Abstract: The manufacture of a memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. The manufacture of each load MISFET consists of forming source, drain and channel regions within the same polycrystalline silicon film, and a gate electrode consisting of a different layer conductive film, such as a polycrystalline film, than that of the drive MISFETs. The manufacture of the memory cell having such a stacked arrangement, facilitates the patterning of the source (drain) region and gate electrode of each load MISFET thereof to have an overlapping relationship with each other so as to increase the effective capacitance associated with each of the memory cell storage nodes.

Abstract: A memory cell of the type a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETS. Each load MISFET of a memory cell consists of a source, drain and channel region formed within the same polycrystalline silicon film, and a gate electrode consisting of a different layer conductive film than that of the drive MISFETs. In a memory cell having such a stacked arrangement, the source (drain) region and gate electrode of each load MISFET thereof are patterned to have an overlapping relationship with each other so as to increase the effective capacitance associated with each of the memory cell storage nodes.

Abstract: A memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. Each load MISFET of a memory cell consists of a source, drain and channel region formed of a semiconductor strip, such as a polycrystalline silicon film strip, and a gate electrode consisting of a different layer conductive film than that of the drive MISFETs. In a memory cell having such a stacked arrangement, the source region and gate electrode of each load MISFET thereof are patterned to have a widely overlapping relationship with each other to form a capacitor element thereacross such that an increase in the overall capacitance associated with each of the memory cell storage nodes is effected thereby decreasing occurrence of soft error.

Abstract: A memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is provided in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. Each load MISFET of a memory cell consists of a source, drain and channel region formed of a semiconductor strip, such as a polycrystalline silicon film strip, and a gate electrode consisting of a different layer conductive film than that of the drive MISFETs. A wiring line, formed as a separate conductive layer, is provided in the stacking arrangement of the drive and load MISFETs of a memory cell for applying a ground potential to source regions of the drive MISFETs thereof.

Abstract: A semiconductor memory comprises a capacitor with a data storage portion, and an insulated-gate field-effect transistor. The capacitor is formed by a plate which is made up of the side walls and base of a groove formed in a semiconductor substrate, and by a capacitor electrode formed on the side walls and the base, over an insulation film, and which is connected electrically to the source or drain of the insulated-gate field-effect transistor. Various embodiments are provided for reducing size and preventing leakage between other memory cells, including forming stacked capacitors, forming the transistor over the capacitor, using a silicon-over-insulator arrangement for the transistor, forming a common capacitor plate and providing high impurity layers within the substrate.

Abstract: A semiconductor memory comprises a capacitor with a data storage portion, and an insulated-gate field-effect transistor. The capacitor is formed by a plate which is made up of the side walls and base of a groove formed in a semiconductor substrate, and by a capacitor electrode formed on the side walls and the base, over an insulation film, and which is connected electrically to the source or drain of the insulated-gate field-effect transistor. Various embodiments are provided for reducing size and preventing leakage between other memory cells, including forming stacked capacitors, forming the transistor over the capacitor, using a silicon-over-insulator arrangement for the transistor, forming a common capacitor plate and providing high impurity layers within the substrate.

Abstract: In a memory cell of SRAM of CMOS type, load MISFET having a polycrystalline silicon film as area of source, drain and channel is stacked on drive MISFET, and gate electrodes of the drive MISFET and the load MISFET are constituted by conductive films in different layers. Area of source and drain provided on the polycrystalline silicon film has an overlapped area with the gate electrode of the load MISFET.

Abstract: A static RAM memory is divided into a plurality of mats (12). Word lines (16) in each pair of mats are accessed by an x-decoder (14). Columns or bit lines are accessed by a y-decoder (20) which selectively connect pairs of bit lines (22) to common data bus segments (24). Transistors (60, 62) connect selected bit lines with a load during a write cycle to stabilize those bit lines and memory cells into which data is written. The x-decoders are connected with near word lines (16a) for addressing a near half of each mat and are operatively connected with remote word lines (16b) for addressing word lines in a remote half of each mat. In this manner, each mat is divided into two effective mats. The bit lines of all the effective mats within an actual mat are connected with the same output data bus segment. A pair of sensing amplifiers (32) is provided for each bit of memory which is accessed concurrently, e.g. eight bits, such that the high and low output of each flip-flop memory cell (18) are both amplified.

Abstract: A logic circuit includes first, second, third, fourth, fifth and sixth field effect transistors or FETs, input nodes and an output node. The fifth and sixth FETs are connected to the output node. The first and third FETs are connected to the fifth FET. The second and fourth FETs are connected to the sixth FET. The first and second FETs are connected to the first input node. The third and fourth FETs are connected to the second node. A first signal is supplied to the first input node. A second signal is supplied to gate electrodes of the first and fourth FETs. A signal having a phase opposite to the second signal is supplied to gate electrodes of the second and third FETs. A third signal is supplied to the second input node. One signal selected from the first, second and the third signals is supplied to the gate electrode of the fifth FET. A signal having a phase opposite to the signal supplied to the gate electrode of the fifth FET is supplied to the gate electrode of the sixth FET.

Abstract: A semiconductor static random access memory having a high .alpha.-ray immunity and a high packing density is provided which is also capable of high-speed operation. A semiconductor memory device comprises static random access memory cells each including a flip-flop circuit. Storage nodes of each flip-flop circuit have respective pn-junctions formed at regions sandwiched between gate electrodes of first insulated gate field effect transistors and gate electrodes of second insulated gate field effect transistors, respectively. The pn-junction has an area smaller than that of a channel portion of the first or second insulated gate field effect transistor.

Abstract: Herein disclosed is a semiconductor integrated circuit device having a SRAM, in which two MISFETs of a flip-flop circuit of a memory cell are connected directly with an n.sup.+ -type drain region so that they are cross coupled; and in which a p.sup.+ -type semiconductor region is formed below a direct contact part by making use of the mask used in the step of forming contact holes for the direct contact part. The p.sup.+ -type semiconductor region aids as a barrier to prevent soft errors of the SRAM due to .alpha.-particles.

Abstract: Disclosed is an MOSIC including a plurality of silicon gate type MOSFET's in which, after polycrystalline silicon wirings are formed simultaneously with polycrystalline silicon gates, the electrodes contacted with the source and drain regions are made of polycrystalline silicon so as to be connected to the polycrystalline silicon wirings, thereby to prevent the shallow pn junctions of the source and drain regions from being destroyed by the contacts and to provide a high degree of integration to one silicon chip.

Abstract: A semiconductor integrated circuit includes: a data output terminal; a first semiconductor element connected between a first operating potential point and the data output terminal; a second semiconductor element connected between the data output terminal and a second operating potential point; first control means connected to a control input terminal of the first semiconductor element; second control means connected to a control input terminal of the second semiconductor element; first generating means for generating a first predetermined voltage; and second generating means for generating a second predetermined voltage higher than the first predetermined voltage.

Abstract: A semiconductor memory device is disclosed, in which a word line address translation unit, a data line address translation unit, a first spare memory and a second spare memory are provided in addition to a main memory to relieve a defective memory cell in the main memory. Spare word line address signals for selecting a spare word line on the first spare memory are written in the word line address translation unit, spare data line address signals for selecting a spare data line on the second spare memory are written in the data line address translation unit, and each of the word line address translation unit and the data line address translation unit is constructed of an ordinary semiconductor memory of the multi-bit output type.

Abstract: A static RAM memory is divided into a plurality of mats (12). Word lines (16) in each pair of mats are accessed by an x-decoder (14). Columns or bit lines are accessed by a y-decoder (20) which selectively connect pairs of bit lines (22) to common data bus segments (24). Transistors (60, 62) connect selected bit lines with a load during a write cycle to stabilize those bit lines and memory cells into which data is written. The x-decoders are connected with near word lines (16a) for addressing a near half of each mat and are operatively connected with remote word lines (16b) for addressing word lines in a remote half of each mat. In this manner, each mat is divided into two effective mats. The bit lines of all the effective mats within an actual mat are connected with the same output data bus segment. A pair of sensing amplifiers (32) is provided for each bit of memory which is accessed concurrently, e.g. eight bits, such that the high and low output of each flip-flop memory cell (18) are both amplified.

Abstract: A semiconductor memory comprises a capacitor with a data storage portion, and an insulated-gate field-effect transistor. The capacitor is formed by a plate which is made up of the side walls and base of a groove formed in a semiconductor substrate, and by a capacitor electrode formed on the side walls and the base, over an insulation film, and which is connected electrically to the source or drain of the insulated-gate field-effect transistor. Various embodiments are provided for reducing size and preventing leakage between other memory cells, including forming stacked capacitors, forming the transistor over the capacitor, using a silicon-over-insulator arrangement for the transistor, forming a common capacitor plate and providing high impurity layers within the substrate.

Abstract: An MOS static type RAM has a memory cell array comprising of a plurality of static type memory cells arranged in matrix, a plurality of data lines connected to the data input-output terminals of the respective memory cells and a plurality of word lines connected to the selection terminals of the respective memory cells. Data line load circuits are disposed between the power terminal of the circuit and the data lines. Each data line load circuit is kept at a relatively high impedance in the data write-in operation, and at a relatively low impedance in the data read-out operation. The use of the data line load circuits comprised of such variable impedance circuits can speed up the operating speed of the RAM and can accomplish lower power consumption.

Abstract: A semiconductor memory having static cells each composed of two driver MOS transistors formed on a semiconductor substrate and two transfer MOS transistors and two load resistors, which are formed on the substrate and are connected to the drains of the driver MOS transistors, respectively. A conductive film for fixing the sources of the driver MOS transistors to a ground voltage is formed above the principal surface of the semiconductor substrate, and this conductive film defines one electrode of a capacitance element formed on the substrate. The conductive film is formed over the load resistors formed on the semiconductor substrate so as to constitute an electric field shield for the load resistors.

Abstract: A semiconductor memory device is provided in which an electrode applied with the power supply voltage or the ground voltage is provided on an insulating layer over the drain and/or the gate of the MOS transistors constituting the memory cell of a static memory device, thereby to increasing the capacitance of the storing node of the memory cell. This semiconductor memory device significantly reduces the occurrence of soft errors.

Abstract: A semiconductor memory device having a memory plane defined by a plurality of memory cells, a decoder line for accessing the memory cells, a common data line on which a signal output from an accessed memory cell is collected, and a sense amplifier for amplifying the signal collected on the common data line. The sense amplifier has an amplifying circuit portion which is composed of a pair of common-collector type bipolar transistors supplied with the signal collected on the common data line as a differential input, and a plurality of MOS transistors for converting a change in current into a change in voltage. Each of the MOS transistors has a lightly-doped drain structure.