Abstract: A polyamide resin is disclosed comprising:a diamine component comprised of at least 50% by mole based on the total diamine component of diamine having diphenyl methane structure substituted by alkyl groups, indicated by the following Formula 1, anda dicarboxylic acid component comprised of at least 50% by mole based on the total dicarboxylic acid component of aromatic dicarboxylic acid having phenolic hydroxyl groups, indicated by the following Formula 2, ##STR1## wherein, R.sup.1 and R.sup.2 are a group or atom selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, and an isopropyl group, and wherein R.sup.1 and R.sup.2 are not both hydrogen atoms.

Abstract: Polyamide-hydrogenated polybutadiene-acrylonitrile block copolymers having high solubility in organic solvents, good compatibility with other polymers, and excellent thermal resistance and adhesive properties are characterized by comprising block units (A) represented by the following formula (I) and block units (B) represented by the following formula (III): ##STR1## wherein Bu is hydrogenated butadiene radical, R is divalent organic radical, R' is a divalent aromatic group having a hydroxyl group, Ar is an aromatic divalent group represented by the following formulae (1)-(6): ##STR2## each of k and z is an average polymerization degree where k is an integer of 2-400, and z is an integer of 5-100, m and n are molar fractions in the copolycondensation, where m.gtoreq.0.04, and m+n=1, and x and y are molar fractions in the copolymerization, where x:y=0.95:0.05 to 0.6:0.4, and x+y=1, and block units (A) and (B) are contained in the range of 2 to 20, respectively.

Abstract: Disclosed is a polyamide/polybutadiene/acrylonitrile block copolymer useful in a wide variety of applications, such as an adhesive film, which comprises a polycondensate comprising a polybutadiene/acrylonitrile copolymer having a carboxyl group at each terminal thereof and a polyamide having an aminoaryl group at each terminal, and which is represented by general formula (I) ##STR1## wherein R is a divalent organic group, Ar is a divalent aromatic group, x, y, z, m and n each: represent mean degree of polymerization and are integers in the ranges of x=3 to 7, y=1 to 4, z=5 to 15, n=1 to 30, and nm=2 to 20, respectively.

Abstract: An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material and a carboxyl-terminated polybutadiene-acrylonitrile copolymer is useful as a cationic electrodeposition coating.

Abstract: An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to 400; n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material is useful as a cationic electrodeposition coating.

Abstract: An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to 400; n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material is also disclosed.