Abstract: A method of producing a glass article includes holding a carrier having a circular shape, in which a glass substrate having a circular shape is retained, with an upper surface plate and a lower surface plate; and polishing the glass substrate by rotating the carrier with respect to the upper surface plate and the lower surface plate, to obtain the glass article. The glass substrate is disposed in the carrier such that, in a top plan view, a center of the carrier is included in a region of the glass substrate, and a center of the glass substrate is shifted from the center of the carrier.

Abstract: An improved lead frame conveying apparatus for conveying a lead frame to a bonding position has two pins each with a tapered end which is provided for being inserted into a positioning hole in a lead frame. The tapered end has an upper portion the diameter of which is smaller than the diameter of the positioning hole in the lead frame and a lower portion the diameter of which is larger than the diameter of the positioning hole. The lead frame is supported by the tapered ends of the pins which engage the round edges of the positioning holes. The tapered pins are moved controllably in this state, thereby feeding the lead frame to the bonding position. Since the weight of lead frame tends to push the lead frame down on the pins, the centers of the positioining holes and the tapered pins become automatically aligned, bringing about correct aligning of the lead frame.

Abstract: There is provided a handling system for IC devices having a guide stage comprising a bank portion in which both sides of a IC device to be tested are held at a position other than a portion where terminals of the IC device project and a vacuum suction pore which suctorially sticks to the underside of the IC device at the midpoint of the bank portion.There is also provided a handling system for IC devices wherein multiple bank portions are provided on the stage, one half of which is used for carrying IC devices and the remaining half of which is used for discharging IC devices.

Abstract: An apparatus to mount wafers for sublimation plating on a rotary type wafer holding dome having more than one wafer mounting seat of window type on its circumference comprising a wafer cassette that holds many sheets of wafers piled up with spacing and holding pieces in-between and is driven up-and-down at the same intervals as wafer mounting, a rotary arm having a sucker on the top end with the said wafer mounting seats on its rotation locus, and a conveyor mechanism to receive a piece of wafer at the end of the wafer cassette and to transfer the wafer to a position on the other rotation locus at the top end of the said rotary arm.