Patents by Inventor Osamu Usui

Osamu Usui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200343106
    Abstract: A semiconductor chip (2) includes a surface electrode (3). A conductive bonding member (8) includes first and second bonding members (8a,8b) provided on the surface electrode (3). A lead electrode (9) is bonded to a part of the surface electrode (3) via the first bonding member (8a) and has no contact with the second bonding member (8b). A signal wire (11) is bonded to the surface electrode (3). The second bonding member (8b) is arranged between the first bonding member (8a) and the signal wire (11). A thickness of the first bonding member (8a) is larger than a thickness of the second bonding member (8b).
    Type: Application
    Filed: September 4, 2017
    Publication date: October 29, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Osamu USUI
  • Patent number: 10809972
    Abstract: To enable listening to audio in a more suitable mode without any complicated operation even in a situation in which the user's state or situation successively changes. An information processing device including: a recognition processing unit that recognizes a user's state in accordance with a detection result of a predetermined state or situation; and an output control unit that controls audio output from a predetermined output unit on the basis of a function map, which is selected in accordance with a predetermined condition, in which a setting related to control of the audio output is associated with each of a plurality of candidates for the user's state, and the recognized user's state.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: October 20, 2020
    Assignee: Sony Corporation
    Inventors: Kenichi Oide, Takayuki Mizuuchi, Osamu Nishida, Hirohisa Shibuya, Taeko Usui, Taisuke Nakazono
  • Publication number: 20200295250
    Abstract: According to one embodiment, a sensor module includes at least one sensor and at least one switch. The sensor includes a first piezoelectric element. The first piezoelectric element includes a first electrode. The first piezoelectric element is set with a resonance frequency to resonate at a vibration frequency of a detection target. The switch includes a second piezoelectric element. The second piezoelectric element includes a second electrode connected to the first electrode and a third electrode electrically separated from the second electrode.
    Type: Application
    Filed: August 30, 2019
    Publication date: September 17, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yongfang LI, Takahiro Omori, Takashi Usui, Osamu Nishimura, Kazuo Watabe
  • Publication number: 20200292505
    Abstract: According to one embodiment, a sensor module includes a sensor and a diagnosis circuit. The sensor includes piezoelectric transducers and switches. The piezoelectric transducers have different resonance frequencies. The switches are provided to correspond to the piezoelectric transducers, respectively. Each of the switches outputs an output signal corresponding to a voltage generated by an inverse piezoelectric effect of a corresponding piezoelectric transducer of the piezoelectric transducers. The diagnosis circuit diagnoses, based on a difference in pattern of the output signal, whether vibration has newly occurred in the sensor, and switch an output destination of the output signal of the sensor according to a result of the diagnosis.
    Type: Application
    Filed: August 30, 2019
    Publication date: September 17, 2020
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yongfang Li, Takahiro Omori, Takashi Usui, Osamu Nishimura, Kazuo Watabe
  • Patent number: 10709143
    Abstract: A clamping device for a bone-in limb meat according to an embodiment includes a pair of clamp pieces including a first clamp piece and a second clamp piece, and being openable/closable so as to hold a bone-in limb meat, and rotation suppressing portions for suppressing a rotation of the bone-in limb meat, the rotation suppressing portions being disposed at positions deviated with respect to the pair of clamp pieces in a direction perpendicular to a plane including an opening/closing direction of the pair of clamp pieces. The rotation suppressing portions include a projection portion disposed so as to protrude from the first clamp piece into a space between the pair of clamp pieces and configured to contact the bone-in limb meat when viewed from the direction perpendicular to the plane.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: July 14, 2020
    Assignee: MAYEKAWA MFG. CO., LTD.
    Inventors: Takeshi Chimura, Hiroyuki Usui, Takekuni Umehara, Osamu Goto, Yuuichi Kuratani
  • Patent number: 10707141
    Abstract: First and second electrodes (12,13) are provided on an upper surface of the semiconductor chip (9) and spaced apart from each other. A wiring member (15) includes a first joint (15a) bonded to the first electrode (12) and a second joint (15b) bonded to the second electrode (13). Resin (2) seals the semiconductor chip (9), the first and second electrodes (12,13) and the wiring member (15). A hole (18) extending through the wiring member (15) up and down is provided between the first joint (15a) and the second joint (15b).
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: July 7, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naoki Yoshimatsu, Osamu Usui, Yuji Imoto
  • Patent number: 10681918
    Abstract: A loading system for bone-in limb meat according to an embodiment is a loading system for loading a bone-in limb meat to a processing portion, the loading system includes: an image capturing portion for capturing an image of the bone-in limb meat before being loaded to the processing portion; an image processing portion capable of acquiring orientation information of the bone-in thigh meat from the image of the bone-in limb meat captured by the image capturing portion; an openable/closable pair of clamp pieces for holding the bone-in limb meat; an arm supporting the pair of clamp pieces, and capable of controlling a position and orientation of the pair of clamp pieces; and a control portion controlling, based on the orientation information acquired by the image processing portion, an operation of the arm and thereby holding the bone-in limb meat, and loading the bone-in limb meat to the processing portion.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: June 16, 2020
    Assignee: MAYEKAWA MFG. CO., LTD.
    Inventors: Takeshi Chimura, Hiroyuki Usui, Takekuni Umehara, Osamu Goto, Hajime Akabane, Yuuichi Kuratani
  • Patent number: 10617125
    Abstract: A clamping device for a bone-in limb meat according to an embodiment includes a base portion, a pair of clamp pieces mounted to the base portion and configured to hold a bone-in limb meat, and an orientation adjusting member for adjusting an orientation of the bone-in limb meat, the orientation adjusting member being mounted to the base portion independently of the pair of clamp pieces and having an inclined surface inclined at an acute angle with respect to a center line between the pair of clamp pieces. When the pair of clamp pieces are in an opened state, in a planar view, at least a part of the inclined surface of the orientation adjusting member is disposed so as to overlap a space formed between the pair of clamp pieces.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: April 14, 2020
    Assignee: MAYEKAWA MFG. CO., LTD.
    Inventors: Takeshi Chimura, Hiroyuki Usui, Takekuni Umehara, Osamu Goto, Yuuichi Kuratani
  • Publication number: 20200098701
    Abstract: A semiconductor chip (6) is disposed on the insulation substrate (2). A lead frame (8) is bonded to an upper surface of the semiconductor chip (6). A sealing resin (12) covers the semiconductor chip (6), the insulation substrate (2), and the lead frame (8). A stress mitigation resin (13) having a lower elastic modulus than that of the sealing resin (12) is partially applied to an end of the lead frame (8).
    Type: Application
    Filed: February 9, 2017
    Publication date: March 26, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki HARADA, Naoki YOSHIMATSU, Osamu USUI, Yuji IMOTO, Yuki YOSHIOKA
  • Publication number: 20200068907
    Abstract: A loading system for bone-in limb meat according to an embodiment is a loading system for loading a bone-in limb meat to a processing portion, the loading system includes: an image capturing portion for capturing an image of the bone-in limb meat before being loaded to the processing portion; an image processing portion capable of acquiring orientation information of the bone-in thigh meat from the image of the bone-in limb meat captured by the image capturing portion; an openable/closable pair of clamp pieces for holding the bone-in limb meat; an arm supporting the pair of clamp pieces, and capable of controlling a position and orientation of the pair of clamp pieces; and a control portion controlling, based on the orientation information acquired by the image processing portion, an operation of the arm and thereby holding the bone-in limb meat, and loading the bone-in limb meat to the processing portion.
    Type: Application
    Filed: October 5, 2018
    Publication date: March 5, 2020
    Inventors: Takeshi CHIMURA, Hiroyuki USUI, Takekuni UMEHARA, Osamu GOTO, Hajime AKABANE, Yuuichi KURATANI
  • Publication number: 20200060297
    Abstract: A clamping device for a bone-in limb meat according to an embodiment includes a pair of clamp pieces including a first clamp piece and a second clamp piece, and being openable/closable so as to hold a bone-in limb meat, and rotation suppressing portions for suppressing a rotation of the bone-in limb meat, the rotation suppressing portions being disposed at positions deviated with respect to the pair of clamp pieces in a direction perpendicular to a plane including an opening/closing direction of the pair of clamp pieces. The rotation suppressing portions include a projection portion disposed so as to protrude from the first clamp piece into a space between the pair of clamp pieces and configured to contact the bone-in limb meat when viewed from the direction perpendicular to the plane.
    Type: Application
    Filed: October 5, 2018
    Publication date: February 27, 2020
    Inventors: Takeshi CHIMURA, Hiroyuki USUI, Takekuni UMEHARA, Osamu GOTO, Yuuichi KURATANI
  • Patent number: 10563612
    Abstract: Provided is a control device for an internal combustion engine capable of avoiding deterioration of combustion and reliably suppressing synthetic noise of a high pressure fuel pump and a fuel injection valve without affecting an operating state of the internal combustion engine. Therefore, when it is determined that there is synthetic noise of a high pressure fuel pump and a fuel injection valve, an operating angle of a variable valve mechanism provided in the internal combustion engine is made variable while satisfying a fuel injection request of the fuel injection valve.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: February 18, 2020
    Assignee: Hitachi Automotive Systems, Inc.
    Inventors: Osamu Mukaihara, Satoshi Usui, Masahiro Toyohara
  • Publication number: 20190373904
    Abstract: A clamping device for a bone-in limb meat according to an embodiment includes a base portion, a pair of clamp pieces mounted to the base portion and configured to hold a bone-in limb meat, and an orientation adjusting member for adjusting an orientation of the bone-in limb meat, the orientation adjusting member being mounted to the base portion independently of the pair of clamp pieces and having an inclined surface inclined at an acute angle with respect to a center line between the pair of clamp pieces. When the pair of clamp pieces are in an opened state, in a planar view, at least a part of the inclined surface of the orientation adjusting member is disposed so as to overlap a space formed between the pair of clamp pieces.
    Type: Application
    Filed: October 5, 2018
    Publication date: December 12, 2019
    Inventors: Takeshi CHIMURA, Hiroyuki USUI, Takekuni UMEHARA, Osamu GOTO, Yuuichi KURATANI
  • Patent number: 10504820
    Abstract: A plurality of semiconductor devices (4a-4f, 5a-5f) are provided on an upper surface of the conductive base plate (1) via an insulating substrate (2) and a conductive pattern (3a-3d). A plurality of fins (6) are provided on a lower surface of the conductive base plate (1). A heat dissipating base plate (7) is provided to tips of the plurality of fins (6). A cooler (8) having an inflow port (9a) and an outflow port (9b) in a bottom surface surrounds the plurality of fins (6) and the heat dissipating base plate (7). A partition (10) separates a space surrounded by the cooler (8) and the heat dissipating base plate (7) into an inflow-side space (11a) connected to the inflow port (9a) and an outflow-side space (11b) connected to the outflow port (9b). A first slit (12a) is provided in a central portion of the heat dissipating base plate (7). Second and third slits (12b,12c) are respectively provided on both sides of the heat dissipating base plate (7) along a direction from an inflow side to an outflow side.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: December 10, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tatsuya Kawase, Yosuke Nakata, Yuji Imoto, Osamu Usui
  • Publication number: 20190361666
    Abstract: To enable listening to audio in a more suitable mode without any complicated operation even in a situation in which the user's state or situation successively changes. An information processing device including; a recognition processing unit that recognizes a user's state in accordance with a detection result of a predetermined state or situation; and an output control unit that controls audio output from a predetermined output unit on the basis of a function map, which is selected in accordance with a predetermined condition, in which a setting related to control of the audio output is associated with each of a plurality of candidates for the user's state, and the recognized user's state.
    Type: Application
    Filed: August 9, 2017
    Publication date: November 28, 2019
    Applicant: SONY CORPORATION
    Inventors: Kenichi OIDE, Takayuki MIZUUCHI, Osamu NISHIDA, Hirohisa SHIBUYA, Taeko USUI, Taisuke NAKAZONO
  • Publication number: 20190295924
    Abstract: A plurality of semiconductor devices (4a-4f, 5a-5f) are provided on an upper surface of the conductive base plate (1) via an insulating substrate (2) and a conductive pattern (3a-3d). A plurality of fins (6) are provided on a lower surface of the conductive base plate (1). A heat dissipating base plate (7) is provided to tips of the plurality of fins (6). A cooler (8) having an inflow port (9a) and an outflow port (9b) in a bottom surface surrounds the plurality of fins (6) and the heat dissipating base plate (7). A partition (10) separates a space surrounded by the cooler (8) and the heat dissipating base plate (7) into an inflow-side space (11a) connected to the inflow port (9a) and an outflow-side space (11b) connected to the outflow port (9b). A first slit (12a) is provided in a central portion of the heat dissipating base plate (7). Second and third slits (12b,12c) are respectively provided on both sides of the heat dissipating base plate (7) along a direction from an inflow side to an outflow side.
    Type: Application
    Filed: October 21, 2016
    Publication date: September 26, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tatsuya KAWASE, Yosuke NAKATA, Yuji IMOTO, Osamu USUI
  • Publication number: 20190267297
    Abstract: First and second electrodes (12,13) are provided on an upper surface of the semiconductor chip (9) and spaced apart from each other. A wiring member (15) includes a first joint (15a) bonded to the first electrode (12) and a second joint (15b) bonded to the second electrode (13). Resin (2) seals the semiconductor chip (9), the first and second electrodes (12,13) and the wiring member (15). A hole (18) extending through the wiring member (15) up and down is provided between the first joint (15a) and the second joint (15b).
    Type: Application
    Filed: October 24, 2016
    Publication date: August 29, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Naoki YOSHIMATSU, Osamu USUI, Yuji IMOTO
  • Publication number: 20190153974
    Abstract: Provided is a control device for an internal combustion engine capable of avoiding deterioration of combustion and reliably suppressing synthetic noise of a high pressure fuel pump and a fuel injection valve without affecting an operating state of the internal combustion engine. Therefore, when it is determined that there is synthetic noise of a high pressure fuel pump and a fuel injection valve, an operating angle of a variable valve mechanism provided in the internal combustion engine is made variable while satisfying a fuel injection request of the fuel injection valve.
    Type: Application
    Filed: March 22, 2017
    Publication date: May 23, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Osamu MUKAIHARA, Satoshi USUI, Masahiro TOYOHARA
  • Patent number: 9171773
    Abstract: A semiconductor device according to the present invention includes a base plate, an insulating layer provided on an upper surface of the base plate, a metal pattern provided on an upper surface of the insulating layer, a semiconductor element bonded to the metal pattern, and an insulating substrate disposed to be in contact with an upper surface of the semiconductor element. An end of the insulating substrate is located outside the semiconductor element in plan view. The end of the insulating substrate and the metal pattern are directly or indirectly bonded. The semiconductor element includes an electrode on the upper surface. A portion of the insulating substrate, in which the electrode on the upper surface of the semiconductor element overlaps in plan view, is provided with a through-hole.
    Type: Grant
    Filed: April 4, 2014
    Date of Patent: October 27, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kiyoshi Arai, Osamu Usui
  • Patent number: 9116532
    Abstract: A power semiconductor device module includes a plurality of inverters, each having a first transistor and a second transistor that are interposed in series between a first potential and a second potential and that operate complementarily. The plurality of inverters are assembled into a module. Only one predetermined inverter of the plurality of inverters is configured to detect temperatures of the first and second transistors, and control terminals for detection of the temperatures of the first and second transistors protrude from sides of the module.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 25, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventor: Osamu Usui