Abstract: An RF circuit module includes a laminated dielectric substrate defining an RF circuit module and including an upper layer and a lower layer. An IC and an RF filter are disposed in the upper layer, and a power amplifier and an antenna switch are disposed in the lower layer. The antenna switch is disposed near an end surface of the laminated dielectric substrate, and the RF amplifier is disposed at a position at which it partially overlaps the antenna switch in a plan view. The IC and the power amplifier are also disposed at positions at which they partially overlap each other in a plan view.

Abstract: A PLL circuit includes a PLLic formed into an integrated circuit; a loop filter for receiving an output signal from the PLLic; a voltage-controlled oscillator having an oscillation frequency which is controlled according to an output signal of the loop filter for applying a controlled oscillation output signal to the PLLic, the voltage-controlled oscillator including a resonator and a negative resistor circuit; wherein a buffer amplifier functioning as a part of the voltage-controlled oscillator is incorporated into the PLLic, and the resonator and the negative resistor circuit of the voltage-controlled oscillator are disposed outside of the PLLic.