Patents by Inventor Osamu Nabeya

Osamu Nabeya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7632173
    Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: December 15, 2009
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Osamu Nabeya, Makoto Fukushima, Kunihiko Sakurai, Hiroshi Yoshida, Teruhiko Ichimura
  • Publication number: 20090305612
    Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.
    Type: Application
    Filed: June 3, 2009
    Publication date: December 10, 2009
    Inventors: Mitsuru Miyazaki, Seiji Katsuoka, Naoki Matsuda, Junji Kunisawa, Kenichi Kobayashi, Hiroshi Sotozaki, Hiroyuki Shinozaki, Osamu Nabeya, Shinya Morisawa, Takahiro Ogawa, Natsuki Makino
  • Publication number: 20090233532
    Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
    Type: Application
    Filed: May 15, 2009
    Publication date: September 17, 2009
    Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
  • Publication number: 20090191791
    Abstract: A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.
    Type: Application
    Filed: January 27, 2009
    Publication date: July 30, 2009
    Inventors: Makoto Fukushima, Tetsuji Togawa, Hozumi Yasuda, Osamu Nabeya, Shingo Saito
  • Publication number: 20090191797
    Abstract: A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.
    Type: Application
    Filed: February 25, 2009
    Publication date: July 30, 2009
    Inventors: Osamu NABEYA, Tetsuji TOGAWA, Makoto FUKUSHIMA, Hozumi YASUDA
  • Patent number: 7563356
    Abstract: A composite processing apparatus which can securely process a conductive material, such as a copper film, at a low surface pressure and a high rate while effectively preventing the formation of pits is disclosed. The composite processing apparatus includes: a substrate holder for holding a substrate; a processing table including a mechanical processing section for processing a surface of the substrate by a processing method involving a mechanical action; and an electrolytic processing section which is separate from the mechanical processing section. The electrolytic processing section includes a processing electrode with an ion exchanger, for processing the substrate by applying a voltage between the processing electrode and the substrate while keeping the ion exchanger (92) in contact with the substrate.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: July 21, 2009
    Assignee: Ebara Corporation
    Inventors: Osamu Nabeya, Takayuki Saito, Tsukuru Suzuki, Yasushi Toma, Ikutaro Noji
  • Publication number: 20090111362
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.
    Type: Application
    Filed: October 16, 2008
    Publication date: April 30, 2009
    Inventors: Osamu Nabeya, Tetsuji Togawa, Hozumi Yasuda, Koji Saito, Makoto Fukushima
  • Publication number: 20090061748
    Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
    Type: Application
    Filed: October 16, 2008
    Publication date: March 5, 2009
    Inventors: Tetsuji TOGAWA, Ikutarao NOJI, Keisuke NAMIKI, Hozumi YASUDA, Shunichiro KOJIMA, Kunihiko SAKURAI, Nobuyuki TAKADA, Osamu NABEYA, Makoto FUKUSHIMA, Hideki TAKAYANAGI
  • Patent number: 7491117
    Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: February 17, 2009
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
  • Publication number: 20080314763
    Abstract: A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
    Type: Application
    Filed: August 14, 2008
    Publication date: December 25, 2008
    Inventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Masayuki Kumekawa, Hozumi Yasuda, Osamu Nabeya, Kazuto Hirokawa, Mitsuhiro Shirakashi, Yasushi Toma, Itsuki Kobata
  • Publication number: 20080318492
    Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
    Type: Application
    Filed: August 19, 2008
    Publication date: December 25, 2008
    Inventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
  • Publication number: 20080318499
    Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
    Type: Application
    Filed: August 19, 2008
    Publication date: December 25, 2008
    Inventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
  • Patent number: 7465214
    Abstract: A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: December 16, 2008
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Osamu Nabeya
  • Publication number: 20080287043
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to lift and lower the top ring, and an elongation detecting device configured to detect an elongation of the top ring shaft. The polishing apparatus further includes a controller configured to set a vertical position of the top ring at the time of polishing, and control a lifting and lowering mechanism to lower the top ring to a preset polishing position as the set vertical position. The controller corrects the preset polishing position based on the elongation of the top ring shaft which has been detected by the elongation detecting device.
    Type: Application
    Filed: January 29, 2008
    Publication date: November 20, 2008
    Inventors: Kenichiro Saito, Osamu Nabeya, Kimihide Nagata, Tetsuji Togawa
  • Patent number: 7427345
    Abstract: A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: September 23, 2008
    Assignee: Ebara Corporation
    Inventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Masayuki Kumekawa, Hozumi Yasuda, Osamu Nabeya, Kazuto Hirokawa, Mitsuhiko Shirakashi, Yasushi Toma, Itsuki Kobata
  • Publication number: 20080166957
    Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
    Type: Application
    Filed: March 5, 2008
    Publication date: July 10, 2008
    Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
  • Publication number: 20080119121
    Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
    Type: Application
    Filed: December 6, 2007
    Publication date: May 22, 2008
    Inventors: Tetsuji Togawa, Osamu Nabeya, Makoto Fukushima, Kunihiko Sakurai, Hiroshi Yoshida, Teruhiko Ichimura
  • Patent number: 7357699
    Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: April 15, 2008
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
  • Publication number: 20080076335
    Abstract: A polishing apparatus polish a surface of a substrate, such as a semiconductor substrate. The polishing apparatus according to the present invention includes a substrate holding mechanism, a polishing table having a polishing surface, and a polishing surface temperature controller for controlling a temperature distribution of the polishing surface. The substrate holding mechanism and the polishing table are operable to provide relative movement between the surface of the substrate and the polishing surface while the substrate holding mechanism presses the surface of the substrate against the polishing surface to thereby polish the surface of the substrate. The polishing surface temperature controller controls the temperature distribution so that the polishing surface has a predetermined temperature distribution to thereby control removal rates of portions of the surface of the substrate.
    Type: Application
    Filed: October 30, 2007
    Publication date: March 27, 2008
    Inventor: Osamu Nabeya
  • Publication number: 20080070479
    Abstract: A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.
    Type: Application
    Filed: October 31, 2005
    Publication date: March 20, 2008
    Applicant: EBARA CORPORATION
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda