Patents by Inventor Osamu Taguchi

Osamu Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11594363
    Abstract: Disclosed herein is a coil component that includes first and second substrates, a first coil pattern formed on one surface of the first substrate, a second coil pattern formed on one surface of the second substrate, a first terminal electrode connected to one end of the first coil pattern and protruding from the first substrate, and a second terminal electrode connected to one end of the second coil pattern and protruding from the second substrate. The first and second substrates are laminated such that the first and second terminal electrodes overlap each other and are connected to each other.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: February 28, 2023
    Assignee: TDK CORPORATION
    Inventors: Tomohiro Moriki, Takahiro Ohishi, Hirohumi Asou, Noritaka Chiyo, Toshio Tomonari, Junpei Hamaya, Shigeki Ohtsuka, Takaaki Imai, Takakazu Maruyama, Osamu Taguchi
  • Publication number: 20200381167
    Abstract: Disclosed herein is a coil component that includes first and second substrates, a first coil pattern formed on one surface of the first substrate, a second coil pattern formed on one surface of the second substrate, a first terminal electrode connected to one end of the first coil pattern and protruding from the first substrate, and a second terminal electrode connected to one end of the second coil pattern and protruding from the second substrate. The first and second substrates are laminated such that the first and second terminal electrodes overlap each other and are connected to each other.
    Type: Application
    Filed: April 27, 2020
    Publication date: December 3, 2020
    Applicant: TDK CORPORATION
    Inventors: Tomohiro MORIKI, Takahiro OHISHI, Hirohumi ASOU, Noritaka CHIYO, Toshio TOMONARI, Junpei HAMAYA, Shigeki OHTSUKA, Takaaki IMAI, Takakazu MARUYAMA, Osamu TAGUCHI
  • Patent number: 9894889
    Abstract: A transgenic non-human mammal has a genome that includes an early-immediate enhancer of human cytomegalovirus (CMV enhancer), a ?-actin promoter and the entire gene region of human matrix metalloproteinase 2 (hMMP2) disposed downstream of the promoter. The hMMP2 is systemically expressed in the transgenic non-human mammal, which thus provides a suitable animal model for studying chronic obstructive pulmonary disease and related diseases and conditions.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: February 20, 2018
    Assignee: MIE UNIVERSITY
    Inventors: Esteban C. Gabazza, Osamu Taguchi, Tetsu Kobayashi
  • Publication number: 20160374319
    Abstract: A transgenic non-human mammal has a genome that includes an early-immediate enhancer of human cytomegalovirus (CMV enhancer), a ?-actin promoter and the entire gene region of human matrix metalloproteinase 2 (hMMP2) disposed downstream of the promoter. The hMMP2 is systemically expressed in the transgenic non-human mammal, which thus provides a suitable animal model for studying chronic obstructive pulmonary disease and related diseases and conditions.
    Type: Application
    Filed: December 10, 2014
    Publication date: December 29, 2016
    Inventors: Esteban C. Gabazza, Osamu TAGUCHI, Tetsu KOBAYASHI
  • Patent number: 9464005
    Abstract: A dielectric ceramic composition is represented by a general formula “xBi2O3.yZnO.(z-a)Nb2O5.aV2O5”. The variables, “x”, “y”, “z” and “a” in the general formula respectively satisfy the following conditions: 2.90?x?3.10, 1.90?y?2.10, 1.90?z?2.10, and 0.0005?a?0.020.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: October 11, 2016
    Assignee: TDK CORPORATION
    Inventors: Tomohiro Arashi, Osamu Taguchi, Tomoaki Kawata
  • Patent number: 8997130
    Abstract: There is provided a disk cartridge including a case body in which a plurality of disk-shaped recording media are configured to be able to be received in an axial direction of a central shaft in parallel, and a first shell having a base surface section parallel to a recording surface of the disk-shaped recording medium and a second shell having a basal surface section parallel to the recording surface of the disk-shaped recording medium are coupled and separated through separation and connection in the axial direction, and a presser spring having a section to be attached, which is attached to the case body, and a pressing section configured to come in contact with an outer circumferential surface of the disk-shaped recording medium and to press the disk-shaped recording medium. The presser spring is formed of a resin material.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: March 31, 2015
    Assignee: Sony Corporation
    Inventors: Takaaki Sanpei, Osamu Taguchi, Shuichi Kikuchi, Kazumoto Yatabe, Takeshi Saito
  • Publication number: 20140302320
    Abstract: A dielectric ceramic composition is represented by a general formula “xBi2O3-yZnO-(z-a)Nb2O5-aV2O5”. In the general formula, values “x”, “y”, “z” and “a” respectively satisfy the following conditions: 2.90?x?3.10, 1.90?y?2.10, 1.90?z?2.10, and 0.0005?a?0.020.
    Type: Application
    Filed: April 1, 2014
    Publication date: October 9, 2014
    Applicant: TDK CORPORATION
    Inventors: Tomohiro ARASHI, Osamu TAGUCHI, Tomoaki KAWATA
  • Publication number: 20140133286
    Abstract: There is provided a disk cartridge including a case body in which a plurality of disk-shaped recording media are configured to be able to be received in an axial direction of a central shaft in parallel, and a first shell having a base surface section parallel to a recording surface of the disk-shaped recording medium and a second shell having a basal surface section parallel to the recording surface of the disk-shaped recording medium are coupled and separated through separation and connection in the axial direction, and a presser spring having a section to be attached, which is attached to the case body, and a pressing section configured to come in contact with an outer circumferential surface of the disk-shaped recording medium and to press the disk-shaped recording medium. The presser spring is formed of a resin material.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 15, 2014
    Applicant: SONY CORPORATION
    Inventors: Takaaki Sanpei, Osamu Taguchi, Shuichi Kikuchi, Kazumoto Yatabe, Takeshi Saito
  • Patent number: 8143992
    Abstract: A multilayer chip varistor is provided as one capable of suppressing production of cracks and thereby preventing a connection failure between an internal electrode and a through-hole conductor. An internal electrode 21 is so configured as to be curved toward a direction of penetration of a through hole 10 in a connection portion 28 thereof to a through-hole conductor 27. By this configuration, a region T sandwiched between a curved surface 28a of the connection portion 28 and the through-hole conductor 27 is formed in a varistor layer 9 near the connection portion 28. In this region T, a metal concentration thereof becomes higher because of diffusion of metal of the internal electrode 21 and the through-hole conductor 27 into the varistor layer 9, and therefore, after completion of firing, the region T has an intermediate contraction percentage between that of the internal electrode 21 and through-hole conductor 27 and that of the other region of the varistor layer 9.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: March 27, 2012
    Assignee: TDK Corporation
    Inventors: Hiroyuki Sato, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka
  • Patent number: 7994894
    Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.
    Type: Grant
    Filed: April 20, 2009
    Date of Patent: August 9, 2011
    Assignee: TDK Corporation
    Inventors: Hiroyuki Sato, Makoto Numata, Yo Saito, Hitoshi Tanaka, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka
  • Patent number: 7932807
    Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: April 26, 2011
    Assignee: TDK Corporation
    Inventors: Hiroyuki Sato, Makoto Numata, Yo Saito, Hitoshi Tanaka, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka
  • Patent number: 7911317
    Abstract: A multilayer chip varistor is provided as one having excellent heat radiation performance. A thickness between a first principal face 3 and an outermost internal electrode layer 11A is smaller than a thickness between an internal electrode layer 21 and the outermost internal electrode layer 11A, and because of this configuration, heat generated from a bottom face of a semiconductor light emitting device LE1 is efficiently transferred to the outermost internal electrode layer 11A having a high thermal conductivity. Furthermore, in the multilayer chip varistor V1 of an electronic component EC1, the outermost internal electrode layer 11A has a first internal electrode 13 electrically connected to a first connection electrode 7 and a first terminal electrode 5 through first through-hole conductors 17, and a second internal electrode 15 electrically connected to a second connection electrode 8 and a second terminal electrode 6 through second through-hole conductors 27.
    Type: Grant
    Filed: August 6, 2009
    Date of Patent: March 22, 2011
    Assignee: TDK Corporation
    Inventors: Ryuichi Tanaka, Goro Takeuchi, Hiroyuki Sato, Osamu Taguchi
  • Publication number: 20100117782
    Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.
    Type: Application
    Filed: April 20, 2009
    Publication date: May 13, 2010
    Applicant: TDK CORPORATION
    Inventors: Hiroyuki SATO, Makoto NUMATA, Yo SAITO, Hitoshi TANAKA, Goro TAKEUCHI, Osamu TAGUCHI, Ryuichi TANAKA
  • Publication number: 20100066479
    Abstract: A multilayer chip varistor is provided as one having excellent heat radiation performance. A thickness between a first principal face 3 and an outermost internal electrode layer 11A is smaller than a thickness between an internal electrode layer 21 and the outermost internal electrode layer 11A, and because of this configuration, heat generated from a bottom face of a semiconductor light emitting device LE1 is efficiently transferred to the outermost internal electrode layer 11A having a high thermal conductivity. Furthermore, in the multilayer chip varistor V1 of an electronic component EC1, the outermost internal electrode layer 11A has a first internal electrode 13 electrically connected to a first connection electrode 7 and a first terminal electrode 5 through first through-hole conductors 17, and a second internal electrode 15 electrically connected to a second connection electrode 8 and a second terminal electrode 6 through second through-hole conductors 27.
    Type: Application
    Filed: August 6, 2009
    Publication date: March 18, 2010
    Applicant: TDK CORPORATION
    Inventors: Ryuichi TANAKA, Goro TAKEUCHI, Hiroyuki SATO, Osamu TAGUCHI
  • Publication number: 20100052841
    Abstract: A multilayer chip varistor is provided as one capable of suppressing production of cracks and thereby preventing a connection failure between an internal electrode and a through-hole conductor. An internal electrode 21 is so configured as to be curved toward a direction of penetration of a through hole 10 in a connection portion 28 thereof to a through-hole conductor 27. By this configuration, a region T sandwiched between a curved surface 28a of the connection portion 28 and the through-hole conductor 27 is formed in a varistor layer 9 near the connection portion 28. In this region T, a metal concentration thereof becomes higher because of diffusion of metal of the internal electrode 21 and the through-hole conductor 27 into the varistor layer 9, and therefore, after completion of firing, the region T has an intermediate contraction percentage between that of the internal electrode 21 and through-hole conductor 27 and that of the other region of the varistor layer 9.
    Type: Application
    Filed: August 4, 2009
    Publication date: March 4, 2010
    Applicant: TDK CORPORATION
    Inventors: Hiroyuki SATO, Goro TAKEUCHI, Osamu TAGUCHI, Ryuichi TANAKA
  • Publication number: 20090243768
    Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.
    Type: Application
    Filed: March 3, 2009
    Publication date: October 1, 2009
    Applicant: TDK CORPORATION
    Inventors: Hiroyuki Sato, Makoto Numata, Yo Saito, Hitoshi Tanaka, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka
  • Publication number: 20060105995
    Abstract: The invention relates to TAFI inhibitors and their use to treat pulmonary fibrosis.
    Type: Application
    Filed: October 3, 2005
    Publication date: May 18, 2006
    Applicants: Schering Aktiengesellschaft, Mie University Graduate School of Medicine
    Inventors: Hajime Fujimoto, Esteban Gabazza, Michael Morser, Mariko Nagashima, Osamu Taguchi
  • Patent number: 6548187
    Abstract: A method for manufacturing a Sn-based alloy containing a finely dispersed Sn—Ti compound includes melting Sn by heating to a temperature in a range from 1300 to 1500° C. in vacuum or an inert gas atmosphere, adding 0.1 to 5% by weight of Ti followed by melting by heating, and casting the molten alloy into a copper mold directly or through a pouring cup. The Sn-based alloy obtained by this method contains the Sn—Ti compound having a maximum particle diameter of 30 &mgr;m and a mean particle diameter of 5 to 20 &mgr;m. A precursor of a Nb3Sn wire is also obtained by an inner diffusion method using this Sn-based alloy. The Nb3Sn wire manufactured by using the Sn-based alloy of the present invention exhibits excellent superconductive characteristics. The method of the present invention enables the ingot to be free from a shrinkage cavity appearing during prior art manufacturing processes.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: April 15, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takayuki Nagai, Yoshio Kubo, Kunihiko Egawa, Osamu Taguchi
  • Publication number: 20020153119
    Abstract: A method for manufacturing a Sn based alloy containing a finely dispersed Sn-Ti compound by the steps comprising melting Sn by heating at 1300 to 1500° C in vacuum or under an inert gas atmosphere, adding 0.1 to 5% by weight of Ti followed by melting by heating, and casting the molten alloy into a copper mold directly or through a pouring cup. The Sn based alloy obtained by this method contains the Sn-Ti compound having a maximum particle diameter of 30 &mgr;m and mean particle diameter of 5 to 20 &mgr;m. A precursor of a Nb3Sn wire is also obtained by an inner diffusion method using this Sn based alloy. The Nb3Sn wire manufactured by using the Sn based alloy of the present invention exhibits excellent superconductive characteristics. The method of the present invention enables the ingot to be free from a shrinkage cavity appearing during the manufacturing process.
    Type: Application
    Filed: October 24, 2001
    Publication date: October 24, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takayuki Nagai, Yoshio Kubo, Kunihiko Egawa, Osamu Taguchi
  • Patent number: 6181515
    Abstract: A recording/reproducing tape cassette attached with an improved lid is provided. The cassette comprises a cassette body accommodating therein a cassette tape a part of which is exposed outside and a rotatable lid mechanism for clamping the exposed part of the tape. The lid mechanism is provided with a rotary shaft including a guide portion eccentric therewith and a torsion coil spring fitted on the guide portion. When the rotary shaft rotates, the guide portion rotates eccentric therewith and the torsion coil spring moves in a direction in which it does not interfere with a tape end detecting optical path located near the rotary shaft so that the torque on the torsion coil spring can be increased to smoothly open and close the lid. Further, the rotary shaft may be provided with a rib so that a lid spring for constantly urging the lid toward a direction in which the lid is closed may engaged the rib without bending thereby reducing the space to be occupied by the spring.
    Type: Grant
    Filed: July 24, 1995
    Date of Patent: January 30, 2001
    Assignee: Sony Corporation
    Inventor: Osamu Taguchi