Patents by Inventor Osamu Shindo

Osamu Shindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230382069
    Abstract: Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46, and a support member 45 supporting the lower jig plate 46 and providing a support force to the lower jig plate 46 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 30, 2023
    Applicant: TDK CORPORATION
    Inventors: Yohei SATO, Osamu SHINDO, Hiroshi KOIZUMI, Makoto YAMASHITA, Yasuo KATO, Mitsuyoshi MAKIDA, Masashi MATSUMOTO
  • Publication number: 20230381904
    Abstract: A substrate processing apparatus 10 having a lower jig plate 46 for arranging a substrate 2 as an object to be pressurized, a support member 45 including an installation portion 52 for installing columnar members 50 supporting the lower jig plate 46, in which the columnar members 50 are placed to the installation portion 52 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 30, 2023
    Applicant: TDK CORPORATION
    Inventors: Yohei SATO, Hiroshi KOIZUMI, Toshinobu MIYAGOSHI, Osamu SHINDO, Seijiro SUNAGA, Makoto YAMASHITA, Yasuo KATO, Mitsuyoshi MAKIDA, Masashi MATSUMOTO
  • Publication number: 20230382070
    Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 30, 2023
    Applicant: TDK CORPORATION
    Inventors: Yohei SATO, Hiroshi KOIZUMI, Toshinobu MIYAGOSHI, Osamu SHINDO, Seijiro SUNAGA, Mitsuyoshi MAKIDA, Makoto YAMASHITA, Yasuo KATO, Ryo SHINDO, Masashi MATSUMOTO
  • Publication number: 20230381903
    Abstract: A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 30, 2023
    Applicant: TDK CORPORATION
    Inventors: Yohei SATO, Hiroshi KOIZUMI, Osamu SHINDO, Mitsuyoshi MAKIDA, Masashi MATSUMOTO
  • Publication number: 20230184339
    Abstract: There are provided a steam valve and the like capable of preventing breakage of an auxiliary valve element and effectively suppressing the occurrence of a leak of steam in the auxiliary valve element. In the steam valve of an embodiment, the auxiliary valve element is structured to be in an open state in which the valve rod moves in an opening direction to increase a distance between an auxiliary-valve cap and a main valve element, thereby opening an auxiliary-valve steam introduction hole, and to be in a fully-closed state in which the valve rod moves in a closing direction in which the main valve element is closed to bring the auxiliary-valve cap and the main valve element into contact with each other, thereby closing the auxiliary-valve steam introduction holes.
    Type: Application
    Filed: December 5, 2022
    Publication date: June 15, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Osamu SHINDO, Miyako NIMORI, Shunichi HORII, Ryuhei TAKEMARU
  • Publication number: 20230093241
    Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.
    Type: Application
    Filed: March 4, 2021
    Publication date: March 23, 2023
    Applicant: TDK CORPORATION
    Inventors: Hiroshi KOIZUMI, Yasuo KATO, Makoto YAMASHITA, Mitsuyoshi MAKIDA, Ryo SHINDO, Osamu SHINDO, Hiroshi IIZUKA, Seijiro SUNAGA, Toshinobu MIYAGOSHI
  • Publication number: 20220316620
    Abstract: In a steam valve of an embodiment, a valve element of a comprises: a first valve element part positioned in the closing direction, and including a first valve element part outer peripheral surface configured to surround the valve rod; and a second valve element part positioned in the opening direction, and including a second valve element part outer peripheral surface configured to surround the valve rod. The first valve element part outer peripheral surface is a curved surface formed to have a diameter increased toward the opening direction. A diameter of boundary position between the first valve element part outer peripheral surface and the second valve element part outer peripheral surface is the same as a seat diameter of valve seat at which the valve element is brought into contact with the valve seat when the steam valve is set to a fully-closed state.
    Type: Application
    Filed: February 9, 2022
    Publication date: October 6, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Osamu SHINDO, Miyako NIMORI, Shunichi HORII, Ryuhei TAKEMARU
  • Patent number: 11359515
    Abstract: The steam valve driving apparatus according to an embodiment is a steam valve driving apparatus regulating open and close position of a valve body. The steam valve driving apparatus includes: a plurality of hydraulic cylinders that presses the valve body in an opening direction. Each of the hydraulic cylinders includes: a piston rod extending outward from a piston in the opening direction; and an open-side cylinder chamber arranged in the opposite side of the piston with respect to the piston and to which hydraulic oil is supplied. The hydraulic cylinder is disposed on a side opposite to the valve body with respect to a closing spring pressing the valve body in a closing direction.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: June 14, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Kazuhiro Yokoshima, Osamu Shindo
  • Patent number: 11167541
    Abstract: An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: November 9, 2021
    Assignee: TDK CORPORATION
    Inventors: Toshinobu Miyagoshi, Seijiro Sunaga, Osamu Shindo, Yasuo Kato
  • Patent number: 11101317
    Abstract: In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: August 24, 2021
    Assignee: TDK CORPORATION
    Inventors: Toshinobu Miyagoshi, Seijiro Sunaga, Osamu Shindo, Yasuo Kato
  • Publication number: 20200362729
    Abstract: The steam valve driving apparatus according to an embodiment is a steam valve driving apparatus regulating open and close position of a valve body. The steam valve driving apparatus includes: a plurality of hydraulic cylinders that presses the valve body in an opening direction. Each of the hydraulic cylinders includes: a piston rod extending outward from a piston in the opening direction; and an open-side cylinder chamber arranged in the opposite side of the piston with respect to the piston and to which hydraulic oil is supplied. The hydraulic cylinder is disposed on a side opposite to the valve body with respect to a closing spring pressing the valve body in a closing direction.
    Type: Application
    Filed: March 9, 2020
    Publication date: November 19, 2020
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Kazuhiro YOKOSHIMA, Osamu SHINDO
  • Publication number: 20200227468
    Abstract: In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.
    Type: Application
    Filed: December 13, 2019
    Publication date: July 16, 2020
    Applicant: TDK CORPORATION
    Inventors: Toshinobu MIYAGOSHI, Seijiro SUNAGA, Osamu SHINDO, Yasuo KATO
  • Publication number: 20200215809
    Abstract: An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.
    Type: Application
    Filed: December 13, 2019
    Publication date: July 9, 2020
    Applicant: TDK CORPORATION
    Inventors: Toshinobu MIYAGOSHI, Seijiro SUNAGA, Osamu SHINDO, Yasuo KATO
  • Patent number: 9980395
    Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: May 22, 2018
    Assignees: TDK Corporation, ROHM CO., LTD., SAE Magnetics (H.K.) Ltd.
    Inventors: Koji Shimazawa, Osamu Shindo, Yoshihiro Tsuchiya, Yasuhiro Ito, Kenji Sakai
  • Patent number: 9790805
    Abstract: In the embodiment, a steam valve device has, a steam regulating valve, and an intermediate flow path connecting the main steam stop valve and the steam regulating valve. The main steam stop valve and the steam regulating valve respectively have: casings where flow paths are formed between horizontal inlet ports and outlet ports opened downward and valve seats are arranged in the flow paths; valve elements movable up and down in the casings; and valve rods for driving the valve elements. The valve rods extend upward, and they are pulled off upward in a direction to outside of the casings when opening the flow paths. The intermediate flow path changes the flow direction of main steam flowing out of the outlet port of the main steam stop valve from downward direction to horizontal direction to guide the main steam toward the outlet ports of the steam regulating valves.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: October 17, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Ryuhei Takemaru, Osamu Shindo, Toshihiko Endo
  • Patent number: 9374936
    Abstract: A workpiece mounting apparatus includes a transfer apparatus having a nozzle, a first imaging unit, and an image processor. The nozzle has opposed first and second ends, a suction hole at the first end, and a transparent end face member sealing the second end. The first imaging unit captures a first pattern for positioning a workpiece. The image processor identifies a reference position of the workpiece based on the first pattern captured. The workpiece mounting apparatus also includes a substrate support supporting a substrate with a second pattern for positioning, a second imaging unit for capturing the second pattern, and a positioning unit for controlling position of the nozzle. The image processor identifies a mounting target position on the substrate, based on the second pattern capture, and the positioning unit controls the nozzle to mount the workpiece on the substrate, when the reference position coincides with the mounting target position.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: June 21, 2016
    Assignee: TDK CORPORATION
    Inventors: Toru Mizuno, Osamu Shindo, Hitoshi Nakayama
  • Patent number: 9353650
    Abstract: A steam turbine plant includes: a superheater; a reheater; a high-pressure turbine; an intermediate-pressure turbine; a low-pressure turbine; a condenser; a bypass pipe that branches off a main steam pipe and includes a high-pressure turbine bypass valve; a bypass pipe that branches off a high-temperature reheat steam pipe, is connected to the condenser, and includes a low-pressure turbine bypass valve; and a branch pipe that branches off a low-temperature reheat steam pipe, is connected to the condenser, and includes a ventilator valve. At the time of turbine start up, the ventilator valve, the high-pressure turbine bypass valve, and the low-pressure turbine bypass valve are fully opened to allow steam to be circulated simultaneously into the high-pressure turbine and the intermediate-pressure turbine.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: May 31, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventor: Osamu Shindo
  • Patent number: 9347336
    Abstract: According to one embodiment, there is provided a steam valve apparatus including a main throttle valve, a steam control valve arranged on a downstream side of the main throttle valve, and an intermediate flow-channel part which connects the main throttle valve and the steam control valve. The intermediate flow-channel part is a circular pipe flow channel forming a circular arcuate shape so as to change a flow of steam, which has flowed out of the main throttle valve, from a perpendicular direction into a direction of flowing out into the inlet part. An outlet part is open upward, and a valve rod penetrates a lower part of a casing downward.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: May 24, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Daisuke Ito, Tomoharu Tamaoki, Osamu Shindo
  • Patent number: 9283588
    Abstract: An application head includes a storage-side valve, a discharge-side valve and a plunger. The storage-side valve slides in a space in communication with an intermediate liquid passage between the storage-side valve and the discharge-side valve and changes the volume of liquid in the intermediate liquid passage. Each of the storage-side valve and the discharge-side valve has a column-shaped part, includes a through-hole penetrating between outer circumferential surfaces of the column-shaped part, and is rotatable at least within a predetermined angular range around a center axis of the column-shaped part. Each of the through-holes of the storage-side valve and the discharge-side valve communicates with liquid passages on both sides at a predetermined rotational position and does not communicate with the liquid passage on both sides at other rotational positions outside the angular range.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: March 15, 2016
    Assignee: TDK CORPORATION
    Inventors: Toru Mizuno, Osamu Shindo, Masaya Wada
  • Publication number: 20150040390
    Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.
    Type: Application
    Filed: September 22, 2014
    Publication date: February 12, 2015
    Inventors: Koji SHIMAZAWA, Osamu SHINDO, Yoshihiro TSUCHIYA, Yasuhiro ITO, Kenji SAKAI