Patents by Inventor Osamu Kometani

Osamu Kometani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5748549
    Abstract: A first interconnection frame is provided on a semiconductor substrate so as to surround a central circuit strip. A second interconnection frame is provided on first metal interconnection frame with an insulating film therebetween. Both ends of a supply line are in contact with second interconnection frame. There is a gap provided between both ends of a ground line and second interconnection frame. Ground line and first interconnection frame are connected, using a via hole provided in the insulating film. Thus, an improved dynamic random access memory in which the voltage levels of supply lines and ground lines are stabilized is provided.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: May 5, 1998
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Co., Ltd.
    Inventors: Osamu Kometani, Shoichi Wakano, Mikio Asakura