Abstract: Provided is a mask blank having a structure in which a pattern-forming thin film, a first hard mask film, and a second hard mask film are stacked in this order on a main surface of a substrate. The pattern-forming thin film contains at least one element selected from silicon and transition metals. The first hard mask film contains chromium. The second hard mask film contains tantalum. The tantalum of the second hard mask film contains tantalum that is unsaturated with oxygen. The thickness of the pattern-forming thin film is 20 nm or more. The thickness of the first hard mask film is 15 nm or less. The thickness of the second hard mask film is 10 nm or less.

Abstract: The present invention addresses the problem of providing a mask blank that makes it possible to further miniaturize a mask pattern or a hard mask pattern and improving the pattern quality, and to resolve this problem, a mask blank (100) has a structure in which a thin film (3) for pattern formation and a hard mask film (4) are laminated in this order on a transparent substrate (1), wherein the hard mask film (4) is configured so that a narrow spectrum of Si2p obtained by analysis by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of 103 eV or more, a maximum peak of a narrow spectrum of N1s obtained by analysis by X-ray photoelectron spectroscopy is equal to or less than a detection lower limit value, and the content ratio (atomic %) of silicon and oxygen is less than Si:O=1:2.

Abstract: A mask blank 100 has a structure in which a pattern-forming thin film 3 and a hard mask film 4 are formed on a transparent substrate 1 in this order. An Si2p narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of at least 103 eV. An N1s narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak below a detection lower limit value. In the hard mask film 4, a content ratio (atomic %) of silicon and oxygen is Si:O=1:less than 2.

Abstract: Provided are a mask blank, a phase shift mask, and a method of manufacturing a semiconductor device. A mask blank comprises a light-shielding film on a transparent substrate. The light-shielding film is made of a material comprising silicon and nitrogen. An internal region of the light-shielding film has a maximum peak at a binding energy in a range in which a Si2p narrow spectrum obtained by analysis by X-ray photoelectron spectroscopy is more than 100 eV and 101.5 eV or less. The internal region of the light-shielding film is a region obtained by excluding a back surface side region on the transparent substrate side and a front surface side region opposite to the transparent substrate.

Abstract: A light shielding film made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film made up of a material containing chromium, oxygen, and carbon are laminated on a transparent substrate. The hard mask film is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for N1s in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film have a 50 atom % or more chromium content, and the maximum peak for Cr2p in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.

Abstract: A mask blank comprises a transparent substrate and a phase shift film on the transparent substrate. The phase shift film includes a lower layer and an upper layer formed on the lower layer. The upper layer is in contact with the lower layer. The lower layer includes silicon and oxygen. The upper layer includes hafnium and oxygen. The upper layer has a thickness of 5 nm or more. The phase shift film has a thickness of 90 nm or less.

Abstract: A mask blank has a substrate and a pattern-forming thin film formed on the substrate. The pattern-forming thin film is one of a single-layer film containing chromium and nitrogen or a multi-layer film comprising at least one chromium nitride-based layer. An arithmetic mean roughness Sa is 1.0 nm or less and a ratio of a maximum height Sz to the arithmetic mean roughness Sa Sz/Sa is 14 or less in a 1-?m square positioned in a central region on a surface of the pattern-forming thin film with respect to a center of the substrate.

Abstract: Provided is a mask blank. A mask blank comprising a phase shift film on a transparent substrate, the phase shift film having a structure in which a first layer, a second layer, and a third layer are layered in this order on the transparent substrate, the first layer and the third layer including hafnium and oxygen, and the second layer including silicon and oxygen, wherein when thicknesses of the first layer, the second layer, and the third layer are represented by D1, D2, and D3, respectively, all relationships of (Expression 1-A) to (Expression 1-D) are satisfied, or all relationships of (Expression 2-A) to (Expression 2-D) are satisfied.

Abstract: A light shielding film made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film made up of a material containing chromium, oxygen, and carbon are laminated on a transparent substrate. The hard mask film is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for N1s in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film have a 50 atom% or more chromium content, and the maximum peak for Cr2p in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.

Abstract: A mask blank comprises: a light-transmissive substrate; and a phase shift film formed on the light-transmissive substrate, in which the phase shift film includes a lower layer containing hafnium and oxygen and an upper layer formed on the lower layer and containing silicon, oxygen, and nitrogen, a total content of hafnium and oxygen in the lower layer is 95 atom % or more, and a content of nitrogen in the upper layer is 15 atom % or more.

Abstract: A light shielding film made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film made up of a material containing chromium, oxygen, and carbon are laminated on a transparent substrate. The hard mask film is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for N1s in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film have a 50 atom % or more chromium content, and the maximum peak for Cr2p in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.

Abstract: Provided is a mask blank. The mask blank has a structure where a thin film for pattern formation, a first hard mask film, and a second hard mask film are stacked in this order on a main surface of a substrate, the thin film for pattern formation contains a transition metal, the first hard mask film contains oxygen and one or more elements selected from silicon and tantalum, the second hard mask film contains a transition metal, a content of transition metal of the second hard mask film is less than the content of transition metal of the thin film for pattern formation, a region where the first hard mask film is formed on the main surface is smaller than a region where the thin film for pattern formation is formed, and the second hard mask film and the thin film for pattern formation are in contact with each other at least in part.

Abstract: The phase shift film has a function to transmit an exposure light of a KrF excimer laser at a transmittance of 2% or more, and a function to generate a phase difference of 150 degrees or more and 210 degrees or less between the exposure light transmitted through the phase shift film and the exposure light transmitted through the air for a same distance as a thickness of the phase shift film, in which the phase shift film has a structure where a lower layer and an upper layer are stacked in order from a side of the transparent substrate, in which a refractive index nL of the lower layer at a wavelength of the exposure light and a refractive index nU of the upper layer at a wavelength of the exposure light satisfy a relation of nL>nU, in which an extinction coefficient kL of the lower layer at a wavelength of the exposure light and an extinction coefficient kU of the upper layer at a wavelength of the exposure light satisfy a relation of kL>kU; and in which a thickness dL of the lower layer and a thicknes

Abstract: Provided is a mask blank . A transmittance adjusting film is provided on a phase shift film; the phase shift film generates a phase difference of 150 degrees or more and 210 degrees or less between an ArF excimer laser exposure light transmitted through the phase shift film and the exposure light transmitted through the air for a same distance as a thickness of the phase shift film; and a refractive index nu with respect to a wavelength of the exposure light, an extinction coefficient ku with respect to the wavelength of the exposure light, and a thickness du[nm] of the transmittance adjusting film satisfy both equations (1) and (2) given below. d U ? -17 .63 × n U 3 +142 .0 × n U 2 -364 .9 × n U +315 .8 d U ? -2 .805 × k U 3 +19 .48 × k U 2 -43 .58 × k U +38 .

Abstract: A mask blank includes a substrate and a thin film formed on the substrate, the thin film including hafnium and oxygen. A total content of hafnium and oxygen of the thin film is 95 atom % or more. An oxygen content of the thin film is 60 atom % or more. An X-ray diffraction profile of a diffraction angle 2? between 25 degrees and 35 degrees has a maximum diffraction intensity in a diffraction angle 2? between 28 degrees and 29 degrees, the X-ray diffraction profile being obtained by an X-ray diffraction analysis with an Out-of-Plane measurement with respect to the thin film.

Abstract: Provided is a mask blank (100) for manufacturing a phase shift mask, the mask blank enabling formation of a high-precision and fine pattern on a light shielding film.

Abstract: An object is to provide a mask blank A mask blank having a substrate and a thin film, the substrate includes two main surfaces and a side surface with a chamfered surface provided between the two main surfaces and the side surface, one main surface of the two main surfaces includes an inner region including a center of the main surface and an outer peripheral region outside of the inner region, the thin film is provided on the inner region of the main surface, the surface reflectance Rs of the outer peripheral region with respect to light of 400 nm to 700 nm wavelength is 10% or less, and provided that Rf is the surface reflectance with respect to light of 400 nm to 700 nm wavelength in one section among sections of the thin film in the range of 9 nm to 10 nm film thickness, the contrast ratio (Rf/Rs) is 3.0 or more.

Abstract: Provided is a reflective mask blank comprising a phase shift film having a small change in the phase difference and/or reflectance of the phase shift film even in a case where the film thickness of the phase shift film changes. A reflective mask blank comprises a multilayer reflective film and a phase shift film in this order on a main surface of a substrate. The phase shift film comprises a lower layer and an uppermost layer. The lower layer is located between the uppermost layer and the multilayer reflective film. The lower layer is formed of a material in which the total content of ruthenium and chromium is 90 atomic % or more, or a material in which the total content of ruthenium, chromium, and nitrogen is 90 atomic % or more. The uppermost layer is formed of a material in which the total content of ruthenium, chromium, and oxygen is 90 atomic % or more.

Abstract: Provided is a mask blank that can manufacture a phase shift mask. Provided is a mask blank having a phase shift film on a transparent substrate, the phase shift film contains hafnium, silicon, and oxygen, a ratio of a hafnium content to a total content of hafnium and silicon in the phase shift film by atom % is 0.4 or more, a refractive index n of the phase shift film to a wavelength of an exposure light of an Arf excimer laser is 2.5 or more, and an extinction coefficient k of the phase shift film to a wavelength of the exposure light is 0.30 or less.

Abstract: A mask blank 100 has a structure in which a pattern-forming thin film 3 and a hard mask film 4 are formed on a transparent substrate 1 in this order. An Si2p narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of at least 103 eV. An N1s narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak below a detection lower limit value. In the hard mask film 4, a content ratio (atomic %) of silicon and oxygen is Si:O=1:less than 2.