Abstract: The present invention relates to a synapse formation promoter and a brain plasticity promoter comprising CD24-negative mesenchymal stem cells prepared from a patient's own bone marrow aspirate and treatment of dementia, chronic-phase cerebral infarction, chronic-phase spinal cord injury, mental diseases, and the like using the synapse formation promoter and brain plasticity promoter.

Abstract: There is provided an image sensor including a first substrate including a plurality of pixels and a plurality of vertical signal lines and a plurality of first wiring layers and a second substrate including a plurality of second wiring layers. The first and second substrates are secured together between the pluralities of first and second wiring layers. First pads are provided between one of the plurality of first wiring layers and one of the plurality of second wiring layers and second pads are provided between another of the plurality of first wiring layers and another of the plurality of second wiring layers. First vias and second vias connect the first pads and the one of the plurality of first wiring layers and the one of the plurality of second wiring layers together.

Abstract: The purpose of the present disclosure is to improve the dynamic range of an image sensor including a polarization pixel. The image sensor includes: a high-sensitivity pixel group; and a low-sensitivity pixel group. The high-sensitivity pixel group included in the image sensor includes a plurality of high-sensitivity pixels. The low-sensitivity pixel group included in the image sensor includes a plurality of low-sensitivity pixels. A polarization unit that causes incident light in a predetermined polarization direction to be transmitted therethrough is disposed in part of pixels of at least the high-sensitivity pixel group, of the high-sensitivity pixel group and the low-sensitivity pixel group.

Abstract: There is provided a solid-state imaging device including: a pixel region that includes a plurality of pixels arranged in a two-dimensional matrix pattern. Some of the plurality of pixels are configured to be phase difference detection pixels that include a photoelectric conversion section disposed on a semiconductor substrate and a light blocking film disposed above a portion of the photoelectric conversion section. In particular a location of the light blocking film for the phase difference detection pixels varies according to a location of the phase difference detection pixel. For example, the location of the light blocking film for a phase difference detection pixel positioned at a periphery of the pixel region is different than a location of the light blocking film for a phase difference detection pixel positioned in a center portion of the pixel region.

Abstract: A solid-state image pickup apparatus includes an image pickup pixel and a focus detection pixel. The image pickup pixel includes a micro lens and a photoelectric conversion unit that receives light incident from the micro lens. The focus detection pixel includes the micro lens, the photoelectric conversion unit, and a light shielding unit that shields part of light incident on the photoelectric conversion unit. In the solid-state image pickup apparatus, the micro lens is uniformly formed in the image pickup pixel and the focus detection pixel, and the focus detection pixel further includes a high refractive index film formed under the micro lens.

Abstract: There is provided a solid-state imaging device including a wafer in which a guard ring with conductivity in an insulation film layered on a first conductivity type substrate is formed between an edge portion of at least a first chip, out of the first chip and a second chip of a layered chip, and a scribe line region, at least two second conductivity type layers are formed at an interval within a region corresponding to the guard ring, in the first conductivity type substrate, and the guard ring includes a first guard ring part connected to one of the second conductivity type layers on a chip edge portion side, and a second guard ring part connected to another one of the second conductivity type layers on a scribe line side.

Abstract: There is provided a solid-state imaging device including a wafer in which a guard ring with conductivity in an insulation film layered on a first conductivity type substrate is formed between an edge portion of at least a first chip, out of the first chip and a second chip of a layered chip, and a scribe line region, at least two second conductivity type layers are formed at an interval within a region corresponding to the guard ring, in the first conductivity type substrate, and the guard ring includes a first guard ring part connected to one of the second conductivity type layers on a chip edge portion side, and a second guard ring part connected to another one of the second conductivity type layers on a scribe line side.

Abstract: There is provided a solid-state imaging device including: a pixel region that includes a plurality of pixels arranged in a two-dimensional matrix pattern. Some of the plurality of pixels are configured to be phase difference detection pixels that include a photoelectric conversion section disposed on a semiconductor substrate and a light blocking film disposed above a portion of the photoelectric conversion section. In particular a location of the light blocking film for the phase difference detection pixels varies according to a location of the phase difference detection pixel. For example, the location of the light blocking film for a phase difference detection pixel positioned at a periphery of the pixel region is different than a location of the light blocking film for a phase difference detection pixel positioned in a center portion of the pixel region.

Abstract: A method for producing a high-zinc-content yeast extract, including extracting the high-zinc-content yeast extract by suspending zinc-containing yeast into a solution containing a carboxylic acid, a carboxylic acid salt, or both thereof to thereby obtain a suspension liquid, and separating a solid component and a liquid component of the suspension liquid; the high-zinc-content yeast extract; food; and an agent for maintaining and restoring a green color of vegetables.

Abstract: There is provided a solid-state imaging device including a wafer in which a guard ring with conductivity in an insulation film layered on a first conductivity type substrate is formed between an edge portion of at least a first chip, out of the first chip and a second chip of a layered chip, and a scribe line region, at least two second conductivity type layers are formed at an interval within a region corresponding to the guard ring, in the first conductivity type substrate, and the guard ring includes a first guard ring part connected to one of the second conductivity type layers on a chip edge portion side, and a second guard ring part connected to another one of the second conductivity type layers on a scribe line side.

Abstract: [Problem] To provide: a novel quality-preserving agent which can preserve the quality of a peeled and/or cut vegetable or fruit or seafood during storage in a simple manner and effectively and is highly safe; and others. [Solution] The quality-preserving agent contains two components, i.e., sodium acetate and ?-lipoic acid, as active ingredients. The quality-preserving agent can prevent the discoloration, brownish discoloration or the like of a peeled and/or cut vegetable or fruit or seafood during chilled storage and ambient-temperature storage of the vegetable or fruit or the seafood, can improve the shelf life of the vegetable or fruit or the seafood, and can preserve the quality of the vegetable or fruit or the seafood in a simple manner and effectively merely by bringing the vegetable or fruit or the seafood into contact with the quality-preserving agent.

Abstract: A solid-state image pickup apparatus includes an image pickup pixel and a focus detection pixel. The image pickup pixel includes a micro lens and a photoelectric conversion unit that receives light incident from the micro lens. The focus detection pixel includes the micro lens, the photoelectric conversion unit, and a light shielding unit that shields part of light incident on the photoelectric conversion unit. In the solid-state image pickup apparatus, the micro lens is uniformly formed in the image pickup pixel and the focus detection pixel, and the focus detection pixel further includes a high refractive index film formed under the micro lens.

Abstract: There is provided a solid-state imaging device including a sensor substrate having a sensor-side semiconductor layer including a pixel region in which a photoelectric conversion section is provided and a sensor-side wiring layer provided on an opposite surface side from a light receiving surface of the sensor-side semiconductor layer, a circuit substrate having a circuit-side semiconductor layer and a circuit-side wiring layer and provided on a side of the sensor-side wiring layer of the sensor substrate, a connection unit region in which a connection section is provided, the connection section having a first through electrode, a second through electrode, and a connection electrode connecting the first through electrode and the second through electrode, and an insulating layer having a step portion which has the connection electrode embedded therein and has a film thickness that gradually decreases from the connection unit region to the pixel region.

Abstract: A method for producing a high-zinc-content yeast extract, including extracting the high-zinc-content yeast extract by suspending zinc-containing yeast into a solution containing a carboxylic acid, a carboxylic acid salt, or both thereof to thereby obtain a suspension liquid, and separating a solid component and a liquid component of the suspension liquid; the high-zinc-content yeast extract; food; and an agent for maintaining and restoring a green color of vegetables.

Abstract: There is provided a solid-state imaging device including a sensor substrate having a sensor-side semiconductor layer including a pixel region in which a photoelectric conversion section is provided and a sensor-side wiring layer provided on an opposite surface side from a light receiving surface of the sensor-side semiconductor layer, a circuit substrate having a circuit-side semiconductor layer and a circuit-side wiring layer and provided on a side of the sensor-side wiring layer of the sensor substrate, a connection unit region in which a connection section is provided, the connection section having a first through electrode, a second through electrode, and a connection electrode connecting the first through electrode and the second through electrode, and an insulating layer having a step portion which has the connection electrode embedded therein and has a film thickness that gradually decreases from the connection unit region to the pixel region.

Abstract: There is provided a solid-state imaging device including a wafer in which a guard ring with conductivity in an insulation film layered on a first conductivity type substrate is formed between an edge portion of at least a first chip, out of the first chip and a second chip of a layered chip, and a scribe line region, at least two second conductivity type layers are formed at an interval within a region corresponding to the guard ring, in the first conductivity type substrate, and the guard ring includes a first guard ring part connected to one of the second conductivity type layers on a chip edge portion side, and a second guard ring part connected to another one of the second conductivity type layers on a scribe line side.

Abstract: An adhesive composition for semiconductor device, comprising 10 to 30% by weight of a reactive elastomer (A), 40 to 65% by weight of an epoxy resin (B) having two or more glycidyl ether groups, a phenol resin (C) and a curing accelerator (D), wherein a ratio of the epoxy resin (B) to the phenol resin (C) is within a range from 1:0.6 to 1:1 in terms of a functional group equivalent ratio, and an adhesive sheet for a semiconductor device using the same are provided. The composition and the sheet are superior in reflow resistance and short-time and low-temperature bonding without lowering characteristics such as heat resistance, low hygroscopicity, high adhesion and electrical insulating properties of an epoxy resin cured article.

Abstract: The present invention relates to an enzyme immunoassay method for assaying calcium ion, including putting calcium-dependent glutamate dehydrogenase, namely glutamate dehydrogenase (GLDH) never expressing its activity in the absence of calcium ion, in contact to the calcium ion in a sample to assay the enzyme activity of the GLDH, the activity changing depending on the calcium ion concentration in the sample; and the invention also relates to an assay reagent for use in the same. Because the reagent is very stable in a solution state under storage, the reagent can be incorporated in a liquid reagent. Thus, the calcium in a biological material or other samples can be assayed in a simple and accurate manner.

Abstract: An adhesive sheet for producing semiconductor devices, such as QFNs, can prevent the generation both of wire-bonding defects and mold flashes, and can thereby prevent the production of defective semiconductor devices. The present invention provides an adhesive sheet for producing semiconductor devices which is detachably attached to a lead frame and which comprises a heat resistant substrate and an adhesive layer which is arranged on one surface of the heat resistant substrate, wherein the adhesive layer contains, a thermosetting resin component (a) and a thermoplastic resin component (b); and the weight ratio of the component (a)/the component (b) is 0.3 to 3.

Abstract: A recombinant human creatine kinase heterodimer with solution-stability is disclosed. The CK heterodimer is characterized by being produced by using a vector which contains a nucleic acid encoding the M type subunit of creatine kinase and a nucleic acid encoding the B type subunit thereof.