Patents by Inventor Osamu Okafuji

Osamu Okafuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070074382
    Abstract: The invention provides a shape member manufacturing apparatus and a shape member manufacturing method which aims at cutting and grinding a joint projection 8B formed when a plurality of shape members are joined together by welding or friction stir welding, in a short time with high accuracy. A plurality of mounts 11 having a side structure 8 placed thereon are arranged in the longitudinal direction of the side structure. A joint projection 8B of a welded portion or a friction stir welded joint is formed on the surface of the side structure 8 in its longitudinal direction. A carrier 100 travels in the longitudinal direction of the side structure 8. Columns 105 are installed in a girder 103 of the carrier, and a milling cutter device 80 and a grinding device 90 are installed in lower portions of the columns 105. A milling surface of a milling cutter 81 of the milling cutter device 80 has a circular-arc shape with a radius R.
    Type: Application
    Filed: December 1, 2006
    Publication date: April 5, 2007
    Inventors: Osamu Okafuji, Koji Hamada, Takeshi Yano, Kazushige Fukuyori
  • Patent number: 7171735
    Abstract: The invention provides a shape member manufacturing apparatus and a shape member manufacturing method which aims at cutting and grinding a joint projection 8B formed when a plurality of shape members are joined together by welding or friction stir welding, in a short time with high accuracy. A plurality of mounts 11 having a side structure 8 placed thereon are arranged in the longitudinal direction of the side structure. A joint projection 8B of a welded portion or a friction stir welded joint is formed on the surface of the side structure 8 in its longitudinal direction. A carrier 100 travels in the longitudinal direction of the side structure 8. Columns 105 are installed in a girder 103 of the carrier, and a milling cutter device 80 and a grinding device 90 are installed in lower portions of the columns 105. A milling surface of a milling cutter 81 of the milling cutter device 80 has a circular-arc shape with a radius R.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: February 6, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Osamu Okafuji, Koji Hamada, Takeshi Yano, Kazushige Fukuyori
  • Publication number: 20060059671
    Abstract: The invention provides a shape member manufacturing apparatus and a shape member manufacturing method which aims at cutting and grinding a joint projection 8B formed when a plurality of shape members are joined together by welding or friction stir welding, in a short time with high accuracy. A plurality of mounts 11 having a side structure 8 placed thereon are arranged in the longitudinal direction of the side structure. A joint projection 8B of a welded portion or a friction stir welded joint is formed on the surface of the side structure 8 in its longitudinal direction. A carrier 100 travels in the longitudinal direction of the side structure 8. Columns 105 are installed in a girder 103 of the carrier, and a milling cutter device 80 and a grinding device 90 are installed in lower portions of the columns 105. A milling surface of a milling cutter 81 of the milling cutter device 80 has a circular-arc shape with a radius R.
    Type: Application
    Filed: March 9, 2005
    Publication date: March 23, 2006
    Inventors: Osamu Okafuji, Koji Hamada, Takeshi Yano, Kazushige Fukuyori
  • Patent number: 5345978
    Abstract: An electrical interconnection assembly which prevents a slack of insulated wire pieces interconnecting wire receiving terminals and is high in reliability in electric connection between them and suitable for high density wiring. The assembly comprises an insulating support body, a plurality of wire receiving terminals mounted on the insulating support body and each having a wire receiving slot formed at an end portion thereof, each of the wire receiving terminals having a terminal portion at the other end thereof, an insulated wire selectively received in the slots of the wire receiving terminals and cut into a plurality of wire pieces in such a manner as to form a predetermined wiring pattern, and a plurality of wire holding bosses provided on the insulating support body for holding intermediate portions of the wire pieces extending between the wire receiving terminals to retain the insulated wire in the predetermined wiring pattern.
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: September 13, 1994
    Assignee: Yazaki Corporation
    Inventors: Osamu Okafuji, Akiyoshi Sato, Akio Yamaguchi
  • Patent number: 5289633
    Abstract: An electrical interconnection assembly which prevents a slack of insulated wire pieces interconnecting wire receiving terminals and is high in reliability in electric connection between them and suitable for high density wiring. The assembly comprises an insulating support body, a plurality of wire receiving terminals mounted on the insulating support body and each having a wire receiving slot formed at an end portion thereof, each of the wire receiving terminals having a terminal portion at the other end thereof, an insulated wire selectively received in the slots of the wire receiving terminals and cut into a plurality of wire pieces in such a manner as to form a predetermined wiring pattern, and a plurality of wire holding bosses provided on the insulating support body for holding intermediate portions of the wire pieces extending between the wire receiving terminals to retain the insulated wire in the predetermined wiring pattern.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: March 1, 1994
    Assignee: Yazaki Corporation
    Inventors: Osamu Okafuji, Akiyoshi Sato, Yamaguchi, Akio
  • Patent number: 5156557
    Abstract: An electrical interconnection assembly which prevents a slack of insulated wire pieces interconnecting wire receiving terminals and is high in reliability in electric connection between them and suitable for high density wiring. The assembly comprises an insulating support body, a plurality of wire receiving terminals mounted on the insulating support body and each having a wire receiving slot formed at an end portion thereof, each of the wire receiving terminals having a terminal portion at the other end thereof, an insulated wire selectively received in the slots of the wire receiving terminals and cut into a plurality of wire pieces in such a manner as to form a predetermined wiring pattern, and a plurality of wire holding bosses provided on the insulating support body for holding intermediate portions of the wire pieces extending between the wire receiving terminals to retain the insulated wire in the predetermined wiring pattern.
    Type: Grant
    Filed: November 1, 1991
    Date of Patent: October 20, 1992
    Assignee: Yazaki Corporation
    Inventors: Osamu Okafuji, Akiyoshi Sato, Akio Yamaguchi