Patents by Inventor Osamu Ogasawara

Osamu Ogasawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125784
    Abstract: The problem addressed by the present invention is to provide an immunological assay method using a monoclonal antibody and a kit including the monoclonal antibody, which can be used for assaying ICTP without requiring special facilities. This problem can be solved by a method for immunological assay of type I collagen C-terminal telopeptide in a biological sample, including contacting type I collagen C-terminal telopeptide with a monoclonal antibody that recognizes an amino acid sequence represented by GFDFSFLP (SEQ ID NO: 1) as an epitope.
    Type: Application
    Filed: March 23, 2022
    Publication date: April 18, 2024
    Applicant: SEKISUI MEDICAL CO., LTD.
    Inventors: Shiomi HORIUCHI MORISHITA, Rikako OGASAWARA, Tomohide ASAI, Osamu MIYAZAKI
  • Publication number: 20120181738
    Abstract: An electronic part positioning jig is provided, which includes a positioning member which is made of carbon and positions an element part, and a platform which supports the positioning member on a plane. The platform includes a frame member which receives the positioning member, and a body portion which fixes the frame member. The positioning member is sandwiched between the frame member and the body portion so as to be displaceable on the body portion by the frame member being fixed to the body portion by a joining member.
    Type: Application
    Filed: January 16, 2012
    Publication date: July 19, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Keiji Hirose, Osamu Ogasawara, Koji Ishida, Yoshiyuki Yamada
  • Patent number: 5305110
    Abstract: In a chassis connection apparatus and a chassis formed by using it, a front operation block fixed to a housing by means of a claw-shaped lock mechanism is connected to a chassis frame with a main circuit installed thereon at the back of the front operation block. The chassis can be taken out of the housing by merely pulling the chassis frame backward and releasing a claw-shaped lock. In the construction described above, an engagement section is disposed in a section where the chassis connection apparatus is connected to the chassis frame, so that the chassis frame can be connected at a later time.
    Type: Grant
    Filed: October 25, 1991
    Date of Patent: April 19, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoya Taki, Osamu Ogasawara
  • Patent number: 5220712
    Abstract: A component with an unlock mechanism is unlockably locked with respect to another component by a resilient snap tooth engaging in a hole defined in the other component. To unlock the components from each other, the unlock mechanism is pulled between the components to force the snap tooth out of the hole against its resiliency. The unlock mechanism has a slant surface that slides against a slant surface of the snap tooth to displace the snap tooth out of the hole in response to the movement of the unlock mechanism.
    Type: Grant
    Filed: November 8, 1991
    Date of Patent: June 22, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoya Taki, Osamu Ogasawara