Abstract: An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.

Abstract: An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.

Abstract: The solder contains Sn—Zn alloy(s) having a single composition ratio or a plurality of composition ratios, and Sn—Bi—Ag alloy(s) having a single composition ratio or a plurality of composition ratios. The solder includes zinc at 7 to 10 weight % both inclusive, bismuth at 0.001 to 6 weight % both inclusive, silver at 0.001 to 0.1 weight % both inclusive, and the remainder of tin when the alloys are melted in mixture.

Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.

Abstract: Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.

Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.

Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.

Abstract: Dielectric parts 12 which become resonators are fitted in holes formed in a dielectric substrate 11 and magnetic parts 13 for setting resonance frequencies of the dielectric parts 12 are also fitted in holes formed in the dielectric substrate 11. With such construction in which the dielectric parts are fitted in the holes of the dielectric substrate, the physical preciseness of a high frequency filter is improved. Further, by fitting not only the dielectric parts 12 but also the magnetic parts 13 in the holes of the dielectric substrate 11, it is possible to form the high frequency filter operating in a frequency band of several tens GHz as a micro wave integrated circuit to thereby improve the uniformality and mass-producibility of the high frequency filter.

Abstract: A laminate printed circuit board loaded with transistors, ICs (Integrated Circuits) or LSIs (Large Scale Integrated Circuits) and a method of producing the same are disclosed. The circuit board includes a signal layer, a ground layer and a power supply layer sequentially laminated with the intermediary of insulation layers. An impedance adding circuit is formed in the power supply layer. A magnetic layer is positioned at least above or at least blow the impedance adding circuit. The circuit board with this configuration reduces power supply noise to a noticeable degree.

Abstract: A Ni--Zn type ferrite has the composition represented by the general formula: Ni.sub.X Zn.sub.1-X Fe.sub.2-Y-Z Mn.sub.Y Zr.sub.Z O.sub.4 (0.55.ltoreq.X.ltoreq.0.80, 0.001.ltoreq.Y.ltoreq.0.20, 0.001.ltoreq.Z.ltoreq.0.04). The Ni--Zn type ferrite is formed with the step described below. A raw powder is first mixed for 64 hours and then fired at 850.degree. C. in an oxygen atmosphere for two hours. Next, the fired powder is crushed and then the crushed powder is again mixed. Then, a binder is added to the resulting powder, which is then press-formed under a pressure of 2.5 ton/cm.sup.2, and the press-formed powder is sintered at 1350.degree. C. for 5 hours in an oxygen atmosphere.

Abstract: An ultrasonic motor comprises a rotor and a stator between which a pressurized face-to-face contact is established. The stator includes a longitudinal vibrator for producing a longitudinal thrust in the axial direction thereof and a torsional vibrator for transmitting a torsional thrust to the rotor in response to a longitudinal thrust timely generated by the longitudinal vibrator. The stator is supported by a structure which comprises a ring portion secured to the stator and a plurality of limb portions radially extending from the ring portion. Each of the limb portions has such an effective length and a width that the oscillation frequency of the motor matches the primary resonant frequency of a vibration of the limb portion generated on a plane normal to the axial direction of the stator and has such a thickness that the oscillation frequency matches an intermediate point between adjacent antiresonant frequencies of a vibration of the limb portion generated in the axial direction of the stator.

Abstract: An ultrasonic motor driver includes a voltage-current phase difference detector for detecting a phase difference between an applied voltage and a current of a torsional vibration piezoelectric element and a phase shifter for adjusting phases of voltages applied to the longitudinal and torsional vibration piezoelectric elements so that the phase difference is minimum. Even if changes in application environment, e.g., an external force or temperature, occur, a rotational speed can be kept stable to drive an ultrasonic motor.

Abstract: An ultrasonic motor comprises a stator which generates a combined ultrasonic elliptic vibration which is a combined vibration of longitudinal and torsional vibrations, and a rotor which is in press-contact with the stator and driven by the ultrasonic elliptic vibration via a friction force between the rotor and the stator. The stator comprises a first piezoelectric element for generating the longitudinal vibration, a second piezoelectric element for generating the reacting vibration, a headmass having a large stiffness against said longitudinal vibration and a large inertial mass against the torsional vibration, and a rearmass. In the ultrasonic motor, the resonance frequencies of the longitudinal and torsional vibrations are equal, so that the ultrasonic elliptic vibration is generated efficiently on the rotor in a high power state which is adapted in practical use.

Abstract: In an ultrasonic motor which uses, as a stator, a longitudinal-torsional composite vibrator in which longitudinal and torsional piezoelectric elements are sandwiched between two blocks, and urges a rotor against the stator, a member is arranged on a piezoelectric element side of the block located near the rotor, so that an inertial mass of the member becomes larger with respect to torsional vibration than that of a rotor side.

Abstract: An ultrasonic motor has a longitudinal-torsional composite transducer, a stator constituted by an ultrasonic vibrator sandwiching the transducer, and a rotor urged against the stator. The stator excites longitudinal-torsional ultrasonic vibrations to rotate the rotor by a frictional force. The motor includes a vibration adjusting rod for matching resonance frequencies of longitudinal and torsional ultrasonic vibrations of the stator with each other.

Abstract: This invention provides an ultrasonic motor using a bolt-tightened Langevin type torsional vibrator as a stator. The stator produces a vibrational energy to be converted into a rotational energy for a rotor contacted with the stator. The rotor is provided between a piezoelectric actuator and the torsional vibrator so that the contact state between the rotor and the torsional vibrator is controlled either one of loose contact and tight contact therebetween. According to the present invention, since the piezoelectric actuator is slidingly combined to the rotor, the rotation energy is not applied to the piezoelectric actuator and thus the life time of the actuator becomes long.