Abstract: A polypropylene-based composite resin composition in which: (1) a complex viscosity ?* at 190° C. and an angular frequency (?) of 0.1 rad/s is 2000 Pa·s or more, (2) shear storage moduli G?100, G?10, G?0.1, and G?0.01 at 190° C. and angular frequencies (?) of 100, 10, 0.1 and 0.01 rad/s satisfy an equation (I) and an equation (II): log(G?100)?log(G?10)?0.6??(I) log(G?0.1)?log(G?0.01)?0.4??(II) and (3) a shear storage modulus G?0.0251 at 190° C. and an angular frequency of 0.0251 rad/s is 60 Pa or more. The polypropylene-based composite resin composition reveals less liability to cause failures such as short shot, burrs, surface formation failure, deformation and stringing even when a molding cycle in injection molding is shortened.

Abstract: A multilayer printed wiring board which comprises B layer laminated on one or both faces of A layer, wherein A layer is a layer constituted with one or more layers which comprise a resin composition comprising at least one resin selected from epoxy resins, phenolic resins, unsaturated polyester resins and polyimide resins of a bismaleimide type and B layer is a layer constituted with one or more layers which comprise a resin composition comprising 40% by weight or more of a styrenic resin having a syndiotactic configuration.

Abstract: Provided by the present invention is a mold release film for sealing a semiconductor element, which does not deform or cause deformation of the terminals of the semiconductor and which has good releasability during the semiconductor element sealing process, and a sealing method for a semiconductor element using the mold release film, which can improve efficiency of manufacturing a semiconductor.

Abstract: Disclosed is a polyolefin resin composition which comprises 35 to 98% by weight of a polyolefin resin, 1 to 50% by weight of a muscovite and 1 to 50% by weight of titanium oxide. Also disclosed is another polyolefin resin composition which comprises further 0.5 to 40 parts by weight of a talc per 100 parts by weight of the resin composition defined above.The polyolefin resin composition according to the present invention has excellent light-shielding properties, small specific gravity which contributes to lightening the weight, excellent shock resistance and stiffness balance as well as moldability when manufacturing articles such as electric parts and automobile parts.

Abstract: Flame retarded resin compositions are formed of specified quantities of polypropylene, polyethylene, inorganic filler and flame retarder such as an organic halide.

Abstract: Pencils not requiring sharpening are produced by wrapping a thermoplastic resin sheet, which has been uniaxially stretched, around a core material so that a stretched direction of the sheet forms a spiral against the core material, whereby the sheet forms a holder for the pencil which may be stripped off to selectively expose the core material.