Patents by Inventor Osamu Kakutani
Osamu Kakutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105672Abstract: A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the capillary. The controller positions the capillary with respect to the workpiece based on the first image, and calculates a positioning correction amount of the capillary based on the second image.Type: ApplicationFiled: July 6, 2021Publication date: March 28, 2024Applicant: SHINKAWA LTD.Inventors: Shigeru HAYATA, Osamu KAKUTANI
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Publication number: 20240105673Abstract: A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.Type: ApplicationFiled: August 26, 2021Publication date: March 28, 2024Applicant: SHINKAWA LTD.Inventors: Toru MAEDA, Osamu KAKUTANI
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Publication number: 20230125756Abstract: A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.Type: ApplicationFiled: February 22, 2021Publication date: April 27, 2023Applicant: SHINKAWA LTD.Inventors: Osamu KAKUTANI, Shigeru HAYATA
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Patent number: 10700585Abstract: The linear motor includes a stator and a mover. The stator includes: a board part having a rectangular plate shape, a plurality of magnetic pole teeth which are juxtaposing to each other on the board part and around each of which a coil is wound, and an auxiliary tooth which is arranged in an end part of the board part in a juxtaposed direction in a manner of being separate from the magnetic pole teeth and around which a coil is not wound. The mover includes: a plurality of magnets whose tip surfaces face the stator, and a back yoke having a rectangular plate shape in which the plurality of magnets are aligned in a straight line such that magnetic poles are alternately formed.Type: GrantFiled: March 30, 2016Date of Patent: June 30, 2020Assignee: Hitachi Metals, Ltd.Inventors: Seiki Takedomi, Osamu Kakutani, Yoshitaka Takagi
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Patent number: 10388555Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.Type: GrantFiled: August 26, 2016Date of Patent: August 20, 2019Assignee: SHINKAWA LTD.Inventors: Osamu Kakutani, Taito Kobayashi, Yasushi Sato
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Patent number: 10361166Abstract: Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.Type: GrantFiled: September 1, 2016Date of Patent: July 23, 2019Assignee: SHINKAWA LTD.Inventors: Osamu Kakutani, Hidehiro Tazawa, Masahito Tuji
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Patent number: 10350692Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.Type: GrantFiled: January 15, 2015Date of Patent: July 16, 2019Assignee: SHINKAWA LTD.Inventors: Kohei Seyama, Yasuhiro Chida, Osamu Kakutani
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Publication number: 20180069464Abstract: The linear motor includes a stator and a mover. The stator includes: a board part having a rectangular plate shape, a plurality of magnetic pole teeth which are juxtaposing to each other on the board part and around each of which a coil is wound, and an auxiliary tooth which is arranged in an end part of the board part in a juxtaposed direction in a manner of being separate from the magnetic pole teeth and around which a coil is not wound. The mover includes: a plurality of magnets whose tip surfaces face the stator, and a back yoke having a rectangular plate shape in which the plurality of magnets are aligned in a straight line such that magnetic poles are alternately formed.Type: ApplicationFiled: March 30, 2016Publication date: March 8, 2018Inventors: Seiki Takedomi, Osamu Kakutani, Yoshitaka Takagi
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Publication number: 20170053889Abstract: Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.Type: ApplicationFiled: September 1, 2016Publication date: February 23, 2017Applicant: SHINKAWA LTD.Inventors: OSAMU KAKUTANI, HIDEHIRO TAZAWA, MASAHITO TUJI
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Patent number: 9576927Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.Type: GrantFiled: June 5, 2015Date of Patent: February 21, 2017Assignee: SHINKAWA LTD.Inventors: Osamu Kakutani, Takatoshi Kawamura, Kohei Seyama, Akira Sato
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Publication number: 20160365267Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.Type: ApplicationFiled: August 26, 2016Publication date: December 15, 2016Applicant: SHINKAWA LTD.Inventors: OSAMU KAKUTANI, TAITO KOBAYASHI, YASUSHI SATO
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Publication number: 20150333032Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.Type: ApplicationFiled: June 5, 2015Publication date: November 19, 2015Inventors: OSAMU KAKUTANI, TAKATOSHI KAWAMURA, KOHEI SEYAMA, AKIRA SATO
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Publication number: 20150183040Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.Type: ApplicationFiled: January 15, 2015Publication date: July 2, 2015Applicant: SHINKAWA LTD.Inventors: Kohei SEYAMA, Yasuhiro CHIDA, Osamu KAKUTANI
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Patent number: 8511534Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: GrantFiled: September 23, 2011Date of Patent: August 20, 2013Assignee: Kabushiki Kaisha ShinkawaInventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
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Patent number: 8434656Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: GrantFiled: September 23, 2011Date of Patent: May 7, 2013Assignee: Kabushiki Kaisha ShinkawaInventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
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Patent number: 8152043Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: GrantFiled: September 23, 2011Date of Patent: April 10, 2012Assignee: Kabushiki Kaisha ShinkawaInventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
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Publication number: 20120018490Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: ApplicationFiled: September 23, 2011Publication date: January 26, 2012Applicant: SHINKAWA LTD.Inventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
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Publication number: 20120018489Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: ApplicationFiled: September 23, 2011Publication date: January 26, 2012Applicant: SHINKAWA LTD.Inventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
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Publication number: 20120018491Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: ApplicationFiled: September 23, 2011Publication date: January 26, 2012Applicant: SHINKAWA LTD.Inventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
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Patent number: 8052026Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: GrantFiled: October 6, 2006Date of Patent: November 8, 2011Assignee: Kabushiki Kaisha ShinkawaInventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama