Patents by Inventor Osamu Kitamura

Osamu Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9333693
    Abstract: An aliphatic polyester film is obtained by melt-extruding an aliphatic polyester as a film, controlling the entrained air stream between a casting drum and the film while inhibiting the variations of the film edge portion landing points on the casting drum, and subsequently bringing the film into contact with the casting drum over the entire width of the film.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: May 10, 2016
    Assignee: Toray Industries, Inc.
    Inventors: Hideyuki Yamauchi, Junichi Masuda, Yoshikazu Endo, Osamu Kitamura
  • Publication number: 20120086155
    Abstract: An aliphatic polyester film is obtained by melt-extruding an aliphatic polyester as a film, controlling the entrained air stream between a casting drum and the film while inhibiting the variations of the film edge portion landing points on the casting drum, and subsequently bringing the film into contact with the casting drum over the entire width of the film.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 12, 2012
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Hideyuki Yamauchi, Junichi Masuda, Yoshikazu Endo, Osamu Kitamura
  • Patent number: 7885752
    Abstract: A control system for an internal combustion engine in which fuel containing alcohol is used. In the control system, a maximum opening of a throttle valve of the engine is set, and a target opening of the throttle valve is set to a value which is equal to or less than the maximum opening. An opening of the throttle valve is controlled so as to coincide with the target opening. The maximum opening is according to a concentration parameter indicative of a concentration of alcohol in the fuel, a temperature parameter indicative of a temperature of the engine, and a number of ignitions performed after start of the engine.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: February 8, 2011
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kazunori Kawamura, Futoshi Nishioka, Osamu Kitamura
  • Patent number: 7725245
    Abstract: A throttle valve control system for an internal combustion engine which controls an opening of a throttle valve of the engine so that the opening coincides with a target opening. A regulation value of a change amount of the throttle valve opening is set according to at least a temperature parameter indicative of a temperature of the engine. The target opening is set within a range defined by the regulation value. An upper limit value and a lower limit value of the regulation value is set according to the temperature parameter, and a transition control is performed wherein the regulation value is set according to an elapsed time period after start of the engine so as to change from the lower limit value to the upper limit value.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: May 25, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kazunori Kawamura, Futoshi Nishioka, Osamu Kitamura
  • Publication number: 20090112448
    Abstract: A throttle valve control system for an internal combustion engine which controls an opening of a throttle valve of the engine so that the opening coincides with a target opening. A regulation value of a change amount of the throttle valve opening is set according to at least a temperature parameter indicative of a temperature of the engine. The target opening is set within a range defined by the regulation value. An upper limit value and a lower limit value of the regulation value is set according to the temperature parameter, and a transition control is performed wherein the regulation value is set according to an elapsed time period after start of the engine so as to change from the lower limit value to the upper limit value.
    Type: Application
    Filed: October 22, 2008
    Publication date: April 30, 2009
    Inventors: Kazunori Kawamura, Futoshi Nishioka, Osamu Kitamura
  • Publication number: 20090112443
    Abstract: A control system for an internal combustion engine in which fuel containing alcohol is used. In the control system, a maximum opening of a throttle valve of the engine is set, and a target opening of the throttle valve is set to a value which is equal to or less than the maximum opening. An opening of the throttle valve is controlled so as to coincide with the target opening. The maximum opening is according to a concentration parameter indicative of a concentration of alcohol in the fuel, a temperature parameter indicative of a temperature of the engine, and a number of ignitions performed after start of the engine.
    Type: Application
    Filed: October 22, 2008
    Publication date: April 30, 2009
    Inventors: Kazunori Kawamura, Futoshi Nishioka, Osamu Kitamura
  • Publication number: 20030219615
    Abstract: Disclosed is a packing material for a sheet recording material, which contains a paper material comprising an alkyl ketene dimer and cationic starch, the extraction pH of the paper material being within the range of 6.5 to 9.0. The packing material of the present invention suppresses generation of paper dust and prevents occurrence of white spot defect in recorded images on a sheet recording material even when the packing material is not subjected to surface treatment.
    Type: Application
    Filed: March 31, 2003
    Publication date: November 27, 2003
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Yasushi Kikuchi, Osamu Kitamura
  • Patent number: 6574954
    Abstract: The invention provides an electronic control unit for controlling an air/fuel ratio of an engine having a lean NOx catalyst in its exhaust system in order to prevent the decrease of the fuel efficiency without deterioration of the drivability due to a rich operation for reducing the NOx catalyst.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: June 10, 2003
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Masayuki Wakui, Junichi Suzuki, Masayuki Ueno, Osamu Kitamura
  • Patent number: 6545337
    Abstract: Collector regions (32, 33) with films capable of withstanding high voltage by laminating 4 epitaxial layers when the collector regions (32, 33) are formed. In order to reduce effects caused by interference between the transistors (21, 22) and also reduce parasitic transistor, the epitaxial layers and substrate are etched in a V-groove. Each etched region is dielectrically isolated by the poly-Si (42).
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: April 8, 2003
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tadayoshi Takada, Osamu Kitamura, Shigeaki Okawa, Hirotsugu Hata, Chikao Fujinuma
  • Patent number: 6528379
    Abstract: A buried layer of a collector region and a buried layer of a collector taking-out region are formed at the same time at each epitaxial layer when the collector region and the collector taking-out region of the semiconductor integrated circuit device according to the invention. Each buried layer is diffused to connect, and etched in V-groove. By that, the collector region and collector taking-out region made thick in film are formed at the same time so as to realize the semiconductor integrated circuit device of high withstanding voltage.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: March 4, 2003
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tadayoshi Takada, Osamu Kitamura, Shigeaki Okawa, Hirotsugu Hata, Chikao Fujinuma
  • Publication number: 20020046563
    Abstract: The invention provides an electronic control unit for controlling an air/fuel ratio of an engine having a lean NOx catalyst in its exhaust system in order to prevent the decrease of the fuel efficiency without deterioration of the drivability due to rich operation to reduce the NOx catalyst. The electronic control unit comprises: air/fuel ratio control means for changing the air/fuel ratio to a rich side when the amount of NOx occluded by the lean NOx catalyst exceeds a predetermined value and changing said air/fuel ratio back to a lean side when a first predetermined period has elapsed; lagging means for lagging ignition timing in synchronization with the air/fuel ratio changing to the rich side by said air/fuel ratio control means; and decrementing means for decrementing amount of the ignition timing lagged by said lagging means by a predetermined amount when a second predetermined period shorter than said first predetermined period has elapsed after the air/fuel ratio changing to the rich side.
    Type: Application
    Filed: September 27, 2001
    Publication date: April 25, 2002
    Inventors: Masayuki Wakui, Junichi Suzuki, Masayuki Ueno, Osamu Kitamura
  • Publication number: 20020028561
    Abstract: Collector regions (32, 33) with films capable of withstanding high voltage by laminating 4 epitaxial layers when the collector regions (32, 33) are formed. In order to reduce effects caused by interference between the transistors (21, 22) and also reduce parasitic transistor, the epitaxial layers and substrate are etched in a V-groove. Each etched region is dielectrically isolated by the poly-Si (42).
    Type: Application
    Filed: September 5, 2001
    Publication date: March 7, 2002
    Inventors: Tadayoshi Takada, Osamu Kitamura, Shigeaki Okawa, Hirotsugu Hata, Chikao Fujinuma
  • Publication number: 20020028551
    Abstract: A buried layer of a collector region and a buried layer of a collector taking-out region are formed at the same time at each epitaxial layer when the collector region and the collector taking-out region of the semiconductor integrated circuit device according to the invention. Each buried layer is diffused to connect, and etched in V-groove. By that, the collector region and collector taking-out region made thick in film are formed at the same time so as to realize the semiconductor integrated circuit device of high withstanding voltage.
    Type: Application
    Filed: September 5, 2001
    Publication date: March 7, 2002
    Inventors: Tadayoshi Takada, Osamu Kitamura, Shigeaki Okawa, Hirotsugu Hata, Chikao Fujinuma
  • Patent number: 5989364
    Abstract: A thin wire of gold alloy for wire bonding, consisting of: a first group consisting of 2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium; and the balance consisting of gold and unavoidable impurities. The thin wire has a loop height of 200 .mu.m or more and a wire flow after resin molding of not more than 5%.
    Type: Grant
    Filed: December 12, 1994
    Date of Patent: November 23, 1999
    Assignee: Nippon Steel Corporation
    Inventor: Osamu Kitamura
  • Patent number: 5793199
    Abstract: A method of determining a concentration of magnetic powderly material in a sample is disclosed. In this method, a pair of series-connected exciting coils are disposed in such a manner that magnetic fields generated from the respective exciting coils oppose to each other. A detecting coil is disposed at a position where the magnetic fields from the pair of exciting coils cancel out each other. A sample mixed with magnetic powder is inserted into one of the pair of exciting coils. Then, the method detects a voltage induced in the detecting coil in association with the insertion of the sample into the exciting coil and determines the concentration of the magnetic powder in the sample based on the detected voltage.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: August 11, 1998
    Assignee: New Cosmos Electric Co., Ltd.
    Inventors: Riichiro Kasahara, Yoshihisa Nozawa, Masanori Miyoshi, Osamu Kitamura
  • Patent number: 5761779
    Abstract: A method of producing soft fine metal spheres for semiconductor packaging from a material selected from soft metals and soft alloys. A plurality of fine wires made of the material are arranged in parallel on a flat base plate. Each of the wires has a diameter of not more than 100 .mu.m. The fine wires are cut into wire chips having an equal mass relative to each other and a chip length/chip diameter ratio between 5 and 100 by utilizing a cutting jig having cutting edges which are arranged at a constant pitch. The resulting wire chips are arranged so that the chips are spaced apart a minimum distance sufficient to prevent the chips from merging when melted. The resulting spaced-apart wire chips are heated to a temperature up to but not exceeding 100.degree. C. above the melting point thereof, thereby forming the chips into molten spheres. The resulting molten spheres are cooled, thereby forming solid spheres having a diameter within about 5% of a desired diameter.
    Type: Grant
    Filed: February 5, 1996
    Date of Patent: June 9, 1998
    Assignee: Nippon Steel Corporation
    Inventors: Tadakatsu Maruyama, Osamu Kitamura, Yasuhide Ohno, Tosiharu Kikuchi, Yasuhiro Suzuki, Hisao Kuribayashi, Tomohiro Uno
  • Patent number: 5658664
    Abstract: This invention provides a thin gold-alloy wire for a semiconductor device capable of improving long term reliability of bonding with an electrode and capable of simultaneously accomplishing reduction of a wire bend and wire flow at the time of resin molding and high looping.The thin gold-alloy wire contains 50 to 3000 ppm by weight of Mn and the balance comprising gold and unavoidable impurities. Further, the thin gold-alloy wire comprises any of the following combinations 1, 2, 1+2, 2+3 and 1+2+3 when element groups to be added are classified into the following groups 1 to 3:1 1 to 20 ppm by weight in total of at least one of Be and B;2 1 to 30 ppm by weight in total of at least one of Ca, Sr and rare earth elements; and3 1 to 50 ppm by weight in total of at least oneof In and Tl.The thin gold-alloy wire according to the present invention has high bonding reliability at the bond portion with the electrode on a semiconductor device and can be packaged with high density semiconductor devices.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: August 19, 1997
    Assignee: Nippon Steel Corporation
    Inventors: Tomohiro Uno, Osamu Kitamura, Yasuhide Ohno
  • Patent number: 5637274
    Abstract: The present invention provides a Pd alloy thin wire for wire bonding semiconductor elements comprising Ca, Al, Cr and Si each in an amount of up to 0.0003% by weight, from 0.001 to 0.01% by weight of In, optionally one or both of Au and Ag each having a purity of at least 99.99% in respective amounts of 0.001 to 2.0% by weight and 0.001 to 5.0% by weight, and the balance Pd having a purity of at least 99.99% by weight and unavoidable impurities. The Pd alloy thin wire exhibits an excellent loop shape compared with that of an Au alloy thin wire, ensures bonding reliability, and can replace an Au bonding wire.
    Type: Grant
    Filed: September 8, 1995
    Date of Patent: June 10, 1997
    Assignee: Nippon Steel Corporation
    Inventor: Osamu Kitamura
  • Patent number: 5254215
    Abstract: A dry etching method capable of performing fine patterning. A sample substrate is fixedly disposed on a table in a reactant chamber. Gas plasma produced by a gas plasma generator is introduced into the reactant chamber, and excitation light, that is, light capable of exciting inner shell electrons of constituent atoms of the substrate, is irradiated onto the substrate from above the substrate. In the optical path of the excitation light is disposed a mask. The substrate is irradiated with the light in response to a pattern designated by the mask. The excitation light has an energy for exciting electrons of constituent atoms of the substrate. Upon arrival of the light in etched regions, the electrons of the substrate are excited. As a result, etching is effected by the contact of the excited electrons with the gas plasma, and the rate of this etching is greatly enhanced.
    Type: Grant
    Filed: November 12, 1991
    Date of Patent: October 19, 1993
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Shingo Terakado, Osamu Kitamura
  • Patent number: 4298050
    Abstract: In the continuous casting of steel, it has been possible to produce killed steel industrially, but semikilled and rimmed steel have not been successfully produced due to rimming action occurring in the oscillating mold. The present invention involves a concept of suppressing the nuclei of bubbles which will later grow into CO bubbles. In order to suppress the nuclei of bubbles and to form a non-defective solidification layer of a continuously cast strand, the present invention provides a combination of: a free oxygen concentration of from 50 to 200 ppm in the molten steel; a concave shape at the short sides of the mold; a propulsion forces of the molten steel directed along the long sides of the mold in directions opposite to one another; subjecting a solidification interface to an electromagnetic flow having a speed of from 0.1 to 1.
    Type: Grant
    Filed: November 6, 1979
    Date of Patent: November 3, 1981
    Assignee: Nippon Steel Corporation
    Inventors: Tetsro Ohashi, Osamu Kitamura, Hiromu Fujii, Seizo Mineyuki, Eiichi Takeuchi