Abstract: Provided is a machine tool hand including a body portion that is mounted so as to be attachable to and detachable from a spindle of a machine tool, and that is provided with a flow path connected to a coolant-liquid supply path formed in the spindle; and two or more hand members that are attached to the body portion such that at least one of the hand members is pivotable about a prescribed axis, and that are capable of gripping an object therebetween by being closed. The flow path is provided with discharge ports via which a coolant liquid supplied from the coolant-liquid supply path is discharged toward surfaces of the hand members that are exposed to an outside, and a pressure of the coolant liquid causes an opening operation or a closing operation of the hand members.

Abstract: Provided is a machine tool hand including a body portion that is mounted so as to be attachable to and detachable from a spindle of a machine tool, and that is provided with a flow path connected to a coolant-liquid supply path formed in the spindle; and two or more hand members that are attached to the body portion such that at least one of the hand members is pivotable about a prescribed axis, and that are capable of gripping an object therebetween by being closed. The flow path is provided with discharge ports via which a coolant liquid supplied from the coolant-liquid supply path is discharged toward surfaces of the hand members that are exposed to an outside, and a pressure of the coolant liquid causes an opening operation or a closing operation of the hand members.

Abstract: Provided is a machine tool hand including a body portion that is mounted so as to be attachable to and detachable from a spindle of a machine tool, and that is provided with a flow path connected to a coolant-liquid supply path formed in the spindle; and two or more hand members that are attached to the body portion such that at least one of the hand members is pivotable about a prescribed axis, and that are capable of gripping an object therebetween by being closed. The flow path is provided with discharge ports via which a coolant liquid supplied from the coolant-liquid supply path is discharged toward surfaces of the hand members that are exposed to an outside, and a pressure of the coolant liquid causes an opening operation or a closing operation of the hand members.

Abstract: Provided is a machine tool hand including a body portion that is mounted so as to be attachable to and detachable from a spindle of a machine tool, and that is provided with a flow path connected to a coolant-liquid supply path formed in the spindle; and two or more hand members that are attached to the body portion such that at least one of the hand members is pivotable about a prescribed axis, and that are capable of gripping an object therebetween by being closed. The flow path is provided with discharge ports via which a coolant liquid supplied from the coolant-liquid supply path is discharged toward surfaces of the hand members that are exposed to an outside, and a pressure of the coolant liquid causes an opening operation or a closing operation of the hand members.

Abstract: The claim analysis process section (60) represents, by a numerical value, the scope of right recited in a claim. Furthermore, the first analysis process section (61) adds up the number of sets of patent specification data whose scopes of rights have been represented by numerical values, and calculates the average of the scopes of the rights. Since the average can be used as an index to analyze the numbers and the scopes of inventions created or filed by applicants and attorneys, it becomes possible to objectively analyze the right acquisition capabilities of applicants and attorneys.

Abstract: An air cycling type air-conditioner includes: a heat exchanger (3); a compressor (1) compressing suction air and transferring the compressed air to the heat exchanger (3), and compressing air transferred from the heat exchanger (3) and transferring the compressed air as supply air; an expander (4) expanding the suction air and transferring the expanded air to the heat exchanger (3), and expanding air transferred from the heat exchanger (3) and transferring the expanded air as the supply air; and a motor (2) driving the compressor (1) and the expander (4).

Abstract: In a method of pattern formation according to this invention, an organic polymer resist material is simultaneously used with an inorganic resist material, i.e., a first desired pattern consisting of the organic polymer resist material layer is formed on a substrate material, then the whole surface thereof is covered with the inorganic resist material layer, a second desired pattern is then formed with the inorganic resist material layer, and then the resulting second desired pattern is transferred to the organic polymer resist material. According to the invention, mask alignment can automatically be effected by detecting reflected light from an alignment mark on the substrate, formation of a relief including large and small patterns is also easily carried out, throughput can also be increased. The method of the invention may be combined with various process steps, so that such combined method is applicable for deep and shallow etching, formation of an interlayer insulation film, and lift-off method.

Abstract: A method for fabricating semiconductor devices comprising the steps of: forming on the main surface of a semiconductor substrate an inorganic photoresist layer having a first amorphous layer, which contains Se as a matrix component and includes an impurity for providing one conductivity type and a second silver, or a silver containing layer, formed on the first layer; exposing the inorganic photoresist layer with an exposure pattern; developing the exposed inorganic photoresist layer to form a patterned impurity containing inorganic photoresist layer as an impurity source layer; forming a heat resistive overcoating layer on the main surface of the semiconductor substrate, while covering the impurity source layer; and forming a doped region by diffusing impurity from the impurity source layer into a region of the substrate underlying the impurity source layer.

Abstract: This invention relates to a pattern-forming process using a radiation sensitive chalcogenide layer composed of a laminate of amorphous chalcogenide layer (2) and thin silver layer (3), and discloses a pattern-forming process characterized by etching out an amorphous chalcogenide layer (22) not doped with silver at an unexposed area under an irradiation of a light (6) or an accelerated corpuscular beam by a plasma etching with a fluorine-series gas and also a pattern-forming process wherein silver-doped amorphous chalcogenide layer (21) left on the substrate according to a given pattern by the above process is used as an etching mask and then the substrate layer (1c) is etched out by a plasma etching to form the given pattern on the substrate.

Abstract: A pattern-forming material comprises a substrate and a radiation sensitive chalcogenide layer disposed thereon. The radiation sensitive chalcogenide layer consists of an amorphous layer having a chemical composition of 75 to 95 mol% of selenium and 5 to 25 mol% of germanium and a silver layer superimposed thereon. The pattern-forming materials having the radiation sensitive chalcogenide layer of the invention are particularly useful in lithographic applications.