Abstract: There is provided a method for efficiently manufacturing metal nano particles without condensing laser beams by using a lens etc. In this method, first, metallic foil pieces, which are a starting material, are dispersed in a dispersion liquid. Next, laser beams are irradiated directly to the metallic foil pieces without providing a condensing means, by which many metal fine particles are yielded. The particle diameters of the metal fine particles obtained can be controlled to sizes from nano particles to submicron particles by utilizing the relationship between the shape (especially thickness) of the metallic foil piece which is a starting material and the absorbed energy of the laser beam.

Abstract: The present invention provides a nanowire production method that is simpler than conventional nanowire production methods, and that makes it easier to control the size and shape of the nanowires by using a technique completely different from the conventional ones. A powder particle containing a metal element is divided into nanometer-size wires containing the metal element by irradiating a suspension of the powder particles with a femtosecond laser. The present invention also makes it possible to divide the nanometer-size wires thus formed into nanometer-size particles containing the metal element by irradiating further the nanometer-size wires with the femtosecond laser.

Abstract: The present invention provides a nanowire production method that is simpler than conventional nanowire production methods, and that makes it easier to control the size and shape of the nanowires by using a technique completely different from the conventional ones. A powder particle containing a metal element is divided into nanometer-size wires containing the metal element by irradiating a suspension of the powder particles with a femtosecond laser. The present invention also makes it possible to divide the nanometer-size wires thus formed into nanometer-size particles containing the metal element by irradiating further the nanometer-size wires with the femtosecond laser.

Abstract: There is provided a method for efficiently manufacturing metal nano particles without condensing laser beams by using a lens etc. In this method, first, metallic foil pieces, which are a starting material, are dispersed in a dispersion liquid. Next, laser beams are irradiated directly to the metallic foil pieces without providing a condensing means, by which many metal fine particles are yielded. The particle diameters of the metal fine particles obtained can be controlled to sizes from nano particles to submicron particles by utilizing the relationship between the shape (especially thickness) of the metallic foil piece which is a starting material and the absorbed energy of the laser beam.

Abstract: The invention provides a process for producing vanadium alloy foil suitable as a membrane in a hydrogen-refining unit. A vanadium alloy comprising 5 to 25% by weight of at least one selected from the group consisting of Ni, Co, Mo, Fe and Ag, 0.01 to 5% by weight of at least one selected from the group consisting of Ti, Zr and Y, and the balance being V is used. A melt of the vanadium alloy is prepared by use of a crucible 1 having slit 3 in the bottom, a roll 2 comprising a cylinder whose central axis is arranged to be parallel to the slit is rotated, the melt is jetted from the slit 3 to the roll surface 5, the melt is jetted from the slit 3 is rapidly cooled, and the vanadium alloy solidified on the roll surface 5 is continuously exfolitated from the roll surface 5 to obtain the foil.

Abstract: The invention provides a process for producing vanadium alloy foil suitable as a membrane in a hydrogen-refining unit.

Abstract: A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.