Abstract: A mobile device that makes it possible to prevent a person other than a user from being aware of information relating to a predetermined communication while also enabling the user to immediately be aware of the information relating to the predetermined communication. The mobile device includes a status determining section (41) for determining, in a case where a communication is received, whether or not the mobile device is being left unattended; and an output control section (42) for outputting predetermined received communication information in a case where the mobile device is not being left unattended, the output control section (42) skipping output of the predetermined received communication information in a case where the mobile device is being left unattended.

Abstract: A storage control device includes a first memory, a second memory, and a processor. The processor is configured to store a reference count of each of a plurality of first and second unit data. The processor is configured to arrange first entries of first management information in a first memory area on the first memory. The first entries each include a hash value and information indicating where corresponding one of the first unit data is stored. The processor is configured to arrange second entries of second management information in a second memory area on the second memory. The second entries each include a hash value, information indicating where corresponding one of the second unit data is stored, and the reference count. The processor is configured to arrange, in a third memory area on the first memory, index information for filtering hash values included in the second entries.

Abstract: An information processing method that is executed by an information processing device which communicates with a plurality of data centers through a network, the information processing method includes transmitting a first request to each of the plurality of data centers, receiving a first response to the first request, from each of the plurality of data centers, acquiring latency in communication through the network, for each of the plurality of data centers, based on time from transmission of the first request to reception of the first response, selecting a first data center from among the plurality of data centers, based on the latency of each of the plurality of data centers, and transmitting a second request for providing a replica of data addressed to the first data center, to a second data center among the plurality of data centers, the second data center storing data regarding the information processing device.

Abstract: A control device includes a processor. The processor is configured to receive a write request to write content data. The processor is configured to divide the content data into leading first data and subsequent second data. The processor is configured to write the first data to a first storage resource in a first storage group among a plurality of storage groups having operating rates different from each other. The first storage group has a first operating rate higher than operating rates of any other storage groups. The processor is configured to write the second data to a second storage resource in a second storage group. The second storage group has a second operating rate lower than the first operating rate. The processor is configured to activate, in parallel with the writing of the first data, the second storage resource when the second storage resource is in a non-operating state.

Abstract: A wire harness to be installed in a vehicle includes an electric wire and a protective tube that protects the electric wire. The electric wire is provided at the lower part of a vehicle body of the vehicle and the protective tube covers the electric wire and includes ferromagnetic materials.

Abstract: A power supply apparatus includes a primary-side circuit and a secondary-side circuit magnetically coupled by a transformer. The secondary-side circuit includes: a first circuit that is connected to a secondary winding of the transformer, performs current doubler rectification, and outputs a first output voltage; a second circuit that is connected to the secondary winding of the transformer, performs a step-down chopping operation, and outputs a second output voltage; semiconductor switching elements that control the step-down chopping operation; and diodes that are shared by the first circuit and the second circuit when rectifying a direct current voltage supplied from the primary-side circuit. The first circuit includes first inductors connected in parallel. A control unit controls switching of the primary-side circuit to establish electrical continuity between the secondary winding of the transformer and the first inductors in order.

Abstract: An inrush current suppression circuit suppresses an inrush current to flow through a load including an input capacitor connected to a power source and a pair of output terminals which are parallel-connected to the input capacitor and output an input current. The inrush current suppression circuit includes a switching element connected to the power source; at least one of a first inductor connected between the switching element and a connection point of connecting one of the pair of output terminals and one electrode of the input capacitor and a second inductor connected between an anode of the diode and a connection point of connecting the other electrode of the input capacitor and the other of the pair of output terminals; and a diode whose cathode is connected to a connection point of connecting the switching element and the first inductor.

Abstract: An inrush current inhibiting circuit is to inhibit an inrush current flowing to a load which includes an input capacitor and a pair of output terminals. The inrush current inhibiting circuit is provided with a switching element connected to the power source and on-off controlled, a first inductor connected between the switching element and a connecting point between the one output terminal and one electrode of the input capacitor, a diode whose cathode is connected to a connecting point between the switching element and the first inductor, a second inductor connected between an anode of the diode and a connecting point between the other electrode of the input capacitor and the other output terminal, and a control part for controlling the switching element.

Abstract: A current command value in a period from a time when a relay switch is turned on until charging of an inverter capacitor is completed is set to a value smaller than a value corresponding to the smallest one of rated currents of components included in a circuit, and is set to a value smaller than a maximum current value in a safe operating area of a switching element.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A disk array apparatus has a plurality of the same type of disk array units. Each of the disk array units has a plurality of storage areas in each of which firmware for allowing the disk array unit to operate is stored. When the disk array apparatus recognizes that a first disk array unit has been disposed therein, it compares a version number of firmware stored in each storage area included in the first disk array unit with a version number of firmware stored in each storage area included in a second disk array unit that currently operates in the disk array apparatus. If these version numbers are the same, the disk array apparatus makes a storage area in which firmware executed by the first disk array unit is stored conform to a storage area in which firmware executed by the second disk array unit is stored.

Abstract: A process for producing a vinyl-cis-polybutadiene rubber, including mixing (A) vinyl-cis-polybutadiene obtained by (1) a step of adding a cis-1,4-polymerization catalyst obtainable from an organoaluminum compound and a soluble cobalt compound to a mixture containing 1,3-butadiene and a hydrocarbon-based organic solvent as the major components and having an adjusted water content, thereby subjecting the 1,3-butadiene to cis-1,4-polymerization and subsequently, (2) a step of making a catalyst obtainable from a soluble cobalt compound, an organoaluminum compound represented by the general formula, AlR3 (wherein R represents an alkyl group having from 1 to 6 carbon atoms, a phenyl group, or a cycloalkyl group), and carbon disulfide present in the resulting polymerization reaction mixture, thereby subjecting the 1,3-butadiene to 1,2-polymerization; and (B) cis-polybutadiene obtained by a step of adding the foregoing cis-1,4-polymerization catalyst, thereby subjecting the 1,3-butadiene to cis-1,4-polymerization and

Abstract: A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask.

Abstract: In a transmission type screen and other optical devices formed by combining optical sheets such as a Fresnel lens sheet and a lenticular lens sheet, the generation of stray light and defective appearance caused by a friction-reducing agent are prevented. In the optical devices such as a transmission type screen 3 formed by combining a plurality of optical sheets such as a Fresnel lens sheet 1 and a lenticular lens sheet 2, a friction-reducing agent 20 is provided on a surface of at least one of the optical sheets at a thickness of 0.3 nm or more to 10 nm or less. A coating applicator 30 for the friction-reducing agent 20 includes: a transfer roller 31; coating liquid-supplying means 32 for supplying the coating liquid 20 to the transfer roller 31; and scraping means 35 for adjusting the thickness of the coating liquid 20 adhering to the transfer roller 31. In the coating liquid 30, the surface roughness Ra (JIS B 0601-1982) of the transfer roller 31 is set to 0.01 to 1 ?m.

Abstract: A storage control apparatus that stores backup target in a predetermined storage area of a storage apparatus includes a determination unit for determining whether or not the backup target data has been modified, and a backup processing unit for performing the backup processing for the backup target data when the determination unit determines that the backup target data has been modified.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.