conversion property; and a production process thereof. A magnetic recording medium comprising at least a non-magnetic support, a lower non-magnetic layer on one surface of the non-magnetic support, and an upper magnetic layer on the lower non-magnetic layer, wherein the upper magnetic layer contains at least a ferromagnetic powder, and a binder resin material, and the lower non-magnetic layer contains at least carbon black, iron oxide, and a binder resin material, and the iron oxide has an average major axis length of 30 to 100 nm, and a specific surface area based on the BET method of 80 to 120 m2/g, and the iron oxide contains moisture in an amount per unit specific surface area of 0.13 to 0.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: TDK Corporation
    Inventors: Hiroyuki Tanaka, Tsutomu Ide, Osamu Inoue
  • Publication number: 20080241602
    Abstract: The present invention provides a magnetic recording medium wherein both of a reduction in the particle diameter of a ferromagnetic powder and an increase in the filling ratio of the powder in a magnetic layer are attained and the magnetic layer is excellent in surface smoothness and electromagnetic conversion property.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: TDK Corporation
    Inventors: Hiroyuki TANAKA, Tsutomu IDE, Osamu INOUE
  • Publication number: 20080239565
    Abstract: A servo pattern recording device capable of improving the recording accuracy of a servo pattern. The servo pattern recording device is comprised of a magnetic head that records a servo pattern for tracking servo on a magnetic tape, a first motor that feeds the magnetic tape, a second motor that takes up the magnetic tape, and a main panel along a surface of which the magnetic tape is caused to move. The first motor and the second motor are mounted on the main panel, and the magnetic head is mounted on a first sub panel that is formed separately from the main panel and is connected to the main panel via a connecting member.
    Type: Application
    Filed: March 21, 2008
    Publication date: October 2, 2008
    Applicant: TDK CORPORATION
    Inventors: Osamu INOUE, Keiji TESHIMA, Koji MATSUNO, Takashi HANDA, Kazutaka FUJITA
  • Patent number: 7326309
    Abstract: This invention provides a method of producing a ceramic laminate body capable of suppressing the occurrence of de-lamination and cracks, and providing high reliability. This method comprises a heat-bonding step of covering a full periphery of side surfaces of ceramic layers 11 positioned in an orthogonal direction to a laminating direction with a side surface jig while the ceramic layers are laminated, heating the ceramic layers and pressing the ceramic layers from both end faces positioned in the laminating direction by end face jigs to form a heat-bonded ceramic laminate body; and a side surface grinding step of grinding or cutting the full periphery of the side surfaces inclusive of damage portions 9 occurring in the ceramic laminate body in the heat-bonding step.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: February 5, 2008
    Assignee: Denso Corporation
    Inventors: Kazuhide Sato, Hidekazu Hattori, Toshiaki Kamiya, Osamu Inoue
  • Publication number: 20080018252
    Abstract: A glass composition of the present invention is oxide glass and has a composition that satisfies: 60 wt %<B2O3<78 wt %, 15 wt %<ZnO?24 wt %, 6 wt %?R2O?16 wt %, 1 wt %?MO<17 wt %, and 0 wt %?SiO2?10 wt %, where R denotes at least one selected from Li, Na, and K, and M indicates at least one selected from Mg, Ca, Sr, and Ba. A display panel of the present invention is formed using such a glass composition of the present invention.
    Type: Application
    Filed: September 20, 2007
    Publication date: January 24, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Osamu INOUE, Shinya Hasegawa, Yasuhiko Nakada, Tsutomu Koshizuka
  • Patent number: 7219416
    Abstract: The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 ?·cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: May 22, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Osamu Inoue, Junichi Kato, Nobuya Matsutani, Hiroshi Fujii, Takeshi Takahashi
  • Patent number: 7208430
    Abstract: A glass composition for covering electrodes of the present invention contains: 0 to 15 wt % SiO2; 10 to 50 wt % B2O3; 15 to 50 wt % ZnO; 0 to 10 wt % Al2O3; 2 to 40 wt % Bi2O3; 0 to 5 wt % MgO; 5 to 38 wt % CaO+SrO+BaO; 0 to 0.1 wt % Li2O+Na2O+K2O; 0 to 4 wt % MoO3; and 0 to 4 wt % WO3, and the total of the contents of MoO3 and WO3 is in the range of 0.1 to 8 wt %. The glass composition for covering electrodes of the present invention may contain: 0 to 2 wt % SiO2; 10 to 50 wt % B2O3; 15 to 50 wt % ZnO; 0 to 10 wt % Al2O3; 2 to 40 wt % Bi2O3; 0 to 5 wt % MgO; 5 to 38 wt % CaO+SrO+BaO; 0 to 4 wt % MoO3; and 0 to 4 wt % WO3, and the total of the contents of MoO3 and WO3 may be in the range of 0.1 to 8 wt %.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: April 24, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shinya Hasegawa, Osamu Inoue, Seiji Toyoda
  • Publication number: 20070052361
    Abstract: A plasma display panel of the present invention includes display electrodes and address electrodes that cross each other. The electrode to be covered with the first dielectric layer contains at least one selected from silver and copper. The first glass contains Bi2O3. The first glass further contains 0 to 4 wt % of MoO3 and 0 to 4 wt % of WO3, and the total of the contents of MoO3 and WO3 that are contained in the first glass is in a range of 0.1 to 8 wt %. The first glass may contain, as components thereof: 0 to 15 wt % SiO2; 10 to 50 wt % B2O3; 15 to 50 wt % ZnO; 0 to 10 wt % Al2O3; 2 to 40 wt % Bi2O3; 0 to 5 wt % MgO; 5 to 38 wt % CaO+SrO+BaO; 0 to 4 wt % MoO3; and 0 to 4 wt % WO3, and the total of the contents of MoO3 and WO3 that are contained in the first glass is in the range of 0.1 to 8 wt %.
    Type: Application
    Filed: November 1, 2006
    Publication date: March 8, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Shinya Hasegawa, Osamu Inoue, Seiji Toyoda, Akira Kawase, Yasuhiko Nakada, Kazuhiro Yokota, Tsutomu Koshizuka
  • Publication number: 20070035013
    Abstract: In a module including circuit elements, a plurality of wires, which are generally two-dimensionally formed, are multi-layered via electrically insulating material, which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module further includes a heat sink member that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element, which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.
    Type: Application
    Filed: May 7, 2004
    Publication date: February 15, 2007
    Inventors: Hiroyuki Handa, Seiichi Nakatani, Koichi Hirano, Osamu Inoue, Akihiro Ishikawa, Tsunenori Yoshida
  • Publication number: 20060276322
    Abstract: A glass composition for covering electrodes of the present invention contains: 0 to 15 wt % SiO2; 10 to 50 wt % B2O3; 15 to 50 wt % ZnO; 0 to 10 wt % Al2O3; 2 to 40 wt % Bi2O3; 0 to 5 wt % MgO; 5 to 38 wt % CaO+SrO+BaO; 0 to 0.1 wt % Li2O+Na2O+K2O; 0 to 4 wt % MoO3; and 0 to 4 wt % WO3, and the total of the contents of MoO3 and WO3 is in the range of 0.1 to 8 wt %. The glass composition for covering electrodes of the present invention may contain: 0 to 2 wt % SiO2; 10 to 50 wt % B2O3; 15 to 50 wt % ZnO; 0 to 10 wt % Al2O3; 2 to 40 wt % Bi2O3; 0 to 5 wt % MgO; 5 to 38 wt % CaO+SrO+BaO; 0 to 4 wt % MoO3; and 0 to 4 wt % WO3, and the total of the contents of MoO3 and WO3 may be in the range of 0.1 to 8 wt %.
    Type: Application
    Filed: August 16, 2006
    Publication date: December 7, 2006
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Shinya HASEGAWA, Osamu INOUE, Seiji TOYODA
  • Patent number: 7056853
    Abstract: An oxide ceramic material is provided to contain aluminum oxide as a principal component, and at least one selected from A and B shown below as an auxiliary component: A: niobium oxide and copper oxide B: copper oxide, titanium oxide, and silver oxide. With this, it is possible to provide an oxide ceramic material having sinterability at a low temperature and a high heat conductivity, as well as a ceramic substrate, a ceramic laminate device, and a power amplifier module employing the same.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: June 6, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Osamu Inoue, Kenji Harada, Kojiro Okuyama
  • Publication number: 20060006543
    Abstract: A reliable semiconductor device having a multilayer wiring structure formed of copper as a main component material, which constrains occurrence of voids caused by stress migration. In the multilayer wiring structure, a first insulation layer having a high barrier property and a compression stress, and making contact with the upper surface of a first wiring made of copper as a main component material, a second insulation film having a tensile stress, and a third insulation film having a dielectric constant which is lower than those of the first and second insulation film, are laminated one upon another in the mentioned order as viewed the bottom thereof, and a via hole is formed piercing thorough the first insulation film, the second insulation film and the third insulation film, making contact with the first wiring.
    Type: Application
    Filed: June 17, 2005
    Publication date: January 12, 2006
    Applicant: Hitachi, Ltd.
    Inventors: Hiromi Shimazu, Tomio Iwasaki, Hiroyuki Ohta, Kensuke Ishikawa, Osamu Inoue, Takayuki Oshima
  • Patent number: 6893801
    Abstract: On the occasion of the aligning process to transfer a predetermined pattern to a semiconductor wafer by irradiating a photoresist on the semiconductor wafer with an aligning laser beam of the modified lighting via a photomask MK, the photomask MK allocating, to provide periodicity, the main apertures to transfer the predetermined pattern as the apertures formed by removing a part of the half-tone film on the mask substrate and the auxiliary apertures not resolved on the semiconductor wafer as the apertures formed by removing a part of the half-tone film is used to improve the resolution of the pattern.
    Type: Grant
    Filed: January 9, 2004
    Date of Patent: May 17, 2005
    Assignee: Renesas Technology Corp.
    Inventors: Osamu Inoue, Norio Hasegawa, Shuji Ikeda
  • Patent number: 6888435
    Abstract: The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 ?·cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: May 3, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Osamu Inoue, Junichi Kato, Nobuya Matsutani, Hiroshi Fujii, Takeshi Takahashi
  • Patent number: 6852404
    Abstract: The average major-axis length (L) of a ferromagnetic alloy powder primarily contained together with a binder in a magnetic layer provided on at least one surface of a non-magnetic support is less than 0.10 ?m, and the ferromagnetic alloy powder contains Co at a content of 15 to 28 at % relative to Fe, and furthermore, contains Y at a content of 22 ?mol/m2 or more with respect to a specific surface area (Sc) calculated from the above-mentioned average major-axis length (L) and the crystallite diameter (d). A coating-type high-recording-density magnetic recording medium has excellent surface properties, an excellent electromagnetic transducing characteristic especially in short wavelength regions and high reliability.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: February 8, 2005
    Assignee: TDK Corporation
    Inventors: Takayoshi Kuwajima, Osamu Inoue, Akimasa Kaizu
  • Publication number: 20040207954
    Abstract: The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 &OHgr;·cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.
    Type: Application
    Filed: May 11, 2004
    Publication date: October 21, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Osamu Inoue, Junichi Kato, Nobuya Matsutani, Hiroshi Fujii, Takeshi Takahashi