Patents by Inventor Osamu Watanabe

Osamu Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11448292
    Abstract: To provide a tensioner that can keep the oil pressure in an oil pressure chamber stable and consistently generate suitable reaction force and damping force to impact loads to reduce looseness in the chain and noise. A piston is set such as to partition an inner space of a plunger into an adjustment space on the front side and the oil pressure chamber on the rear side, a piston restricting member restricting the movement of the piston toward the adjustment space. An oil relief mechanism is configured to cause the piston to move forward when oil pressure in the oil pressure chamber rises so as to discharge oil inside the oil pressure chamber to the outside. The piston restricting member has an orifice function that can control the amount of discharged oil.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: September 20, 2022
    Assignee: TSUBAKIMOTO CHAIN CO.
    Inventors: Yuichiro Ishikawa, Osamu Yoshida, Yuji Kurematsu, Masanori Watanabe
  • Publication number: 20220291512
    Abstract: A head-mounted display comprises: a wearing body; a display; a communication module configured to perform communication connection with a mobile information terminal; a field of view (FOV) sensor configured to output status data used for determining whether the mobile information terminal is included in a user's FOV through the wearing body; and a controller connected to each of the display, the communication module, and the FOV detection sensor. The controller determines whether the mobile information terminal is included in the user's FOV based on the status data, and performs display control with respect to the display so as to display an application screen of the mobile information terminal on the display when determining that the mobile information terminal is not included in the FOV, and not to display the application screen on the display when determining that the mobile information terminal is included in the FOV.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 15, 2022
    Inventors: Mitsunobu WATANABE, Yasunobu HASHIMOTO, Osamu KAWAMAE, Nobuo MASUOKA, Kazuhiko YOSHIZAWA, Hiroshi SHIMIZU
  • Publication number: 20220235588
    Abstract: A door latch device includes: a first position switch and a second position switch, each including a first contact hole, a second contact hole, and a common contact hole; a common pin configured to be electrically conducted to the common contact hole of the first position switch and the first contact hole of the second position switch by being inserted therein; a first signal pin configured to be electrically conducted to the first contact hole of the first position switch by being inserted therein; and a second signal pin configured to be electrically conducted to the common contact of the second position switch by being inserted therein, wherein the first position switch and the second position switch are configured to perform a switch operation at a same timing of an operation of a predetermined operation detection target.
    Type: Application
    Filed: October 25, 2019
    Publication date: July 28, 2022
    Inventors: Osamu KAWANOBE, Shintaro OKAWA, Yasuyuki WATANABE
  • Patent number: 11387211
    Abstract: A bonding apparatus bonds a semiconductor die, which has a first mam surface provided with a bump electrode, to a substrate by means of thermo-compression, with a thermo-compression film being interposed therebetween. The bonding apparatus includes: an intermediate stage that has a die placing surface on which the semiconductor die is placed such that the die placing surface faces the first main surface; and a bonding tool which detachably holds a second main surface of the semiconductor die that is placed on the intermediate stage, the second main surface being on the reverse side of the first main surface. The intermediate stage has a push-up mechanism which applies, to the first main surface of the semiconductor die, a force for separating the semiconductor die therefrom in the normal direction of the die placing surface (in a Z-axis direction).
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: July 12, 2022
    Assignee: SHINKAWA LTD.
    Inventors: Tetsuya Otani, Osamu Watanabe, Tomonori Nakamura
  • Patent number: 11378805
    Abstract: A head-mounted display comprises: a wearing body; a display; a communication module configured to perform communication connection with a mobile information terminal; a field of view (FOV) sensor configured to output status data used for determining whether the mobile information terminal is included in a user's FOV through the wearing body; and a controller connected to each of the display, the communication module, and the FOV detection sensor. The controller determines whether the mobile information terminal is included in the user's FOV based on the status data, and performs display control with respect to the display so as to display an application screen of the mobile information terminal on the display when determining that the mobile information terminal is not included in the FOV, and not to display the application screen on the display when determining that the mobile information terminal is included in the FOV.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: July 5, 2022
    Assignee: MAXELL, LTD.
    Inventors: Mitsunobu Watanabe, Yasunobu Hashimoto, Osamu Kawamae, Nobuo Masuoka, Kazuhiko Yoshizawa, Hiroshi Shimizu
  • Publication number: 20220196210
    Abstract: Provided are a method for filling hydrogen gas into banks, configured so as to typically maintain high-pressure banks, thereby reducing time delays for supplying hydrogen gas to a second and subsequent FCV; and a hydrogen station. The hydrogen gas filling method and the hydrogen station are characterized by: filling hydrogen gas from a compressor into a bank (target bank) of which pressure is below the preset predetermined pressure; and if there are a plurality of other target banks, selecting as the filling bank a bank that may reach the filled state the fastest by being filled with hydrogen gas from the compressor.
    Type: Application
    Filed: March 26, 2020
    Publication date: June 23, 2022
    Inventor: Osamu WATANABE
  • Patent number: 11357970
    Abstract: The present invention provides a biomedical electrode composition capable of forming a living body contact layer for a biomedical electrode that is excellent in conductivity and biocompatibility, is light-weight, can be manufactured at low cost, and can control significant reduction in conductivity even though the biomedical electrode is soaked in water or dried. The present invention was accomplished by a biomedical electrode composition including a polymer compound having both the ionic repeating unit “a” and the repeating unit “b” of (meth)acrylate, in which the ionic repeating unit “a” is a repeating unit of sodium salt, potassium salt, or ammonium salt including a partial structure represented by the following general formula (1), and the repeating unit “b” of (meth)acrylate is a repeating unit represented by the following general formula (2).
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: June 14, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Takayuki Fujiwara, Osamu Watanabe, Motoaki Iwabuchi
  • Publication number: 20220157484
    Abstract: A polyurethane contains a weakly acidic functional group having a pKa of 5 to 11. Thus, the present invention provides: a conductive paste composition for forming a stretchable conductive wire which varies slightly in electric conductivity at the time of elongation and shrinkage; and a polyurethane for providing the composition.
    Type: Application
    Filed: November 3, 2021
    Publication date: May 19, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shiori NONAKA, Koji HASEGAWA, Osamu WATANABE, Jun HATAKEYAMA
  • Publication number: 20220133201
    Abstract: A bio-electrode composition contains (A) an ionic polymer material, (B) an addition reaction-curable silicone having at least a hydrosilyl group, (C) a platinum-group catalyst, and a solvent. The bio-electrode composition has a water content of 0.2 mass % or less. The solvent includes one or more of an ether solvent, an ester solvent, and a ketone solvent each of which does not contain a hydroxy group, a carboxyl group, a nitrogen atom, or a thiol group. Thus, present invention provides: a bio-electrode composition capable of forming a living body contact layer for a bio-electrode which is excellent in electric conductivity and biocompatibility, light-weight, and manufacturable at low cost, and which does not leave residue on skin after attachment to and peeling from the skin; a bio-electrode including a living body contact layer formed of the bio-electrode composition; and a method for manufacturing the bio-electrode.
    Type: Application
    Filed: November 1, 2021
    Publication date: May 5, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun HATAKEYAMA, Osamu WATANABE, Joe IKEDA, Shiori NONAKA, Koji HASEGAWA, Motoaki IWABUCHI, Yasuyoshi KURODA
  • Publication number: 20220091303
    Abstract: To provide an antireflection member which not only has a low reflectance, but also is enhanced in scratch resistance, and an image display device comprising the antireflection member. An antireflection member 100 comprising a low refractive index layer 130 on a transparent substrate 110, in which the low refractive index layer 130 includes a binder resin and silica particles 132 and 134, a ratio of Si element attributed to the silica particles, obtained by analysis of a surface region of the low refractive index layer 130 by X-ray photoelectron spectroscopy, is 10.0 atomic percent or more and 18.0 atomic percent or less and a ratio of C element under the assumption that the ratio of Si element is defined to be 100 atomic percent is 180 atomic percent or more and 500 atomic percent or less.
    Type: Application
    Filed: January 10, 2020
    Publication date: March 24, 2022
    Inventors: Tatsuya KOZAKAI, Tomoyuki HORIO, Michiaki TAKEI, Osamu WATANABE, Keisuke ENDOU, Takanobu TADAKI, Kio MIZUNO, Atsushi WASHIO, Keita IWAHARA, Sho SUZUKI
  • Publication number: 20220055562
    Abstract: A bumper device includes a bumper reinforcement, a crush box, and a lashing nut. The bumper reinforcement has a plate portion constituting an outer-side surface of the bumper reinforcement. The crush box includes a cylindrical portion that is disposed at a position closer to a cabin than the plate portion, and that is fixed to the plate portion in an orientation in which an axial direction of the cylindrical portion extends in a front-rear direction of a vehicle. The lashing nut is disposed within the cylindrical portion in an orientation in which an axial direction of the lashing nut extends in the front-rear direction of the vehicle. The lashing nut is connected to the plate portion. The lashing nut is unconstrained with respect to an inner face of the cylindrical portion.
    Type: Application
    Filed: July 1, 2021
    Publication date: February 24, 2022
    Applicants: Toyota Jidosha Kabushiki Kaisha, Subaru Corporation
    Inventors: Osamu Watanabe, Osamu Shimasaki, Shinji Nakano
  • Publication number: 20220043351
    Abstract: The present invention is a positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that enable formation of a fine pattern and high resolution, have excellent mechanical characteristics even when cured at low temperatures, and have no degradation in adhesive force between before and after a high temperature and high humidity test.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 10, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masashi IIO, Hiroyuki URANO, Osamu WATANABE, Katsuya TAKEMURA
  • Publication number: 20220043348
    Abstract: The present invention is a negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that enables formation of a fine pattern with high rectangularity and high resolution, has excellent mechanical characteristics even when cured at low temperatures, and furthermore, has no degradation in adhesive force between before and after a high temperature and high humidity test.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 10, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masashi IIO, Hiroyuki URANO, Osamu WATANABE, Katsuya TAKEMURA
  • Patent number: 11201132
    Abstract: Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: December 14, 2021
    Assignee: SHINKAWA LTD.
    Inventors: Tomonori Nakamura, Toru Maeda, Satoru Nagai, Yoshihiro Saeki, Osamu Watanabe
  • Publication number: 20210371663
    Abstract: A bio-electrode composition contains (A) an ionic polymer material. The component (A) is a polymer compound containing: a repeating unit-a having a structure selected from the group consisting of salts of ammonium, sodium, potassium, and silver formed with any of fluorosulfonic acid, fluorosulfonimide, and N-carbonyl-fluorosulfonamide; and a repeating unit-b having a side chain with a radical-polymerizable double bond in a structure selected from the group consisting of (meth)acrylate, vinyl ether, and styrene. Thus, the present invention provides: a bio-electrode composition capable of forming a living body contact layer for a bio-electrode to enable signal collection immediately after attachment to skin and prevention of residue on the skin after peeling from the skin; a bio-electrode including a living body contact layer formed of the bio-electrode composition; and a method for manufacturing the bio-electrode.
    Type: Application
    Filed: March 8, 2021
    Publication date: December 2, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun HATAKEYAMA, Motoaki IWABUCHI, Osamu WATANABE, Joe IKEDA, Koji HASEGAWA
  • Publication number: 20210376675
    Abstract: This canned motor (10) is provided with a rotor (14); a cylindrical rotor can (42) that houses the rotor (14); an end plate (40) that covers an opening of the rotor can (42) in the axial direction and is joined to the rotor can (42); a rotating shaft (16) that passes through the rotor (14) and the end plate (40); and an annular wall (46) that surrounds the outer circumference of the rotating shaft (16), is joined to or integrated with the end plate (40), and is joined to the entire circumference of the rotating shaft (16) at an end thereof in the axial direction. The thickness of the end plate (40) is larger than the thickness of the annular wall (46).
    Type: Application
    Filed: July 18, 2019
    Publication date: December 2, 2021
    Applicant: NIKKISO CO., LTD.
    Inventors: Kazuo FUTATSUGI, Osamu WATANABE, Yasushi KUBOTA, Yu KODAMA, Masaaki EGUCHI
  • Patent number: 11189594
    Abstract: A bonding apparatus and a bonding method are provided. The bonding apparatus bonds a semiconductor die to a substrate by thermocompression through an adhesive material. This bonding apparatus is provided with: a bonding tool which has a bonding surface that holds the semiconductor die through a first portion of a tape, and a pair of first tape constraining surfaces that are arranged so as to sandwich the bonding surface and constrain a second portion of the tape: tape constraining mechanisms which have a second tape constraining surface that presses the tape against the first tape constraining surfaces; and a control part which controls the movements of the bonding tool and the tape constraining mechanisms.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: November 30, 2021
    Assignee: SHINKAWA LTD.
    Inventors: Osamu Watanabe, Yoshihito Hagiwara, Tomonori Nakamura
  • Patent number: 11135422
    Abstract: The present invention provides a bio-electrode that is excellent in conductivity and biocompatibility, is light-weight, can be manufactured at low cost, and can control significant reduction in conductivity even though the bio-electrode is soaked in water or dried. The present invention is accomplished by providing a conductive substrate and a living body contact layer formed on the conductive substrate, where the living body contact layer is a cured product of a bio-electrode composition including an (A) ionic material and a (B) resin other than the component (A), in which the component (A) has both a repeating unit “a” of a lithium salt, a sodium salt, a potassium salt, or an ammonium salt of sulfonamide including a partial structure represented by the following general formula (1) and a repeating unit “b” having a silicon atom, —R1—C(?O)—N?—SO2—Rf1M+(1).
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: October 5, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Motoaki Iwabuchi, Osamu Watanabe, Takayuki Fujiwara, Yasuyoshi Kuroda
  • Patent number: 11071485
    Abstract: The present invention provides a bio-electrode composition including a polymer compound having both an ionic repeating unit A and a (meth)acrylate repeating unit B, wherein the ionic repeating unit A is a repeating unit selected from the group consisting of sodium salt, potassium salt, and ammonium salt having either or both partial structures shown by the following general formulae (1-1) and (1-2), and the (meth)acrylate repeating unit B is a repeating unit shown by the following general formula (2). This can form a living body contact layer for a bio-electrode with excellent electric conductivity, biocompatibility, and light weight, which can be manufactured at low cost and does not cause large lowering of the electric conductivity even when it is wetted with water or dried.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 27, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Koji Hasegawa, Osamu Watanabe, Motoaki Iwabuchi
  • Patent number: 11069651
    Abstract: A method of mounting a die includes: preparing a die having a bump formation surface on which a plurality of bump electrodes are formed; disposing a vacuum suction tool having a suction surface above the die such that the suction surface faces toward the bump formation surface; sandwiching a porous sheet between the suction surface and the bump formation surface and suctioning the die by the vacuum suction tool; and mounting the die that has been suctioned by the vacuum suction tool in a bonding region of a substrate with an adhesive material interposed therebetween, the porous sheet having a thickness equal to or greater than the protrusion height of the bump electrodes on the bump formation surface. Stabilization and ease of maintenance of vacuum suction can thereby be improved.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: July 20, 2021
    Assignees: SHINKAWA LTD., VALQUA, LTD.
    Inventors: Osamu Watanabe, Tomonori Nakamura, Yoshihito Hagiwara, Yuji Kanai