Abstract: Provided is a separation and recovery apparatus for continuously separating and recovering, from a resin mixture containing a resin containing a hydrolyzable polymer and a resin containing a nonhydrolyzable polymer, a hydrolytic component a of the hydrolyzable polymer A and the nonhydrolyzable polymer B, the apparatus including: a crushing unit that crushes the resin mixture a melting/discharging unit that melts a crushed product obtained by the crushing unit to form a fluid and discharges the fluid at a high pressure; and a hydrothermal reaction treatment unit that continuously subjects the fluid discharged from the melting/discharging unit to a hydrothermal reaction treatment, wherein, in the melting/discharging unit, the hydrolyzable polymer A is hydrolyzed, and the hydrolytic component a thereof is dissolved and transferred into water permeating a sintered alloy diaphragm, thereby separating the nonhydrolyzable polymer B.

Abstract: A novel compound represented by the following general formula (1), or a salt thereof, which has a superior EP4 receptor agonist activity, and a medicament containing the compound or a salt thereof as an active ingredient, which can be used for promotion of osteogenesis, therapeutic treatment and/or promotion of healing of fracture and the like.

Abstract: A novel compound represented by the following general formula (1), or a salt thereof, which has a superior EP4 receptor agonist activity, and a medicament containing the compound or a salt thereof as an active ingredient, which can be used for promotion of osteogenesis, therapeutic treatment and/or promotion of healing of fracture and the like.

Abstract: A novel compound represented by the following general formula (1), or a salt thereof, which has a superior EP4 receptor agonist activity, and a medicament containing the compound or a salt thereof as an active ingredient, which can be used for promotion of osteogenesis, therapeutic treatment and/or promotion of healing of fracture and the like.

Abstract: An external unit is externally attached to a storage-medium storage device. The external unit includes a verification unit that verifies whether a storage medium that is about to be inserted in a storage slot of the storage-medium storage device is legitimate, and an open/close unit that opens the storage slot so that the storage medium can be inserted in the storage slot only upon the verifying unit verifying that the storage medium is legitimate.

Abstract: A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.

Abstract: An external unit is externally attached to a storage-medium storage device. The external unit includes a verification unit that verifies whether a storage medium that is about to be inserted in a storage slot of the storage-medium storage device is legitimate, and an open/close unit that opens the storage slot so that the storage medium can be inserted in the storage slot only upon the verifying unit verifying that the storage medium is legitimate.

Abstract: A method of manufacturing an optical device including: on at least one of a light transmitting first substrate and a second substrate which includes a first optical element having a first optical portion and a second optical element having a second optical portion, forming a first spacer in a form to surround the first optical portion, and then forming a second spacer in a form to surround the second optical portion; sealing the first and second optical portions with the first substrate and the first and second spacers by connecting the first substrate to the second substrate with the first and second spacers interposed; and cutting the second substrate to separate the first and second optical elements respectively having the first and second sealed optical portions.

Abstract: A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.

Abstract: A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.

Abstract: A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.

Abstract: An optical module includes an interconnect board which has a base board and an interconnecting pattern formed on the base board; an optical chip which has an optical section and an electrode which electrically connects the optical section and the interconnecting pattern; and a body material which holds a lens which concentrates light on the optical section. The body material is directly attached to the optical chip.

Abstract: A method of manufacturing an optical device including: on at least one of a light transmitting first substrate and a second substrate which includes a first optical element having a first optical portion and a second optical element having a second optical portion, forming a first spacer in a form to surround the first optical portion, and then forming a second spacer in a form to surround the second optical portion; sealing the first and second optical portions with the first substrate and the first and second spacers by connecting the first substrate to the second substrate with the first and second spacers interposed; and cutting the second substrate to separate the first and second optical elements respectively having the first and second sealed optical portions.

Abstract: An optical module is provided which includes a wiring substrate including a flexible substrate and a wiring pattern formed thereon, an optical chip including an electrode that is electrically connected to the wiring pattern and an optical section, and a base member that holds a lens that focuses light on the optical section. A surface of the optical chip having the electrode is opposite to the wiring substrate. The wiring substrate includes a light-transmissive section at a location that overlaps the optical section. The base member is affixed to the optical chip through the wiring substrate.

Abstract: A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.

Abstract: A method of manufacturing a semiconductor device includes (a) connecting a first substrate with a second substrate disposed to be stacked on the first substrate and (b) cutting the first substrate and the second substrate in the same process with a cutting tool. The cutting tool includes a plurality of cutters disposed close to each other, having different cut widths and the first substrate and the second substrate are cut with the cutting tool so that the first substrate and the second substrate have different cut widths, in step (b).

Abstract: The present invention is a semiconductor device which can improve the adhesive force between a semiconductor chip substrate. This semiconductor device 60 has a semiconductor chip 18, a die pad (metallic portion) 16 on which the semiconductor chip 18 is fixedly mounted and supported through an adhesive layer 62, and a sealing resin 24 for sealing the die pad 16 and semiconductor chip 18. The adhesive layer 62 includes a plurality of conductive adhesive regions 66 and a plurality of insulative adhesive regions 64 together.

Abstract: A library apparatus having components permitting accurate and straightforward assembly. The library apparatus includes respective cell, drive, accessor and passage units, each having box shaped housings including a connection mechanism. A coupling couples the housings of the passage units with the other units. Other features of the library apparatus include a reference mark on the accessor unit which permits a transport mechanism in the passage unit to correct positional errors of the transport mechanism to other components.