Abstract: Disclosed is a technique for ranking a driver's fuel efficiency among other drivers based on various variables associated with the environment in which the vehicle is being driven. More particularly, the present invention, selects, as a category, one or more factors affecting fuel efficiency, and, as one or more, variables another one or more. Vehicle data is then collected by a communications device which is associated with a particular trip. Next an average of the fuel efficiencies and an average of the variables for the trip are calculated accordingly the selected one more categories. The fuel efficiency of the trip corresponding to a same category for every coordinate point of the variable is then statistically processed to calculate the average of the fuel efficiency and the standard deviation of the fuel efficiency and regularized (processed as a GAP calculation) to determine the ranking of a vehicle driver.

Abstract: Disclosed is a technique for ranking a driver's fuel efficiency among other drivers based on various variables associated with the environment in which the vehicle is being driven. More particularly, the present invention, selects, as a category, one or more factors affecting fuel efficiency, and, as one or more, variables another one or more. Vehicle data is then collected by a communications device which is associated with a particular trip. Next an average of the fuel efficiencies and an average of the variables for the trip are calculated accordingly the selected one more categories. The fuel efficiency of the trip corresponding to a same category for every coordinate point of the variable is then statistically processed to calculate the average of the fuel efficiency and the standard deviation of the fuel efficiency and regularized (processed as a GAP calculation) to determine the ranking of a vehicle driver.

Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.

Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.