Abstract: A vapor chamber that includes a casing, a pillar in an internal space of the casing and that supports the casing from an inside thereof, a working fluid in the internal space of the casing, and recessed portions in at least a portion of a main external surface of the casing.

Abstract: A vapor chamber that includes a casing, a pillar in an internal space of the casing and that supports the casing from an inside thereof, a working fluid in the internal space of the casing, and recessed portions in at least a portion of a main external surface of the casing.

Abstract: A rotary electronic component includes a base member, a shaft attached to the base member so as to be rotatable around an axis, and a regulating member that regulates a rotation angle of the shaft. The shaft includes a flange section including a projecting sections and recessed sections alternately disposed in a circumferential direction. The regulating member includes a contact member in contact with the projecting sections and the recessed sections of the flange section of the shaft, and a biasing member that biases the contact member radially inwardly toward the shaft.

Abstract: A vapor chamber that includes a casing, a pillar in an internal space of the casing and that supports the casing from an inside thereof, a working fluid in the internal space of the casing, and recessed portions in at least a portion of a main external surface of the casing.

Abstract: A rotary electronic component includes a base member, a shaft attached to the base member so as to be rotatable around an axis, and a regulating member that regulates a rotation angle of the shaft. The shaft includes a flange section including a projecting sections and recessed sections alternately disposed in a circumferential direction. The regulating member includes a contact member in contact with the projecting sections and the recessed sections of the flange section of the shaft, and a biasing member that biases the contact member radially inwardly toward the shaft.

Abstract: A rotary variable resistor includes an insulating substrate, a resistor pattern and a current collector pattern that are provided on the insulating substrate, a rotor that is mounted on the insulating substrate in a rotatable manner, and a slider that is mounted on the rotor and makes sliding contact with the resistor pattern and the current collector pattern to cause the resistor pattern and the current collector pattern to be conducted to each other. When a maximum dimension of the resistor pattern, which defines a variable resistor, is Z [mm] and electric linearity is L [%], Z?4.0 and Z×L<10 are satisfied.

Abstract: A rotary variable resistor includes an insulating substrate, a resistor pattern and a current collector pattern that are provided on the insulating substrate, a rotor that is mounted on the insulating substrate in a rotatable manner, and a slider that is mounted on the rotor and makes sliding contact with the resistor pattern and the current collector pattern to cause the resistor pattern and the current collector pattern to be conducted to each other. When a maximum dimension of the resistor pattern, which defines a variable resistor, is Z [mm] and electric linearity is L [%], Z?4.0 and Z×L<10 are satisfied.

Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

Abstract: Provided is a flux gate sensor comprising the following: a magnetic core having a first wiring layer formed on a board, a first insulating layer formed in such a way as to cover the aforementioned first wiring layer, and a magnetic core which is formed on the aforementioned first insulating layer and which has a central portion and an end portion that continues to the aforementioned central portion, that has a width larger than the width of the aforementioned central portion, and that is located on either side of the aforementioned central portion; a second insulating layer which covers the aforementioned magnetic core and which is formed on the aforementioned first insulating layer; and a second wiring layer formed on the aforementioned second insulating layer.

Abstract: Provided is a flux gate sensor comprising the following: a magnetic core having a first wiring layer formed on a board, a first insulating layer formed in such a way as to cover the aforementioned first wiring layer, and a magnetic core which is formed on the aforementioned first insulating layer and which has a central portion and an end portion that continues to the aforementioned central portion, that has a width larger than the width of the aforementioned central portion, and that is located on either side of the aforementioned central portion; a second insulating layer which covers the aforementioned magnetic core and which is formed on the aforementioned first insulating layer; and a second wiring layer formed on the aforementioned second insulating layer.

Abstract: Provided is a resin multilayer device having a balun, wherein the resin multilayer device comprises: a substrate; a first resin layer formed on the substrate; two balanced signal transmission lines that are electrically independently disposed on the first resin layer; a second resin layer formed on the two balanced signal transmission lines and the first resin layer; an unbalanced signal transmission line disposed on the second resin layer and facing the two balanced signal transmission lines; and a third resin layer formed on the unbalanced signal transmission line and the second resin layer.

Abstract: Provided is a resin multilayer device having a balun, wherein the resin multilayer device comprises: a substrate; a first resin layer formed on the substrate; two balanced signal transmission lines that are electrically independently disposed on the first resin layer; a second resin layer formed on the two balanced signal transmission lines and the first resin layer; an unbalanced signal transmission line disposed on the second resin layer and facing the two balanced signal transmission lines; and a third resin layer formed on the unbalanced signal transmission line and the second resin layer.

Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

Abstract: A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.

Abstract: A magnetic device comprises a magnetic element, a first magnetic field application device, and a second magnetic field application device. The first and second magnetic field applying means are disposed on mutually opposite sides of the magnetic element. The magnetic element is, for example, an element in which a soft magnetic film is formed in a meandering shape on a nonmagnetic substrate. The first and second magnetic field application device create a magnetic field in one direction from the first magnetic field application device toward the second magnetic field application device. The bias magnetic field in one direction is thereby applied to the entire soft magnetic film in the magnetic element disposed between the first and second magnetic field application device.

Abstract: A magnetic device comprises a magnetic element, a first magnetic field applying means, and a second magnetic field applying means. The first and second magnetic field applying means are disposed on mutually opposite sides of the magnetic element. The magnetic element is, for example, an element in which a soft magnetic film is formed in a meandering shape on a nonmagnetic substrate. The first and second magnetic field applying means create a magnetic field in one direction from the first magnetic field applying means toward the second magnetic field applying means. The bias magnetic field in one direction is thereby applied to the entire soft magnetic film in the magnetic element disposed between the first and second magnetic field applying means.

Abstract: A magnetic device comprises a magnetic element, a first magnetic field applying means, and a second magnetic field applying means. The first and second magnetic field applying means are disposed on mutually opposite sides of the magnetic element. The magnetic element is, for example, an element in which a soft magnetic film is formed in a meandering shape on a nonmagnetic substrate. The first and second magnetic field applying means create a magnetic field in one direction from the first magnetic field applying means toward the second magnetic field applying means. The bias magnetic field in one direction is thereby applied to the entire soft magnetic film in the magnetic element disposed between the first and second magnetic field applying means.

Abstract: A magnetic sensor module which includes: a semiconductor substrate including an integrated circuit for switching operation; a magneto-resistive element which is disposed on a first surface of the semiconductor substrate and has a magneto-sensitive direction in a direction along the first surface; and a bias magnetic field applying member provided on the semiconductor substrate and disposed on a surface which is parallel to the first surface, wherein: the bias magnetic field applying member is magnetized in a direction along the surface on which the bias magnetic field applying member is disposed; and when no external magnetic field is applied, the bias magnetic field applying member applies a bias magnetic field in the direction along the first surface on which the magneto-resistive element is provided.