Abstract: An analysis method is provided, by which it is determined whether or not a solution to be-examined contains an organic substance in an amount on the order of 20 mass ppb or less. The analysis method for organic substances in a solution to be examined includes the following steps: a sampling step in which 500 ml or less of a sample solution is taken front a solution to be examined; an adsorption step in which the sample solution is passed through activated carbon 8 so that the organic substance is adsorbed on the activated carbon; an extraction step in which the organic substance is extracted into a hydrophobic solvent; a specimen preparation step in which, a specimen solution is prepared by using the hydrophobic solvent into which the organic substance has been extracted; and an analysis step in which an analysis is performed to determine whether or not the organic substance in an amount of 20 mass ppb or less is contained in the solution to be examined.

Abstract: Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 270° C. and lower than 660° C. to decompose the resin molded body.

Abstract: Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a step of decomposing the resin molded body by bringing the aluminum-coated resin molded body into contact with concentrated nitric acid with a concentration of 62% or more.

Abstract: Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a step of decomposing the resin molded body by bringing the aluminum-coated resin molded body into contact with concentrated nitric acid with a concentration of 62% or more.

Abstract: Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 270° C. and lower than 660° C. to decompose the resin molded body.

Abstract: A high-quality member installed in a wafer storage case is provided in which the wafer is not contaminated by the generated sulfur gas and the injection molding process is satisfactorily carried out. A member 1 installed in a case 2 for storing a wafer 3 is formed by injection molding a polybutylene terephthalate (PBT) resin. The PBT resin has a weight-average molecular weight (Mw) of 15000 to 20000. The member 1 installed in the wafer storage case is formed by injection molding so that the weight of sulfur in a sulfur-containing secondary antioxidant added to the PBT resin is 0.1% or less of the weight of the PBT resin.

Abstract: To provide a non-crosslinked flame-retardant resin composition delivering excellent heat resistance without deteriorating over a long period of time, as well as possessing sufficient flame retardancy, mechanical properties, flexibility and workability, and an insulated wire and a wiring harness using the same. The non-crosslinked flame-retardant resin composition includes (B) a metallic hydrate, (C) a hindered phenolic antioxidant, (D) a sulfurous antioxidant, and (E) a metallic oxide in (A) a non-crosslinked base resin which includes a propylene resin containing 50 wt % or more of propylene monomer. It is preferable to utilize an imdazole compound as the ingredient (D) and an oxide of zinc as the ingredient (E). In addition, the composition is used as an insulated covering material for a non-halogenous insulated wire, which is used in a wire bundle of the wiring harness.

Abstract: The invention relates to a container used to store a compound semiconductor substrate where the content of tin in the container is 1 ppm or less. Further, it relates to a container used to store a compound semiconductor substrate where the content of silicon in the container is 1 ppm or less. Further, it relates to a packaging body used to store a compound semiconductor substrate, where the content of tin in the packaging body is 1 ppm or less. Further, it relates to a manufacturing method of the container and the packaging body and a compound semiconductor substrate stored in the container and the packaging body.

Abstract: A compound semiconductor substrate includes a substrate composed of a p-type compound semiconductor; and a substance containing p-type impurity atoms, the substance being bonded to a surface of the substrate.

Abstract: To provide a non-crosslinked flame-retardant resin composition delivering excellent heat resistance without deteriorating over a long period of time, as well as possessing sufficient flame retardancy, mechanical properties, flexibility and workability, and an insulated wire and a wiring harness using the same. The non-crosslinked flame-retardant resin composition includes (B) a metallic hydrate, (C) a hindered phenolic antioxidant, (D) a sulfurous antioxidant, and (E) a metallic oxide in (A) a non-crosslinked base resin which includes a propylene resin containing 50 wt % or more of propylene monomer. It is preferable to utilize an imdazole compound as the ingredient (D) and an oxide of zinc as the ingredient (E). In addition, the composition is used as an insulated covering material for a non-halogenous insulated wire, which is used in a wire bundle of the wiring harness.