Abstract: A wiring module that is attached to a plurality of power storage elements, including: a circuit board; an electric wire; and a protector configured to hold the circuit board and the electric wire, wherein a conductive path is routed on the circuit board, and the conductive path includes a connection land that is electrically connected to an electrode terminal of a power storage element among the plurality of power storage elements, an electric wire land that is connected to one end of the electric wire, and a fuse portion provided between the connection land and the electric wire land.

Abstract: To calculate PageRank with high accuracy using transaction data held by a plurality of data sources as input and keeping the transaction data of each data source secret. A data source apparatus (1) calculates a transaction rate for each combination of transaction entities (S12). The data source apparatus (1) encrypts the transaction rate and transmits the encrypted transaction rate to each secure computation apparatus (2) (S13). Each secure computation apparatus (2) receives a ciphertext of the transaction rate from a plurality of data source apparatuses (1) (S21). The secure computation apparatus (2) securely calculates a ciphertext which becomes, when decrypted, PageRank of the computational objective transaction entity by using the ciphertext of the transaction rate related to the computational objective transaction entity and the ciphertext of the PageRank of a transaction counterpart (S22).

Abstract: An external connection bus bar to be connected to a storage element group having a plurality of storage elements and having an output electrode terminal for outputting electric power to an external circuit includes a main body portion to be connected to the output electrode terminal, an external connection terminal to be connected to an external circuit, and a circuit board connection portion to be soldered to a bus bar land provided on the circuit board. The external connection terminal is provided between the main body portion and the circuit board connection portion.

Abstract: The present invention performs characteristic tests on a communication device with a compact and simple configuration. A testing device 1 that performs characteristic tests in a near field on a communication antenna 250 of a communication device 240 includes a tray body 220 that supports the communication device in a test space S as an anechoic chamber, and a coupler support frame 520 that supports coupler antennas transmitting and receiving radio waves to/from the communication antenna 250. The coupler support frame can form inner-periphery coupler antenna arrays 300A and 300B each including a plurality of coupler antennas 300 arranged at least in a row along a curve extending along an inner peripheral surface composed of side surface S1 and S2, an upper surface S3, and a lower surface S4, and a rear coupler antenna array 300C including a plurality of coupler antennas 300 arranged at least in a row in an upper-lower direction along a curve extending along a rear surface S5.

Abstract: An object of the present invention is to suppress occurrence of disturbance in pass amplitude characteristics within a band and disturbance in return loss characteristics in the band due to total reflection, improve cutoff performance, and acquire a favorable gain. An antenna device 1 includes a waveguide body 5 including a coaxial waveguide conversion unit 6 that includes an inner space 8 and a connector attachment hole 22, and a closure member 30. The antenna device 1 also includes a connector 50 including a connector body 51, a center conductor 60, and a radiator 54 b configured by an end portion 60 a of the center conductor that adapts the protruding length of the end portion to a specific frequency band.

Abstract: In the antenna device, a first insulating plate, a capacitive coupling portion of a tuning plate, a radio wave absorber, a grounding portion of the tuning plate folded back to the back side of the radio wave absorber, and a tuning coated plate provided with a metallic plated film formed on the surface thereof are sequentially stacked below an antenna element having a shape obtained by removing an arched portion from a copper circular plate. Power is supplied from a center conductor of a semi-rigid signal input member to a power feeding unit of the antenna element. An external conductor is held between the upper and lower conductive cushions. A grounding plate is conductive with the external conductor, to ground the grounding portion and the tuning coated plate.

Abstract: The present invention performs characteristic tests on a communication device with a compact and simple configuration. A testing device 1 that performs characteristic tests in a near field on a communication antenna 250 of a communication device 240 includes a tray body 220 that supports the communication device in a test space S as an anechoic chamber, and a coupler support frame 520 that supports coupler antennas transmitting and receiving radio waves to/from the communication antenna 250. The coupler support frame can form inner-periphery coupler antenna arrays 300A and 300B each including a plurality of coupler antennas 300 arranged at least in a row along a curve extending along an inner peripheral surface composed of side surface 51 and S2, an upper surface S3, and a lower surface S4, and a rear coupler antenna array 300C including a plurality of coupler antennas 300 arranged at least in a row in an upper-lower direction along a curve extending along a rear surface S5.

Abstract: By performing continuous matching in an entire frequency band from 600 MHz to 6 GHz by one antenna device, communication with a plurality of types of communication devices having different used frequency bands becomes possible without switching the antenna device. In the antenna device, a first insulating plate 40, a capacitive coupling portion 45a of a tuning plate 45, a radio wave absorber 50, a grounding portion 45b of the tuning plate 45 folded back to the back side of the radio wave absorber 50, and a tuning coated plate 55 provided with a metallic plated film formed on the surface thereof are sequentially stacked below an antenna element 30 having a shape obtained by removing an arched portion from a copper circular plate. Power is supplied from a center conductor 64 of a semi-rigid signal input member 61 to a power feeding unit 33 provided in a part of a circular outer edge 32 of the antenna element 30.

Abstract: There is provided an apparatus including a substrate holder to hold substrates including a product substrate and a dummy substrate, a transfer mechanism that loads the substrates into the substrate holder, a storage part to store a device parameter including at least the number of substrates that can be loaded on the substrate holder and the number of product substrates to be loaded on the substrate holder, and a controller to: (1) create substrate transfer data, which includes information indicating an order for transferring the substrates, transfer source information, and transfer destination information, according to the device parameter, (2) read the created substrate transfer data, (3) by transferring the substrates to the transfer mechanism based on the read substrate transfer data, transfer the dummy substrate to a substrate holding region except for a heat equalization region, and transfer the product substrate to the heat equalization region on the substrate holder.

Abstract: Described herein is a technique capable of stabilizing conditions in a furnace at the start of a film-forming process. According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: pre-processing of preparing a process environment in a process furnace of a substrate processing apparatus; film-forming by processing a substrate; and post-processing, wherein the pre-processing comprises (a1) determining whether to execute a maintenance recipe for a target object in the substrate processing apparatus, wherein (a1) is performed first in the pre-processing.

Abstract: An object of the present invention is to suppress occurrence of disturbance in pass amplitude characteristics within a band and disturbance in return loss characteristics in the band due to total reflection, improve cutoff performance, and acquire a favorable gain. An antenna device 1 includes a waveguide body 5 including a coaxial waveguide conversion unit 6 that is hexahedral and includes an inner space 8 formed by penetrating a first surface and a second surface facing each other and a connector attachment hole 22 for inserting a coaxial connector continuously formed between a third surface orthogonal to the first surface and the second surface and the inner space, and a closure member 30 that is conductive and closes an opening of the inner space on the second surface side.

Abstract: According to one aspect of the present disclosure, there is provided a cleaning method including: cleaning a component in which a deposit adhering to the component constituting an apparatus is removed by supplying and discharging a cleaning gas, wherein the act of cleaning includes controlling the apparatus so that a signal, which indicates a concentration of a predetermined gas generated by a reaction of the deposit and the cleaning gas, reaches a predetermined upper limit value or less and then stays within a range between the predetermined upper limit value and a predetermined lower limit value for a predetermined time period.

Abstract: There is provided an apparatus including a substrate holder to hold substrates including a product substrate and a dummy substrate, a transfer mechanism that loads the substrates into the substrate holder, a storage part to store a device parameter including at least the number of substrates that can be loaded on the substrate holder and the number of product substrates to be loaded on the substrate holder, and a controller to: (1) create substrate transfer data, which includes information indicating an order for transferring the substrates, transfer source information, and transfer destination information, according to the device parameter, (2) read the created substrate transfer data, (3) by transferring the substrates to the transfer mechanism based on the read substrate transfer data, transfer the dummy substrate to a substrate holding region except for a heat equalization region, and transfer the product substrate to the heat equalization region on the substrate holder.

Abstract: An apparatus and method capable of reducing the footprint of substrate processing system. An apparatus includes a housing chamber including a housing cabinet which houses housing containers for housing substrates, and a housing container carrying mechanism provided on the ceiling of the housing chamber and configured to carry the housing containers.

Abstract: This microwave plasma processing apparatus has, as a gas introduction mechanism for introducing a working gas inside a chamber (10), electrical discharge prevention members (96(1) to 96(8)), each of which is provided to a plurality of dielectric window gas passages (94(1) to (94(8)) through which a dielectric window (54) passes. Each electrical discharge prevention member (96(n)), a portion (114) of which protrudes only a height h, which is greater than or equal to a predetermined distance H, upward from the rear surface of a dielectric window (52) on the inlet side, passes through an opening (54a) of a slot plate (54), and inserts into a branched gas supply path (92(n)) of a gas branch part (90). The gas branch part (90), spring coils (116) and the slot plate (54), which surround the protruding portion (114) of each electrical discharge prevention member (96(n)), constitute an enclosing conductor (118).

Abstract: Provided is a method of automatically setting, in a recipe, a process parameter (PP) according to the number of substrates to be processed. The method includes (a) displaying a process parameter of a process recipe on a display unit; (b) displaying a parameter name in a process parameter file on the display unit; (c) generating a first recipe by substituting the process parameter with the parameter name; (d) downloading the first recipe and one of a plurality of condition tables corresponding to the selected number of substrates when the number of substrates to be processed in a processing chamber is selected; and (e) generating a second recipe by substituting the process parameter of the downloaded one of the condition tables for the parameter name in the downloaded first recipe.

Abstract: A method for manufacturing a liquid supply member that supplies a discharge port with liquid includes preparing a transparent member and an absorption member, at least one of both members having a groove for a supply path; bringing both members into contact; and forming the supply path by emitting laser beams simultaneously from a plurality of laser beam sources, toward a contact portion, which is provided in a vicinity of the groove and at which both members are in contact, to weld both members. Laser beams are emitted during the forming such that a total laser-beam irradiation amount per unit area for a first portion included in the contact portion and located in a vicinity of an end in a longitudinal direction of the groove is larger than that for part with a smallest irradiation amount of a second portion other than the first portion of the contact portion.

Abstract: An antenna, a dielectric window, a plasma processing apparatus and a plasma processing method are capable of improving uniformity of a substrate surface processing amount in the surface of the substrate. The antenna includes the dielectric window 16; and a slot plate 20, provided on one side of the dielectric window 16, having a plurality of slots 133. The dielectric window 16 has a flat surface 146 surrounded by a ring-shaped first recess; and a plurality of second recesses 153 formed on the flat surface 146 so as to surround a center of the flat surface 146. Here, the flat surface 146 is formed on the other side of the dielectric window 16. When viewed from a thickness direction of the slot plate, a center of each second recess 153 is located within each slot 133 of the slot plate.

Abstract: An apparatus and method capable of reducing the footprint of substrate processing system. An apparatus includes a housing chamber including a housing cabinet which houses housing containers for housing substrates, and a housing container carrying mechanism provided on the ceiling of the housing chamber and configured to carry the housing containers.

Abstract: A substrate processing method for performing a plasma process on a processing target substrate by a plasma processing apparatus is provided. The plasma processing apparatus comprises: a processing chamber; a gas supply unit; a mounting table; a microwave generator; a dielectric plate; a slot antenna plate; a wavelength shortening plate; and a microwave supply unit, and the microwave supply unit comprises a coaxial waveguide and a distance varying device. The substrate processing method comprises: mounting the processing target substrate on the mounting table; generating microwave by the microwave generator; and varying, by the distance varying device, a distance in a radial direction between a part of an outer surface of an inner conductor and a facing member facing a part of an outer surface of the inner conductor in order to uniformly generate plasma under a lower surface of the dielectric plate in the processing chamber.