Patents by Inventor Osamu Mamezaki

Osamu Mamezaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via fill substrate, production method therefor, and precursor therefor
    Patent number: 10517178
    Abstract: A method for producing a via-filled substrate includes a metal film forming step of forming a metal film containing an active metal on a hole part wall surface of an insulating substrate having a hole part, a filling step of filling a conductor paste having a volume change rate before and after firing of ?10 to 20% in the hole part in which the metal film is formed, and a firing step of firing the insulating substrate in which the conductor paste is filled.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: December 24, 2019
    Assignee: Mitsuboshi Belting Ltd.
    Inventors: Osamu Mamezaki, Yoko Hayashi
  • Via Fill Substrate, Production Method Therefor, and Precursor Therefor
    Publication number: 20180249581
    Abstract: A method for producing a via-filled substrate includes a metal film forming step of forming a metal film containing an active metal on a hole part wall surface of an insulating substrate having a hole part, a filling step of filling a conductor paste having a volume change rate before and after firing of ?10 to 20% in the hole part in which the metal film is formed, and a firing step of firing the insulating substrate in which the conductor paste is filled.
    Type: Application
    Filed: September 21, 2016
    Publication date: August 30, 2018
    Applicant: Mitsuboshi Belting Ltd.
    Inventors: Osamu Mamezaki, Yoko Hayashi