Abstract: Appropriate network data for an indoor map can be efficiently generated using input data including a structure of an indoor space. In a network data generation device (10) that generates, from the input data including at least the structure of the indoor space and information indicating a property based on the structure of the indoor space, network data, the network data including a link representing a movable space on a map and a node that is a starting point or an ending point of the link, a link/node generation unit (142) generates a set of links and a set of nodes based on the input data.

Abstract: In a stick delivering apparatus I, a receiving space D capable of receiving a stick receiving part 2 of a cart II in a stick arrangement direction Y is formed at a position in close proximity to a support arm device 63 in a stick longitudinal direction X. The support arm device 63 includes a stationary stick supporting member 64 extending in the stick arrangement direction Y and a raising/lowering stick supporting member 65 extending in parallel with the stationary stick supporting member 64 in the stick longitudinal direction X. The stationary stick supporting member 64 and the raising/lowering stick supporting member 65 have serrated receiving tooth portions 64A and 65A, respectively, and the receiving tooth portions 64A and 65A have stick sliding edges 64A-1 and 65A-1 which are inclined with respect to a horizontal plane.

Abstract: In a stick delivering apparatus I, a receiving space D capable of receiving a stick receiving part 2 of a cart II in a stick arrangement direction Y is formed at a position in close proximity to a support arm device 63 in a stick longitudinal direction X. The support arm device 63 includes a stationary stick supporting member 64 extending in the stick arrangement direction Y and a raising/lowering stick supporting member 65 extending in parallel with the stationary stick supporting member 64 in the stick longitudinal direction X. The stationary stick supporting member 64 and the raising/lowering stick supporting member 65 have serrated receiving tooth portions 64A and 65A, respectively, and the receiving tooth portions 64A and 65A have stick sliding edges 64A-1 and 65A-1 which are inclined with respect to a horizontal plane. The stationary stick supporting member 64 receives the stick by a trough portion serving as a supporting portion of the receiving tooth portion 64A.

Abstract: Magnetoresistive devices are formed on the insulating surface of a substrate made of silicon. The devices are connected in series through an insulating film using a wiring layer formed on the surface of the substrate. An insulating film for passivation is formed to cover the devices and the wiring layer. A magnetic shield layer of Ni—Fe alloy is formed on the passivation insulating film through an organic film for relieving thermal stress to cover one of the devices. After removal of the sensor chip containing the magnetoresistive devices and other components from the wafer, the chip is bonded to a lead frame through an Ag paste layer by heat treatment. Preferably, the magnetic shield layer is made of a Ni—Fe alloy having a Ni content of 69% or less.

Abstract: Magnetoresistive devices are formed on the insulating surface of a substrate made of silicon. The devices are connected in series through an insulating film using a wiring layer formed on the surface of the substrate. An insulating film for passivation is formed to cover the devices and the wiring layer. A magnetic shield layer of Ni—Fe alloy is formed on the passivation insulating film through an organic film for relieving thermal stress to cover one of the devices. After removal of the sensor chip containing the magnetoresistive devices and other components from the wafer, the chip is bonded to a lead frame through an Ag paste layer by heat treatment. Preferably, the magnetic shield layer is made of a Ni—Fe alloy having a Ni content of 69% or less.

Abstract: Magnetoresistive devices are formed on the insulating surface of a substrate made of silicon. The devices are connected in series through an insulating film using a wiring layer formed on the surface of the substrate. An insulating film for passivation is formed to cover the devices and the wiring layer. A magnetic shield layer of Ni—Fe alloy is formed on the passivation insulating film through an organic film for relieving thermal stress to cover one of the devices. After removal of the sensor chip containing the magnetoresistive devices and other components from the wafer, the chip is bonded to a lead frame through an Ag paste layer by heat treatment. Preferably, the magnetic shield layer is made of a Ni—Fe alloy having a Ni content of 69% or less.

Abstract: Magnetoresistive devices are formed on the insulating surface of a substrate made of silicon. The devices are connected in series through an insulating film using a wiring layer formed on the surface of the substrate. An insulating film for passivation is formed to cover the devices and the wiring layer. A magnetic shield layer of Ni—Fe alloy is formed on the passivation insulating film through an organic film for relieving thermal stress to cover one of the devices. After removal of the sensor chip containing the magnetoresistive devices and other components from the wafer, the chip is bonded to a lead frame through an Ag paste layer by heat treatment. Preferably, the magnetic shield layer is made of a Ni—Fe alloy having a Ni content of 69% or less.

Abstract: A twisted flat cable is provided which includes parallel fused portions and twisted pair portions alternating with the parallel fused portions. TPO (thermoplastic olefin) is used as an insulating material for an insulative layer that covers conductors to provide separately insulated conductors constituting the parallel fused portions and the twisted pair portions in the twisted flat cable. By virtue of this construction, the twisted flat cable has excellent transmission characteristics.

Abstract: A twisted flat cable is provided which comprises parallel fused portions and twisted pair portions alternating with the parallel fused portions. TPO (thermoplastic olefin) is used as an insulating material for an insulative layer that covers conductors to provide separately insulated conductors constituting the parallel fused portions and the twisted pair portions in the twisted flat cable. By virtue of this construction, the twisted flat cable has excellent transmission characteristics.

Abstract: A flat cable having a linear portion in at least a part thereof. The linear portion has a plurality of insulated conductors juxtaposed to one another with adjacent insulated conductors being adhered to each other to provide an integral insulative layer, and a resin tape applied to the surface of the integral insulative layer so as to conform to the shape of the surface. In the production of this flat cable, a plurality of insulated conductors, together with a resin tape, are feed into a mold. In the mold, adjacent insulated conductors in their insulative layers are fused to each other to form an integral insulative layer. The resin tape is applied to the integral insulative layer so as to conform to the shape of the surface of the integral insulative layer.

Abstract: In a flat cable having a linear portion in at least a part thereof, an improved construction of the linear portion is disclosed. The linear portion comprises: a plurality of insulated conductors juxtaposed to one another with adjacent insulated conductors other being adhered to each other to provide an integral insulative layer having on its surface crest portions and root portions; and a resin tape applied to the surface of the integral insulative layer so as to conform to the shape of the surface of the integral insulative layer having crest portions and root portions. In the production of this flat cable, a plurality of insulated conductors, together with a resin tape, are feed into a mold in its grooves.

Abstract: A mold is disposed just behind twist ports for forming twisted pair portions of a flat cable. When a plurality of insulated conductors in their portion corresponding to a parallel portion, before fusion, of a flat cable are passed through the twist ports, the rotation of the twist ports is stopped to permit the plurality of insulated conductors to be parallel aligned with an identical pitch. The mold comprises a combination of two molds each having a plurality of grooves for accommodating therein the plurality of insulated conductors delivered from the twist ports. Upon accommodation of the plurality of insulated conductors within the grooves of the mold, fusion between adjacent insulated conductors in their insulative layers is carried out in the mold to form a parallel fused portion.

Abstract: A mixture of zinc sulfide and silicon dioxide as starting material powder mixed with zinc oxide in an amount of from 0.5 to 5 wt % is subjected to hot pressing sintering to obtain a sintered body. In this manner, a high density sputtering target using the sintered body can be obtained at a high yield.

Abstract: In a flat cable including fused portions and twisted pair portions, the length of the twisted pair portions being not constant, the twist pitch of the twisted pair portions being substantially constant independently of the length of the twisted pair portions, some of the twisted pair portions being constituted by S twists with the other twisted pair portions being constituted by Z twists, the next twisted pair portion is twisted in such a manner that, when the number of twists in the S twisted pair portions in the longitudinal direction of the flat cable is added as “plus (+)” value with the number of twists in the Z twisted pair portions being added as “minus (−)” value, the twist sense in the next twisted pair portion is Z twist sense if the integrated value of the number of twists is plus (+) while the twist sense in the next twisted pair portion is S twist sense if the integrated value of the number of twists is minus (−).

Abstract: A chemical vapor deposition apparatus deposits a thin film on a substrate according to a chemical vapor deposition method by using plasma energy and reaction gas. The chemical vapor deposition apparatus comprises at least a reaction tube, a waveguide and a substrate holder. The reaction tube is inserted through the waveguide to thereby form a reaction vessel. The reaction tube is connected with a reaction gas source, and reaction gas is introduced into the reaction tube. The substrate holder is placed at an area in which the reaction tube and the waveguide intersect. The substrate holder provides a rotation axis for rotating the substrate, and the waveguide is provided such that a center axis thereof is inclined in relation to a center axis of the substrate holder. In addition, the substrate holder can be freely rotated around the center axis thereof.

Abstract: This invention relates to a method or apparatus by which comparatively low-voltage electric wires and cables laid at power stations and other locations can be diagnosed for deterioration of their polymer-insulation in a non-destructive way. The method or apparatus comprises applying a torsional force to the electric wire or cable, detecting the resulting repulsion as a torque, and estimating the degree of deterioration of the polymer-insulation in the electric wire or cable on the basis of the detected value of torque.

Abstract: The present invention is directed to a method for producing a diaphragm for highly brittle metals used in loudspeakers, comprising a step of making a laminated plate by stacking a plate of superplastic material on a plate of highly brittle metal. The laminated plate is arranged on a mould, and the laminated plate is heated to a predetermined range of temperatures, determined according to the highly brittle metal. Subsequently, the laminated plate is deformed by pressuring the laminated plate in the mould, at the range of temperatures. Thus, a diaphragm can be formed from a plate of highly brittle metals, without causing brittle fracture or generating internal or surface defects.