Abstract: A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel and is mounted on the base substrate within the cavity; and a getter material of a metallic film that is formed on the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. A restriction portion, which is arranged in the cavity and restricts a scattering direction of the getter material evaporated by the heating to suppress a scattering amount scattering toward the vibration arm portion, is formed in the base substrate or the lid substrate.

Abstract: Providing a piezoelectric vibrator and a manufacturing method thereof which is capable of achieving gettering in a state where the frequency change of the piezoelectric vibrating reed is suppressed. Providing a piezoelectric vibrator 1 including: a package 9 having a base board 2 and a lid board 3 which are bonded in a superimposed state and a cavity C formed between both boards 2, 3; and a piezoelectric vibrating reed 4 and a gettering material 27 which are accommodated in the same cavity C, wherein a shielding wall 21 is provided in the cavity C so as to shield the piezoelectric vibrating reed 4 from the gettering material 27, and the shielding wall 21 is connected to both the base board 2 and the lid board 3.

Abstract: A process of manufacturing a piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through- electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed in the base substrate by utilizing an electroconductive tack member having a tabular basis part and a core part extending from the basis part toward a di

Abstract: A method for manufacturing a plurality of piezoelectric vibrators includes forming, in the lid substrate wafer, a plurality of cavity recesses forming a plurality of through-electrodes in and through the base substrate wafer; bonding the plural piezoelectric vibration members to the upper face of the base substrate wafer via routing electrodes; overlaying the base substrate wafer and the lid substrate wafer; bonding the base substrate wafer and the lid substrate wafer; and cutting the two bonded wafers into the plural piezoelectric vibrators. Forming the plurality of through-holes includes disposing electroconductive core members having two flat ends and a thickness substantially equal to that of the base substrate wafer, in the plurality of through-holes, and disposing connection members between the core members and the through-holes; and firing the connection members at a predetermined temperature to integrally fix the through-hole, the connection member and the core member to each other.

Abstract: A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel and is mounted on the base substrate within the cavity; and a getter material of a metallic film that is formed on the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. A restriction portion, which is arranged in the cavity and restricts a scattering direction of the getter material evaporated by the heating to suppress a scattering amount scattering toward the vibration arm portion, is formed in the base substrate or the lid substrate.

Abstract: Providing a piezoelectric vibrator and a manufacturing method thereof which is capable of achieving gettering in a state where the frequency change of the piezoelectric vibrating reed is suppressed. Providing a piezoelectric vibrator 1 including: a package 9 having a base board 2 and a lid board 3 which are bonded in a superimposed state and a cavity C formed between both boards 2, 3; and a piezoelectric vibrating reed 4 and a gettering material 27 which are accommodated in the same cavity C, wherein a shielding wall 21 is provided in the cavity C so as to shield the piezoelectric vibrating reed 4 from the gettering material 27, and the shielding wall 21 is connected to both the base board 2 and the lid board 3.

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively.

Abstract: The piezoelectric vibrator manufacturing method of the invention is a method for manufacturing a plurality of piezoelectric vibrators in which a piezo-electric vibration member is sealed up in a cavity formed between a base substrate and a lid substrate bonded to each other, all at once by utilizing a base substrate wafer and a lid substrate wafer, and the method comprises a recess forming step of forming, in the lid substrate wafer, a plurality of cavity recesses for forming cavities when the two wafers are overlaid; a through-electrode forming step of forming a plurality of through-electrodes in and through the base substrate wafer; a routing electrode forming step of forming a plurality of routing electrodes connected electrically with the through-electrodes, on the upper face of the base substrate wafer; a mounting step of bonding the plural piezoelectric vibration members to the upper face of the base substrate wafer via the routing electrodes; an overlaying step of overlaying the base substrate wafer an

Abstract: The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively.

Abstract: An organic EL device has a hole injecting electrode (2), an electron injecting electrode (6), an organic layer participating in a light emitting function disposed between the electrodes. The organic layer includes a light emitting layer (4) comprising a conjugated polymer. The device further includes an inorganic insulative hole injecting layer (3) or an inorganic insulative electron injecting layer (5). The device can take advantage of both organic and inorganic materials, and has an improved efficiency, an extended effective life, and a low cost.

Abstract: An organic electroluminescent device having high efficiency, a long life time, and low cost, includes a substrate, a hole injecting electrode and an electron injecting electrode formed on the substrate, an organic material-containing organic layer between the electrodes, and an inorganic insulative electron injecting and transporting layer between the light emitting layer and the electron injecting electrode. The organic layer includes a light emitting layer containing a conjugated polymer, and the inorganic insulative electron injecting and transporting layer comprises three components. The first component is at least one oxide selected from the group consisting of lithium oxide, rubidium oxide, potassium oxide, sodium oxide, and cesium oxide. The second component is at least one of strontium oxide, magnesium oxide, and calcium oxide. The third component consists of silicon oxide, germanium oxide, or mixtures thereof.

Abstract: An organic EL structure is received in a gas-tight casing to construct an organic EL display assembly. The organic EL structure includes a hole injecting electrode, an electron injecting electrode, and at least one organic layer disposed between the electrodes. A desiccant selected from calcium hydride, strontium hydride and a mixture thereof is disposed in the casing out of contact with the organic EL structure. This EL display assembly substantially eliminates the influence of moisture and has a long lifetime.

Abstract: An organic EL device comprises a substrate, an organic EL structure stacked on the substrate, a sealing plate located on the organic EL structure with a predetermined space therebetween, and a sealing adhesive agent for fixing the sealing plate on the substrate and thereby closing up the organic EL structure. The sealing adhesive agent is a photo-curing type adhesive agent which, upon photo-curing, generates gases under heating conditions of 85° C. and 60 minutes. In these gases, the total amount of a low-molecular straight-chain aliphatic hydrocarbon which may have a substituent, an aromatic hydrocarbon which may have a substituent, an alicyclic hydrocarbon which may have a substituent, and a heterocyclic compound and a siloxane which may have a substituent is 200 &mgr;g/g or lower calculated as benzene.

Abstract: An organic EL structure is formed on a substrate 1, and a sealing sheet is located at a position above the substrate, where the sealing sheet comes in no contact with the organic EL structure. A height from the surface of the substrate, on which an organic EL device structure in a film form is provided, to a junction of the sealing sheet with the substrate has a value larger than the value obtained by adding the size of an irregularity or undulation of the sealing sheet to the height of the organic EL structure.

Abstract: The invention provides an organic electroluminescent light emitting device comprising essentially comprising a substrate, a hole injecting electrode formed on at least said substrate, a light emitting layer and an electron injecting electrode containing a constituting material having a work function of up to 4 eV. The electron injecting electrode has a sealing film on a side thereof not opposite to the substrate. This sealing film contains one or two or more of an oxide, a nitride and a carbide of the constituting material for the electron injecting electrode, and so can be relatively easily formed continuously from the electron injecting electrode without any dedicated equipment for sealing films, while maintaining a high sealing effect. The invention also provides a process of producing such an organic electroluminescent light emitting device.

Abstract: An organic EL device includes a substrate (21), a hole infecting electrode (22), an electron injecting electrode (25), and organic layers (23, 24) disposed between the electrodes. The hole injecting electrode (22) is an ITO electrode having (111) orientation. Due to improved film formation, close contact and physical properties at the interface between the hole injecting electrode and the organic layer, the device has a long lifetime, high luminance, high efficacy, and quality display and prevents the occurrence of current leakage and dark spots.

Abstract: The invention provides an organic EL display device fabrication system comprising a loading side normal-pressure delivery chamber 11 including a first substrate delivery means 61 for delivering a substrate with no film formed thereon, and a loading chamber 21 connected thereto for introducing the substrate from loading side normal-pressure delivery chamber 11 at normal pressure into a vacuum delivery chamber 31 at a vacuum. The vacuum delivery chamber 31 is connected to loading chamber 21 and includes a second substrate delivery means 62 for delivering the substrate in a vacuum, and has one or two or more film formation chambers 32 to 35 connected thereto. The system further comprises an unloading chamber 41 connected thereto for delivering the substrate out of vacuum delivery chamber 31 at a vacuum into an unloading side normal-pressure delivery chamber 51 at normal pressure.

Abstract: An organic EL color display which can give off color light without recourse to a plurality of light emitting layers and be fabricated at low cost is built up of an organic EL color display comprising an organic EL light emitting device for emitting bluish green light, a blue transmitting layer, a green transmitting layer, a fluorescence converting layer that absorbs bluish green light and giving off light including red light, and a red transmitting layer.

Abstract: An organic electroluminescent display includes a substrate (1), and, in order from the substrate, a hole injection electrode, at least one organic layer, an electron injecting electrode, and a sealing plate, and wherein the substrate further includes thereon an element-isolating structure (7,8) for isolating planar structures of the organic layer and the electron injection electrode from each other during film formation, the element isolating structure being a solid structure containing a base part formed on the substrate side and an overhang part larger in width than the base part, and provided on a portion where the organic layer is isolated from the electron injecting electrode as well as other portions, so that the element isolating structure can function as a spacer for the sealing plate, and at least one type of filter layer (14a-14c) is interleaved between the element-isolating structure serving as the spacer and the substrate.