Abstract: A method for improving residual stress of a structure member, comprising steps of: disposing coolant vessels around a pipe being the structure member at an upstream position and a downstream position of a welded portion of the pipe; wrapping a heat insulation member around an outer periphery of the pipe at a center portion in an axial direction of the pipe in each of the coolant vessels; forming the ice plug in the pipe at each position disposing the coolant vessels by cooling an outer surface of the pipe wrapping the heat insulation member in the coolant vessels; and freezing water between the ice plugs in the pipe by cooling the outer surface of the pipe between the ice plugs.

Abstract: A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Abstract: A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Abstract: A resin composition for a coating for an optical fiber which comprises a radical polymerizable oligomer (A) and a radical polymerizable monomer (B), wherein (A) comprises a radical polymerizable oligomer (A1) with Mn of 600 to 1600 formed by reacting compounds (1) to (3) below: (1) an aliphatic polyol compound with Mn of 50 to 600, (2) a polyisocyanate compound with a ring structure, and (3) a compound with a hydroxyl group and a radical polymerizable unsaturated group; and a radical polymerizable oligomer (A2) formed by reacting compounds (4) to (6) below: (4) an aliphatic polyol compound with Mn of 800 to 10,000, (5) a polyisocyanate compound, and (6) a compound with a hydroxyl group and a radical polymerizable unsaturated group; a mass ratio (A1)/(A2) is 20/80 to 80/20, and a concentration of urethane linkages within the resin composition is 1.85 to 3.00 mol/kg.

Abstract: A resin composition for an optical fiber is provided which can be sufficiently cured even in high-speed processing (at a low light energy dose) to obtain a cured article having a Young's modulus suitable for use for an optical fiber, and also causes neither increase in viscosity nor deposition of solids in storage for a long period or in storage at a high temperature and can be easily coated even after such storage. A coated fiber and an optical fiber unit, which use the resin composition are also provided.

Abstract: A pedal support structure for use in a vehicle contains a toe board, a steering support beam, a master cylinder, a pair of pedal support elements including pedal support portions, a supporting mechanism provided between the pedal support portions supporting a pedal lever, and a catcher bracket. When an impact is applied to the vehicle, the pedal support portions are spread apart so as to disconnect the pedal lever from the pedal supporting mechanism and the movement of the pedal lever in a direction toward an operator of the vehicle is restricted by the pedal lever contacting the catcher bracket.

Abstract: A resin composition for a coating for an optical fiber which comprises a radical polymerizable oligomer (A) and a radical polymerizable monomer (B), wherein (A) comprises a radical polymerizable oligomer (A1) with Mn of 600 to 1600 formed by reacting compounds (1) to (3) below: (1) an aliphatic polyol compound with Mn of 50 to 600, (2) a polyisocyanate compound with a ring structure, and (3) a compound with a hydroxyl group and a radical polymerizable unsaturated group; and a radical polymerizable oligomer (A2) formed by reacting compounds (4) to (6) below: (4) an aliphatic polyol compound with Mn of 800 to 10,000, (5) a polyisocyanate compound, and (6) a compound with a hydroxyl group and a radical polymerizable unsaturated group; a mass ratio (A1)/ (A2) is 20/80 to 80/20, and a concentration of urethane linkages within the resin composition is 1.85 to 3.00 mol/kg.

Abstract: A resin composition for an optical fiber is provided which can be sufficiently cured even in high-speed processing (at a low light energy dose) to obtain a cured article having a Young's modulus suitable for use for an optical fiber, and also causes neither increase in viscosity nor deposition of solids in storage for a long period or in storage at a high temperature and can be easily coated even after such storage. A coated fiber and an optical fiber unit, which use the resin composition are also provided.

Abstract: A pedal support structure for use in a vehicle contains a toe board, a steering support beam, a master cylinder, a pair of pedal support elements including pedal support portions, a supporting mechanism provided between the pedal support portions supporting a pedal lever, and a catcher bracket. When an impact is applied to the vehicle, the pedal support portions are spread apart so as to disconnect the pedal lever from the pedal supporting mechanism and the movement of the pedal lever in a direction toward an operator of the vehicle is restricted by the pedal lever contacting the catcher bracket.

Abstract: There is provided a molding-condition recovery device which may easily recover the molding condition having been applied in the past, and also permits the storage of the past molding conditions in a memory having small capacity. A reduction in required memory capacity of the modification history storage file is permitted by storing only data of a component subjected to setting modification, among the components of the molding condition, in a modification history storage file. The recovery of the past molding condition is made by replacing all the set values of the presently-applied molding condition or the data in a temporary file stored with all the set values of the first molding condition with data in the modification history storage file in sequence.